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    WLCSP Price and Stock

    Qualcomm DK-QCC5141-WLCSP94-A-0

    DEV KIT, DK-QCC5141-WLCSP94-A-0
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey DK-QCC5141-WLCSP94-A-0 Bulk 16 1
    • 1 $851.2
    • 10 $851.2
    • 100 $851.2
    • 1000 $851.2
    • 10000 $851.2
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    Qualcomm DK-QCC3002-WLCSP-CE751-1A

    DEV KIT QC33002 WLCSP BT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey DK-QCC3002-WLCSP-CE751-1A Box 7 1
    • 1 $800
    • 10 $800
    • 100 $800
    • 1000 $800
    • 10000 $800
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    Qualcomm DK-QCC3001-WLCSP-CE752-1A

    DEV KIT QC33001 WLCSP WT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey DK-QCC3001-WLCSP-CE752-1A Box 7 1
    • 1 $800
    • 10 $800
    • 100 $800
    • 1000 $800
    • 10000 $800
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    Qualcomm DB-QCC5141-WLCSP94-A-0

    DEV KIT, DB-QCC5141-WLCSP94-A-0
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey DB-QCC5141-WLCSP94-A-0 Bulk 5 1
    • 1 $212.8
    • 10 $212.8
    • 100 $212.8
    • 1000 $212.8
    • 10000 $212.8
    		Buy Now

    Qualcomm DB-QCC3046-WLCSP94-A-0

    DEV KIT, DB-QCC3046-WLCSP94-A-0
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey DB-QCC3046-WLCSP94-A-0 Bulk 3 1
    • 1 $212.8
    • 10 $212.8
    • 100 $212.8
    • 1000 $212.8
    • 10000 $212.8
    		Buy Now
    Find more WLCSP price and stock on Findchips.com

    WLCSP Datasheets (17)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    WLCSP NXP Semiconductors Guideline for the laser marking layout of WLCSP devices Original PDF
    WLCSP12 NXP Semiconductors Wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm Original PDF
    WLCSP12 NXP Semiconductors Wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm Original PDF
    WLCSP12 NXP Semiconductors WLCSP12: wafer level chip-scale package; 12 bumps Original PDF
    WLCSP15 NXP Semiconductors Wafer-level chip-size package; 15 bumps; (4 x 4 - C2) Original PDF
    WLCSP16 NXP Semiconductors Wafer level chip-size package; 16 bumps Original PDF
    WLCSP16 NXP Semiconductors Wafer level chip-size package; 16 bumps Original PDF
    WLCSP17 NXP Semiconductors Wafer level chip-size package; 17 bumps (6-5-6) Original PDF
    WLCSP20 NXP Semiconductors Wafer level chip-size package; 20 bumps Original PDF
    WLCSP25 NXP Semiconductors WLCSP24: wafer level chip-size package; 24 bumps (5 x 5 - A1) Original PDF
    WLCSP25217X232 NXP Semiconductors WLCSP24: wafer level chip-size package; 24 bumps (5 x 5 - A1) Original PDF
    WLCSP39 NXP Semiconductors Wafer level chip-scale package; 39 balls Original PDF
    WLCSP4 NXP Semiconductors Wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) Original PDF
    WLCSP4 NXP Semiconductors Wafer level chip-size package; 4 bumps; 0.91 x 0.91 x 0.70 mm Original PDF
    WLCSP49 NXP Semiconductors Wafer level chip-size package; 49 bumps; 3.37 x 2.97 mm Original PDF
    WLCSP5 NXP Semiconductors Wafer level chip-size package; 5 bumps (2-1-2) Original PDF
    WLCSP6 NXP Semiconductors Wafer level chip-size package; 6 bumps (2 x 3) Original PDF

    WLCSP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Datasheet Serial EEPROM Series Standard EEPROM WLCSP EEPROM BRCC064GWZ-3 General Description BRCC064GWZ-3 is a serial EEPROM of I2C BUS Interface Method Packages W Typ x D(Typ) x H(Max) Features 2 „ Completely conforming to the world standard I C BUS. All controls available by 2 ports of serial clock


    Original     		BRCC064GWZ-3 BRCC064GWZ-3 UCSP30L1 400KHz PDF

    Untitled

    Abstract: No abstract text available
    Text: Datasheet Serial EEPROM Series Standard EEPROM WLCSP EEPROM BRCA016GWZ-W 16Kbit General Description BRCA016GWZ-W series is a serial EEPROM of I2C BUS Interface Method. Features • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Completely conforming to the world standard I2C BUS. All controls available by 2 ports of serial clock (SCL)


