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    STMICROELECTRONICS MARKING CODE DATE BGA Search Results

    STMICROELECTRONICS MARKING CODE DATE BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TC4511BP Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, BCD-to-7-Segment Decoder, DIP16 Visit Toshiba Electronic Devices & Storage Corporation
    5446/BEA Rochester Electronics LLC 5446 - Decoder, BCD-To-7-Segment, With Open-Collector Outputs - Dual marked (M38510/01006BEA) Visit Rochester Electronics LLC Buy
    54LS190/BEA Rochester Electronics LLC 54LS190 - BCD Counter, 4-Bit Synchronous Up/Down, With Mode Control - Dual marked (M38510/31513BEA) Visit Rochester Electronics LLC Buy
    5447/BEA Rochester Electronics LLC 5447 - Decoder, BCD-To-7-Segment, With Open-Collector Outputs - Dual marked (M38510/01007BEA) Visit Rochester Electronics LLC Buy
    5962-8950303GC Rochester Electronics LLC ICM7555M - Dual Marked (ICM7555MTV/883) Visit Rochester Electronics LLC Buy

    STMICROELECTRONICS MARKING CODE DATE BGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    STMicroelectronics smd marking code

    Abstract: smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MLD-MIC/05/943 Notification Date 02/23/2005 CONVERSION TO PB-FREE PRODUCTION MIC - MICROCONTROLLERS 1/4 PCN MLD-MIC/05/943 - Notification Date 02/23/2005 Table 1. Change Identification Product Identification Product Family/Commercial Product


    Original     		MLD-MIC/05/943 MLD-MIC/05/943 STMicroelectronics smd marking code smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK PDF

    STMicroelectronics marking code date

    Abstract: BGA288, 19X19 LOT code stmicroelectronics Date Code Marking STMicroelectronics BGA288 Qualification STMicroelectronics date CODE ST BGA STMicroelectronics lot number STMicroelectronics code date marking
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN CMG-IMG/04/457 INTRODUCTION OF KINSUS SUBSTRATE LEAD FREE PACKAGE FOR ST20DC2 2004/02/26 PCN CMG-IMG/04/457 Product Family /Commercial Product ST20DC2 Type Of Change Package assembly material change Reason For Change


    Original     		CMG-IMG/04/457 ST20DC2 ST20DC2. BGA288 19x19 25-Jun-2004 19-Apr-2004 18-Jun-2004 STMicroelectronics marking code date BGA288, 19X19 LOT code stmicroelectronics Date Code Marking STMicroelectronics Qualification STMicroelectronics date CODE ST BGA STMicroelectronics lot number STMicroelectronics code date marking PDF

    STMicroelectronics smd marking code

    Abstract: BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN CRP/04/744 LEAD-FREE CONVERSION PROGRAM Compliance with RoHS 1 1 RoHS = Restriction of the use of certain Hazardous Substances European directive 2002/95/EC November 18, 2004 Page 1/12 2004 STMicroelectronics - All Rights Reserved


    Original     		CRP/04/744 2002/95/EC) STMicroelectronics smd marking code BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking PDF

    EIA standards 783

    Abstract: smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code
    Text: AN1235 Application note IPAD 500 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip Chips. For information on 400 µm Flip Chips, see Application note AN2348.


    Original     		AN1235 AN2348. EIA standards 783 smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code PDF

    EIA 763

    Abstract: AN2348 EIA standards 783 STMicroelectronics smd marking code WLCSP stencil design 10E12 10E4 10E8 AN1235 ANTISTATIC
    Text: AN2348 Application note IPAD and ASD Application Specific Devices 400 µm Flip-Chip: Package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip-Chips. For information on 500 µm FlipChips, see Application note AN1235.


