Untitled
Abstract: No abstract text available
Text: Honeywell HC6364 Military Products 8K x 8 RADIATION-HARDENED STATIC RAM FEATURES RADIATION OTHER • Fabricated with RICMOS Epitaxial 1.2 urn Process • Total Dose Hardness through 1x106 rad S i02 • Neutron Hardness through 1x1014cm '2 • Access Time of 25 nsec (typical)
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HC6364
1x106
1x1014cm
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Untitled
Abstract: No abstract text available
Text: 4551072 b3E D Honeywell ODQIQIM bS^ • H 0 N 3 HONEYldELL/S S E C Advance Information 256K X 16 RADIATION-TOLERANT SRAM HC81640 FEATURES RADIATION OTHER • Total Dose Hardness at Tactical Level • Detects and Corrects All Single and Double Bit Errors Automatically
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HC81640
1x101
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Untitled
Abstract: No abstract text available
Text: • ft fit * y w n Military Products 32K x 8 RADIATION-HARDENED STATIC RAM HC685 : FEATURES RADIATION OTHER • Fabricated with RICMOS IV Bulk 0.8 pm Process • Total Dose Hardness through 1x106 rad S i0 2 • Listed on SM D #5962-921 3 Available as
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1x106
1x1014cm
HC685
IL-l-38535
1x109
1x101
36-Lead
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Untitled
Abstract: No abstract text available
Text: Honeywell Military & Space Products 32K x 8 STATIC RAM—SOI HX6256 FEATURES RADIATION OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.75 urn Process (Leff= 0.6 )im) • Read/Write Cycle Times < 17 ns (Typical) <25 ns (-55 to 125°C) • Total Dose Hardness through 1x106rad(Si02)
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HX6256
1x106rad
1x1014cm
1x109
1x101
28-Lead
4551A72
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Untitled
Abstract: No abstract text available
Text: Honeywell Military Products Advance Information 128K x 8 RADIATION-HARDENED STATIC RAM-SOI HX6228 FEATURES OTHER RADIATION • Fabricated with RICMOS IV-E Silicon on Insulator SOI 0.7 |xm Process • Read/Write Cycle Times <25 ns (-55 to 125°C) • Total Dose Hardness through 1x106 rad(Si02)
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HX6228
1x106
1x1014cm
1x109rad
1x101
32-Lead
1x106rad
2x105
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Untitled
Abstract: No abstract text available
Text: Honeywell Military & Space Products FIFO—SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 jam Process (Leff = 0.65|im) OTHER • Read/Write Cycle Times <35 ns (-55° to 125°C)
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HX6409
HX6218
HX6136
1x106rad
1x101
1x109
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Untitled
Abstract: No abstract text available
Text: Aerospace Electronics FIFO— SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 |a,m Process (Leff = 0.65|a,m) • Read/Write Cycle Times <35 ns (-55° to 125°C)
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HX6409
HX6218
HX6136
1x106rad
1x101
1x109
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KD 2.d smd transistor
Abstract: No abstract text available
Text: Honeywell Military Products 32K x 8 RADIATION-HARDENED STATIC RAM HC6856 FEATURES RADIATION OTHER • Fabricated with RICMOS IV Bulk 0.8 |um Process • Total Dose Hardness through 1x106 rad S i02 • Listed on SMD #5962-92153. Available as MIL-l-38535 QML Class Q and Class V
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1x106
1x1014cm
1x109
1x101
HC6856
MIL-l-38535
36-Lead
KD 2.d smd transistor
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1A15
Abstract: honeywell hr 20 HLX6408
Text: Honeywell Advance Information 512K x 8 STATIC RAM—SOI HLX6408 FEATURES RADIATION OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.5 |im Process (LeH= 0.4 |im) • Read/Write Cycle Times < 20 ns (Typical) ¿25 ns (-55 to 125°C) • Total Dose Hardness through 5x105rad(Si02)
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5x105rad
1x101
HLX6408
1x109
40-Lead
1A15
honeywell hr 20
HLX6408
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Untitled
Abstract: No abstract text available
Text: Honeywell Military & Space Products Preliminary FIFO—SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 n.m Process (Lelf = 0.65}im) • Read/Write Cycle Times
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HX6409
HX6218
HX6136
1x10U
1x109
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Untitled
Abstract: No abstract text available
Text: Honeywell HC6856 Military Products Preliminary 256K-BIT RADIATION-HARDENED STATIC RAM FEATURES OTHER RADIATION • Fabricated with RICMOS Bulk 0.8 im Process • Total Dose Hardness through 1x106 rad(Si02 • Optional Architecture - 32K x 8 - 256Kx 1
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HC6856
256K-BIT
1x106
256Kx
1x1014cm
1x109
1x101
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Untitled
Abstract: No abstract text available
Text: Honeywell Military & Space Products FIFO— SOI HX6409 HX6218 HX6136 FEATURES • • 1 K x 36, 2 K x 18, 4 K x 9 O rganizations Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 j^m Process (Leff = 0.65|am) OTHER • R ead/W rite Cycle Tim es <35 ns (-55° to 125°C)
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1x10srad
1x1014
1x109
1x1011
1x1010
HX6409
HX6218
HX6136
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harris 6616
Abstract: No abstract text available
Text: Honeywell HC6616 Military Products Preliminary 2K x 8 RADIATION-HARDENED ROM FEATURES O TH ER R AD IATIO N • Typical 55 ns A ccess Tim e • Fabricated w ith RICMOS Epitaxial 1.2 |im Process • Low O perating Pow er • S ynchronous O peration • Total Dose H ardness through
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HC6616
1x106
1x1014cm
1x109
harris 6616
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