    Original     		BRCA016GWZ-W 16Kbit) BRCA016GWZ-W 400KHz PDF

    RF6280

    Abstract: RD6280
    Text: RF6280 Preliminary POWER MANAGEMENT IC Package Style: 15-Bump WLCSP, 4 x 4 Array, 2 mm x 2 mm Features „ „ „ „ „ „ „ „ „ „ „ „ „ Peak Efficiency Up To 96% High Efficiency Over Various Loads Transient Response < 10 s 650 mA Current Capability


    Original     		RF6280 15-Bump RF6280 DS090304 RD6280 PDF

    LQM18PN1R0

    Abstract: CBMF1608 LQM18PN 953-MHz ADP2139
    Text: Compact, 800 mA, 3 MHz, Step-Down DC-to-DC Converter ADP2138/ADP2139 Data Sheet FEATURES GENERAL DESCRIPTION Input voltage: 2.3 V to 5.5 V Peak efficiency: 95% 3 MHz fixed frequency operation Typical quiescent current: 24 A Very small solution size 6-lead, 1 mm x 1.5 mm WLCSP package


    Original     		ADP2138/ADP2139 ADP2138 ADP2139 CB-6-12 LQM18PN1R0 CBMF1608 LQM18PN 953-MHz PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline WLCSP12: wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm A E NVT4555UK B A2 ball A1 index area A A1 D detail X e1 e ZE2 C Øv Øw b C A B C y D e C B ZE1 ball A1 index area e2 1/2 e A 1 ZD1 2 3 X ZD2 2 mm scale Dimensions mm are the original dimensions


    Original     		WLCSP12: NVT4555UK wlcsp12 nvt4555 nvt4555uk PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline WLCSP16: wafer level chip-size package; 16 bumps; 1.96 x 1.96 x 0.53 mm A B D NX20P3xxUK ball A1 index area A2 E A A1 detail X e1 C e C A B C Øv Øw b y D e C e2 B A ball A1 index area 1 2 3 4 X 2 mm scale Dimensions mm are the original dimensions


    Original     		WLCSP16: NX20P3xxUK wlcsp16 nx20p3xxuk PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline WLCSP100: wafer level chip-scale package; 100 balls; 5.074 x 5.074 x 0.6 mm B D LPC1768UK A ball A1 index area A2 A A1 E detail X e1 1/2 e e Øv Øw b C A B C C y K e J H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X 3 mm


    Original     		WLCSP100: LPC1768UK wlcsp100 lpc1768uk PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline WLCSP4: wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm Backside coating included A B D NX3P1107/NX3P1108 A2 ball A1 index area A A1 E detail X e 1/2 e C A B C Øv Øw b C y B 1/2 e e A ball A1 index area 1 2 X 1 mm scale Dimensions (mm are the original dimensions)


    Original     		NX3P1107/NX3P1108 nx3p1107-8 PDF

    WLCSP15

    Abstract: No abstract text available
    Text: Package outline WLCSP15: wafer-level chip-size package; 15 bumps; 4 x 4 - C2 D bump A1 index area A2 E A A1 detail X e1 e b D e C e2 B A 1 2 3 4 X European projection wlcsp15_4x4-c2_po www.nxp.com 2010 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not


    Original     		WLCSP15: wlcsp15 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline WLCSP12: wafer level chip-scale package; 12 bumps; 1.664 x 1.364 x 0.509 mm Backside coating included B A D NX5P1000 A2 ball A1 index area A E A1 detail X e1 1/2 e e C A B C Øv Øw b C y C e B e2 A ball A1 index area 1 2 3 4 X 2 mm scale


    Original     		WLCSP12: NX5P1000 wlcsp12 nx5p1000 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint WLCSP17: wafer level chip-size package; 17 bumps 6-5-6 D bump A1 index area A2 A E A1 detail X e 1/2 e b C e1 B1 B B2 B3 B4 B5 e2 A 1 2 3 e3 4 5 6 X European projection wlcsp17_6-5-6_po www.nxp.com 2010 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not


    Original     		WLCSP17: wlcsp17 PDF

    SOLDERRM

    Abstract: WLCSP10 156BSC
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 1.56x1.05 CASE 567BH−01 ISSUE O SCALE 4:1 È È PIN A1 REFERENCE 2X 0.05 C 2X 0.05 C D A DATE 26 JUL 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.