    Original     		AN2348 AN1235. EIA 763 AN2348 EIA standards 783 STMicroelectronics smd marking code WLCSP stencil design 10E12 10E4 10E8 AN1235 ANTISTATIC PDF

    EIA 763

    Abstract: EIA-481-C EIA standards 783 underfill WLCSP stencil design 10E12 10E4 10E8 AN1235 AN2348
    Text: AN1235 Application note IPAD and ASD Application Specific Devices 500 µm Flip-Chip: Package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip-Chips. For information on 400 µm FlipChips, see Application note AN2348.


    Original     		AN1235 AN2348. EIA 763 EIA-481-C EIA standards 783 underfill WLCSP stencil design 10E12 10E4 10E8 AN1235 AN2348 PDF

    AN2348

    Abstract: EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12
    Text: AN2348 Application note IPAD 400 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip Chips. For information on 500 µm Flip Chips, see Application note AN1235.


    Original     		AN2348 AN1235. AN2348 EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12 PDF

    WLCSP66

    Abstract: PI0297 EIA-481-C EIA 481-C WLCSP64 WLCSP underfill WLCSP stencil design comintec onyx32 smd code marking wlcsp 9
    Text: PI0297 Package Information Description of WLCSP for microcontrollers and recommendations for use Introduction This document describes the WLCSP wafer level chip size package , and provides recommendation on how to use it. Only WLCSP for microcontrollers are described herein.


    Original     		PI0297 WLCSP66 PI0297 EIA-481-C EIA 481-C WLCSP64 WLCSP underfill WLCSP stencil design comintec onyx32 smd code marking wlcsp 9 PDF

    STR912FAW44X6

    Abstract: STR91xFAxxxxx ARM966E-S BGA144 LFBGA144 LQFP128 LQFP80 STR91XFA STR912FAW4 STR91xFAxxx
    Text: STR91xFA Errata sheet STR91xFA limitations and corrections Silicon identification STR91x microcontrollers have two major salestype groups, as follows: ● The initial group consists of STR91xFxxxxx devices, for example STR912FW44X6, with silicon revisions B, and D. Detailed technical information for these devices can be


    Original     		STR91xFA STR91xFA STR91x STR91xFxxxxx STR912FW44X6, STR91xF STR91xFAxxxxx STR912FAW44X6, STR912FAW44X6 ARM966E-S BGA144 LFBGA144 LQFP128 LQFP80 STR912FAW4 STR91xFAxxx PDF

    ARM str91x

    Abstract: STR912FAW44x6 STR912 STR912FA Part Marking STMicroelectronics flash memory PL190 8 Bit ADC Flash Generic STMicroelectronics LQFP marking code date STR912FAW44x6* datasheet ARM966E-S
    Text: STR91xFA Errata sheet STR91xFA limitations and corrections Silicon identification STR91x microcontrollers have two major salestype groups, as follows: ● The initial group consists of STR91xFxxxxx devices, for example, STR912FW44X6, with silicon revisions B and D. Detailed technical information for these devices can be


    Original     		STR91xFA STR91xFA STR91x STR91xFxxxxx STR912FW44X6, STR91xF STR91xFAxxxxx STR912FAW44X6, ARM str91x STR912FAW44x6 STR912 STR912FA Part Marking STMicroelectronics flash memory PL190 8 Bit ADC Flash Generic STMicroelectronics LQFP marking code date STR912FAW44x6* datasheet ARM966E-S PDF

    STR912FAW44X6

    Abstract: STR912FAW4 STR912FAW44x6* datasheet LQFP80 PL190 ARM966E-S BGA144 LFBGA144 LQFP128 STR912FW44X6
    Text: STR91xFA Errata sheet STR91xFA limitations and corrections Silicon identification STR91x microcontrollers have two major salestype groups, as follows: ● The initial group consists of STR91xFxxxxx devices, for example, STR912FW44X6, with silicon revisions B and D. Detailed technical information for these devices can be


