W8X00
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; SEE TABLE 1 FOR LAND PAD AND SOLDER MASK COORDINATES; SEE TABLE 2 FOR SOLDER PASTE STENCIL COORDINATES. 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES
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DS4802X
W8X00
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PDF
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FR4 SUBSTRATE SHEET
Abstract: 0343
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES
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DS1822X
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES
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DS1822X
DS1822X
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PDF
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Untitled
Abstract: No abstract text available
Text: Part Number: S7100PH-C4 Package: 484L HSGBA 23x23mm Material Declaration Statement of Materials, Construction Material Component Name Weight (g) Element/Compound 1 2 Die Underfill 0.1502 0.0170 3 Epoxy 0.0500 4 Heat Spreader 2.3620 5
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S7100PHâ
23x23mm)
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PDF
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underfill
Abstract: DS2417X FR4 substrate ds2417
Text: NOTES: 1. 2. DIMENSIONS: LASER MARK MM [IN C H ] 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR CONNECTIONS AND COORDINATES, SEE TABLE 1 4. PAD UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILUMETERS
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DS2417X
DS2417X
underfill
FR4 substrate
ds2417
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PDF
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IS242
Abstract: DS2423X
Text: NOTES: 1. DIMENSIDNSi 2. 3. MM CINCHES] LASER MARK LAND PAH NOT DEFINED BY SOLDER MASK; FDR PAD CONNECTIONS, SEE TABLE 1 4. UNDERFILL DR GLEIB TDP REQUIRED FDR FR4 DR EQ U IVA LEN T SUBSTRATE TABLE 1. APPLICATION LAND PAD C0NNECT0N5 AND CENTE R COORDINATES
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DS2423X
IS2423X
IS2423X
IS242
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PDF
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KY transistor
Abstract: MSCD052 MSCD053 MSCD054
Text: MSCD052 THRU MSCD054 VOLTAGE 20V ~ 40V Elektronische Bauelemente 0.5 AMP Surface Mount Schott ky Barrier Rectifiers RoHS Compliant Product A suffix of "-C" specifies halogen & lead-free 0805 .002 0.05 FEATURES * Case : Packed with FRP substrate and epoxy underfilled
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MSCD052
MSCD054
0160Hz
MSCD052
MSCD053
01-Jun-2002
KY transistor
MSCD053
MSCD054
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PDF
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DS2430AX
Abstract: FR4 substrate 0537
Text: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR F R 4 SUBSTRATE APPLICATION TABLE 1. PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS
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DS2430AX
IS2430AX
022GE
DS2430AX
FR4 substrate
0537
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PDF
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FR4 SUBSTRATE SHEET
Abstract: DS75X 3ao2
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. NON-SOLDER MASK DEFINED LANDING PAD 4. UNDERFILL OR GLOB TOP RECOMMENDED FOR F R - 4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1: SUBSTRATE CONNECTIONS AND PAD COORDINATES MILLIMETERS INCHES PAD# NAME CENTER X
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DS75X
DS75X
FR4 SUBSTRATE SHEET
3ao2
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PDF
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stdf
Abstract: DS1722X Glob DS1722
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. N O N -SO LD ER MASK DEFINED LANDING PAD 4. UNDERFILL OR GLOB TOP RECOMMENDED FOR FR4- OR EQUIVALENT SUBSTRATE APPLICATIONS T A B LE 1: SU B ST R A T E CDNNECTIDNS AND PAD C D D R IIN A T E S MILLIMETERS NUMBER
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DS1722X
DS1722X
stdf
Glob
DS1722
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PDF
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underfill
Abstract: with or without underfill intel C4 package underfill for good adhesion and low viscosity Low viscosity underfill for flip chip microwave oven
Text: Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging Tom Dory, Assembly Technology Development, Intel Corp. Kenji Takahashi, Japan Package Technology Development, Intel Corp. Tomomi Kume, Japan Package Technology Development, Intel Corp.
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MSCD204
Abstract: MSCD202
Text: MSCD202 THRU MSCD204 VOLTAGE 20V ~ 40V Elektronische Bauelemente 2 AMP Surface Mount Schottky Barrier Rectifiers RoHS Compliant Product A suffix of "-C" specifies halogen & lead-free 0805 .002 0.05 FEATURES * Case : Packed with FRP substrate and epoxy underfilled
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MSCD202
MSCD204
01-Jun-2002
MSCD204
MSCD202
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PDF
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JESD22
Abstract: Sn46 PB46 7410E A104 A108 A113 WED3C7410E16M-400BX
Text: WED3C7410E16M-400BX POWER PC 7410E MULTI-CHIP PACKAGE CONSTRUCTION HIGH RELIABILITY FLIP CHIP ATTACH TEST • C4 Assembly on PowerPC™ Processors & SSRAM die ■ Burn-In - 100%, 48 hours at 125°C ■ JEDEC Level 2 underfill ■ Die Thickness ■ Final Electrical Test - 100% at maximum and
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WED3C7410E16M-400BX
7410E
Sn46/Pb46/Bi8
835mm
EIA/JESD22
200A0004-18
JESD22
Sn46
PB46
A104
A108
A113
WED3C7410E16M-400BX
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PDF
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165301
Abstract: No abstract text available
Text: ^ 0.15 A A1 INDEX N // 0.25 A SEATING PLANE r 8X 6.5 MAX i I I L // 0.35 UNDERFILL ZONE r I y 4X 11.3 MAX TOP VIEW 18X 1.27 w I L h rII ♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦ ♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦ ♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦
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98ARE10598D
5M-1994.