    Original     		WLCSP10, 567BH-01 567BH SOLDERRM WLCSP10 156BSC PDF

    WLCSP10

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 2.46x0.96 CASE 567BG−01 ISSUE O SCALE 4:1 È È PIN A1 REFERENCE 2X 0.05 C 2X 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL


    Original     		WLCSP10, 567BG-01 567BG WLCSP10 PDF

    SOLDERRM

    Abstract: WLCSP15
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP15, 2.47x1.05 CASE 567BR−01 ISSUE O SCALE 4:1 PIN A1 REFERENCE 2X 0.05 C 2X D È È 0.05 C A 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL


    Original     		WLCSP15, 567BR-01 567BR SOLDERRM WLCSP15 PDF

    567AZ-01

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP5, 0.94x1.41 CASE 567AZ−01 ISSUE O SCALE 4:1 D 2X A ÈÈ PIN A1 REFERENCE DATE 26 JUL 2010 B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL


    Original     		567AZ-01 567AZ 567AZ-01 PDF

    143X1

    Abstract: wlcsp8 footprint
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP8, 1.43x1.41 CASE 567BE−01 ISSUE O SCALE 4:1 D PIN A1 REFERENCE 2X A ÈÈ DATE 26 JUL 2010 B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL


    Original     		567BE-01 567BE 143X1 wlcsp8 footprint PDF

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP4, 0.96x0.96 CASE 567AW−01 ISSUE O SCALE 4:1 ÈÈ ÈÈ D PIN A1 REFERENCE 2X A DATE 26 JUL 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL


    Original     		567AW-01 567AW PDF

    WLCSP20

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP20, 3.27x1.13 CASE 567BW−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X 0.05 C 2X D È È A E 0.05 C DIM A A1 A2 b D E eD eE TOP VIEW OptiGuard Option 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER


    Original     		WLCSP20, 567BW-01 567BW WLCSP20 PDF

    567BM-01

    Abstract: WLCSP10
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 3.10x1.15 CASE 567BM−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X 0.05 C 2X D ÈÈ ÈÈ A E 0.05 C DIM A A1 A2 b D E e TOP VIEW OptiGuard Option 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER


    Original     		WLCSP10, 567BM-01 567BM 567BM-01 WLCSP10 PDF

    WLCSP-20

    Abstract: 16X1 WLCSP20
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP20, 3.16x1.05 CASE 567BU−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X 0.05 C 2X D ÈÈ ÈÈ A E 0.05 C DIM A A1 A2 b D E eD eE TOP VIEW OptiGuard Option 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER


    Original     		WLCSP20, 567BU-01 567BU WLCSP-20 16X1 WLCSP20 PDF

    WLCSP10

    Abstract: 567BL
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 1.96x1.33 CASE 567BL−01 ISSUE O SCALE 4:1 PIN A1 REFERENCE 2X ÈÈ D A DATE 26 JUL 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL


    Original     		WLCSP10, 567BL-01 567BL WLCSP10 567BL PDF

    portable dvd player schematic diagram of video

    Abstract: 5.1 Channel audio amplifier datasheet class d power amplifier pwm control of tec AUX0025 SA58671UK
    Text: SA58671 1.2 W/channel stereo class-D audio amplifier Rev. 02 — 24 October 2008 Product data sheet 1. General description The SA58671 is a stereo, filter-free class-D audio amplifier which is available in a 16 bump WLCSP Wafer Level Chip-Size Package . The SA58671 features independent shutdown controls for each channel. The gain can be


    Original     		SA58671 SA58671 portable dvd player schematic diagram of video 5.1 Channel audio amplifier datasheet class d power amplifier pwm control of tec AUX0025 SA58671UK PDF

    Untitled

    Abstract: No abstract text available
    Text: BlueNRG Bluetooth low energy wireless network processor Datasheet - production data • On-chip non-volatile Flash memory  AES security co-processor  Low power modes  16 or 32 MHz crystal oscillator  12 MHz ring oscillator WLCSP34 QFN32  32 kHz crystal oscillator


    Original     		WLCSP34 QFN32 CFR47 STD-T66 DocID025108 PDF

    A2 diode

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package WLCSP W6x6.36 6x6 ARRAY 36 BALL WAFER LEVEL CHIP SCALE PACKAGE E PIN 1 ID D TOP VIEW SYMBOL MILLIMETERS A 0.44 Min, 0.495 Nom, 0.55 Max A1 0.190 ±0.030 A2 0.305 ±0.025 b 0.270 ±0.030


    Original     		PDF