    Original     		STR91xFA STR91xFA STR91x STR91xFxxxxx STR912FW44X6, STR91xF STR91xFAxxxxx STR912FAW44X6, STR912FAW44X6 STR912FAW4 STR912FAW44x6* datasheet LQFP80 PL190 ARM966E-S BGA144 LFBGA144 LQFP128 STR912FW44X6 PDF

    Untitled

    Abstract: No abstract text available
    Text: ST6G3244ME Level translator for SD, SDIO, mini SD, and micro SD Cards with internal I/O supply and ±15 kV ESD protection Features • Supports 60 MHz clock rate ■ Supports DDR mode for SD Card ■ Compliant with – SD Specification Part 1 Physical Layer


    Original     		ST6G3244ME SDR12, SDR25, DDR50) PDF

    QST108

    Abstract: AN2035 AN2036 CHARGE-TRANSFER TOUCH SENSOR LQFP32 7x7 Pb-free package QUANTUM CAPACITIVE AN1181 AN1709 AN2547 JESD97
    Text: QST108 Capacitive touch sensor device 8 keys with individual key state outputs or I2C interface Not For New Design Features • Patented charge-transfer design ■ Up to 8 independent QTouch keys supported ■ Individual key state outputs or I2C interface


    Original     		QST108 QST108 AN2035 AN2036 CHARGE-TRANSFER TOUCH SENSOR LQFP32 7x7 Pb-free package QUANTUM CAPACITIVE AN1181 AN1709 AN2547 JESD97 PDF

    SPC563M64

    Abstract: ps4127 PS4890 SPC563M64L5 ps8845 NEXUS FLASH ERASE ps5060 BGA208 LQFP144 LQFP176
    Text: SPC563M64 Errata sheet SPC563M64 device errata JTAG_ID = 0x2AE01041 Introduction This errata sheet describes all the functional and electrical problems known in the revision 2.1 of the SPC563M64 devices, identified with the JTAG_ID = 0x2AE01041 and the Flash


    Original     		SPC563M64 SPC563M64 0x2AE01041 0x2AE01041 RM0015 ps4127 PS4890 SPC563M64L5 ps8845 NEXUS FLASH ERASE ps5060 BGA208 LQFP144 LQFP176 PDF

    LQFP32 7x7 Pb-free package

    Abstract: QST108KT6 QFN 7X7 32-pin "Touch Sensor IC" thin film filter GPON AN2035 AN2036 AN1181 AN1709 AN2547
    Text: QST108 Capacitive touch sensor device 8 keys with individual key state outputs or I2C interface Not For New Design Features • Patented charge-transfer design ■ Up to 8 independent QTouch keys supported ■ Individual key state outputs or I2C interface


    Original     		QST108 LQFP32 LQFP32 7x7 Pb-free package QST108KT6 QFN 7X7 32-pin "Touch Sensor IC" thin film filter GPON AN2035 AN2036 AN1181 AN1709 AN2547 PDF

    JESD79-2B

    Abstract: CR88 DDR2-667 STLS2E02 STLS2F01 1013tdi
    Text: STLS2F02-LP high performance 64-bit superscalar MIPS Loongson 2F microprocessor Preliminary Data Features • 64-bit superscalar architecture ■ 800 MHz clock frequency ■ Single/double precision floating-point units ■ New streaming multimedia instruction set


    Original     		STLS2F02-LP 64-bit DDR2-667 27x27 JESD79-2B CR88 STLS2E02 STLS2F01 1013tdi PDF

    E329

    Abstract: No abstract text available
    Text: QST108 Capacitive touch sensor device 8 keys with individual key state outputs or I2C interface Not For New Design Features • Patented charge-transfer design ■ Up to 8 independent QTouch keys supported ■ Individual key state outputs or I2C interface


    Original     		QST108 LQFP32 QST108 E329 PDF

    Untitled

    Abstract: No abstract text available
    Text: QST104 Capacitive touch sensor device 4 keys with individual key state outputs or I2C interface Preliminary Data Features • Patented charge-transfer design ■ Up to 4 independent QTouch keys supported ■ Individual key state outputs or I2C interface