165301
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline FCP2: metal flip chip package; 2 leads; 35 mm wide tape SOT732-1 underfill tape A backside tape detail X X reject hole by device testing direction mark underfill tape D 5 10 15 20 mm scale DIMENSIONS mm are the original dimensions UNIT A
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OT732-1
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MSCD104
Abstract: marking a4
Text: MSCD104 VOLTAGE 40V Elektronische Bauelemente 1 AMP Surface Mount Schottky Barrier Re ctifie rs RoHS Compliant Product A suffix of "-C" specifies halogen & lead-free 0805 .002 0.05 FEATURES * Case : Packed with FRP substrate and epoxy underfilled * Terminals : Solder plated , solderable per MIL-STD-750,
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MSCD104
01-Jun-2002
MSCD104
marking a4
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PDF
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underfill
Abstract: DS2415X D085-002 FR4 substrate
Text: NOTES: 1. DIMENSIDN5: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COQRDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS
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DS2415X
DS2415X
underfill
D085-002
FR4 substrate
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PDF
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JESD22-B117
Abstract: JEDEC JESD22-B117 JESD22B117 dallas date code JESD22-B100
Text: 05/06/2003 RELIABILITY REPORT FOR Dallas, no underfill, 144 Chip Scale BGA Interposer Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy.
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underfill
Abstract: SILICON CONTROL RECTIFIER DETAILS AN-1050 Aluminum alloys physical properties Ablestik underfill SN62 PB36 ag2 Copper SN62 PB36 ag2 alsic 105 alsic
Text: AN-1050 DirectFET TM Technology Materials and Practices Application Note page Factors causing thermal fatigue 2 Summarized test results 2 Use of underfill beneath devices 3 Use of lead-free solder alloys 3 Use of insulated metal substrates 4 Use of conformal coatings
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AN-1050
AN-1035,
underfill
SILICON CONTROL RECTIFIER DETAILS
AN-1050
Aluminum alloys physical properties
Ablestik underfill
SN62 PB36 ag2 Copper
SN62 PB36 ag2
alsic 105
alsic
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PDF
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underfill
Abstract: FCP2 SOT732-1 sot732
Text: Package outline Philips Semiconductors FCP2: metal flip chip package; 2 leads; 35 mm wide tape SOT732-1 underfill tape A backside tape detail X X reject hole by device testing direction mark underfill tape D 5 10 15 20 mm scale DIMENSIONS mm are the original dimensions
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Original
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OT732-1
underfill
FCP2
SOT732-1
sot732
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PDF
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Untitled
Abstract: No abstract text available
Text: ^ 0.15 A1 INDEX A_ N / / 0.25 A SEAÄNG PL 8X 6.5 MAX i r I I L / / 0.35 UNDERFILL ZONE r I y 4X 11.3 MAX TOP VIEW 18X 1.27 h I L ♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦ ♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦ ♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦
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98ARE10604D
5M-1994.
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PDF
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OLGA
Abstract: No abstract text available
Text: 360X 0.15 A c A1 INDEX SEATING PLANE 8X 6.5 M A X i 4X 11.3 M A > UNDERFILL ZONE — 0.34 "0.14 360X 0Q-Q2 1 2 3 4 5 6 7 9 11 13 15 17 19 8 10 12 14 16 18 fh 00.3 A E C 00.1 5® A 0.9 '0.7 2.14 MAX- BOTTOM VIEW FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED.
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-360X
98ARE10620D
5M-1994.
OLGA
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PDF
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JEDEC JESD22-B117
Abstract: JESD22-B117 Nitto HC Maxim ic date code Nitto 17X17X1 HC100 underfill JESD22-B100
Text: 01/23/2004 RELIABILITY REPORT FOR DS21Q55, Rev B2, ASAT no underfill Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292
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DS21Q55,
30C/60%
JEDEC JESD22-B117
JESD22-B117
Nitto HC
Maxim ic date code
Nitto
17X17X1
HC100
underfill
JESD22-B100
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PDF
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DS56X
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [INCH] LASER MARK LANDING PAD NOT DEFINED BY SO LD ER Z. 3. MASK; FOR PAD CONNECTIONS AND COORDINATES. SE E TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS
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DS56X
DS56X
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PDF
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