    Original     		QST104 LQFP32 QST104 PDF

    AN2547

    Abstract: JESD97 LQFP32 QST608
    Text: QST608 Capacitive touch sensor device with rotor or slider plus five extra keys and I2C interface Preliminary Data Features • Patented charge-transfer design ■ Rotor or slider plus five extra keys ■ Up to five general-purpose outputs ■ I2C interface


    Original     		QST608 AN2547 JESD97 LQFP32 QST608 PDF

    dad2000

    Abstract: dlp dad2000 MARKING 3D regulator
    Text: DLPA200 www.ti.com DLPS015C – APRIL 2010 – REVISED SEPTEMBER 2013 DLP DLPA200 DMD Micromirror Driver Check for Samples: DLPA200 FEATURES 1 • • • • • APPLICATIONS • • • Industrial: – Direct Imaging Lithography – Laser Marking and Repair Systems


    Original     		DLPA200 DLPS015C DLPA200 dad2000 dlp dad2000 MARKING 3D regulator PDF

    dlp dmd chip xga

    Abstract: dlp dmd chip DAD2000
    Text: DLPA200 www.ti.com DLPS015C – APRIL 2010 – REVISED SEPTEMBER 2013 DLP DLPA200 DMD Micromirror Driver Check for Samples: DLPA200 FEATURES 1 • • • • • APPLICATIONS • • • Industrial: – Direct Imaging Lithography – Laser Marking and Repair Systems


    Original     		DLPA200 DLPS015C DLPA200 80-pin, dlp dmd chip xga dlp dmd chip DAD2000 PDF

    Untitled

    Abstract: No abstract text available
    Text: STM32L15xCC STM32L15xRC STM32L15xUC STM32L15xVC Ultra-low-power 32-bit MCU ARM -based Cortex®-M3, 256KB Flash, 32KB SRAM, 8KB EEPROM, LCD, USB, ADC, DAC Datasheet - production data Features • Ultra-low-power platform – 1.65 V to 3.6 V power supply – -40 °C to 85 °C/105 °C temperature range


    Original     		STM32L15xCC STM32L15xRC STM32L15xUC STM32L15xVC 32-bit 256KB C/105 DocID022799 PDF

    JESD79-2B

    Abstract: 0x01000202 CR88 DDR2-667 STLS2E02 STLS2F01 Loongson
    Text: STLS2F02-LP high performance 64-bit superscalar MIPS Loongson 2F microprocessor Preliminary Data Features • 64-bit superscalar architecture ■ 800 MHz clock frequency ■ Single/double precision floating-point units ■ New streaming multimedia instruction set


    Original     		STLS2F02-LP 64-bit DDR2-667 27x27 JESD79-2B 0x01000202 CR88 STLS2E02 STLS2F01 Loongson PDF

    STR911fa

    Abstract: STR912FA Z32H STR912FAW42X6 STR911 STR912FAW44X6 STR9 flash programming 372 lfbga Encapsulation thermal resistance STR912FAW44x6* datasheet ARM7 induction
    Text: STR91xFAx32 STR91xFAx42 STR91xFAx44 ARM966E-S 16/32-Bit Flash MCU with Ethernet, USB, CAN, AC motor control, 4 timers, ADC, RTC, DMA Features • 16/32-bit 96 MHz ARM9E based MCU – ARM966E-S RISC core: Harvard architecture, 5-stage pipeline, Tightly-Coupled


    Original     		STR91xFAx32 STR91xFAx42 STR91xFAx44 ARM966E-STM 16/32-Bit ARM966E-S STR91xFA 32-bits STR911fa STR912FA Z32H STR912FAW42X6 STR911 STR912FAW44X6 STR9 flash programming 372 lfbga Encapsulation thermal resistance STR912FAW44x6* datasheet ARM7 induction PDF