Untitled
Abstract: No abstract text available
Text: Package outline BGA208: plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm SOT595-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C T e R P N M L K J e2 H G 1/2 e F E D C B A 1 shape optional 4x
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BGA208:
OT595-1
MS-034
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SF-BGA208A-B-11
Abstract: BGA208
Text: D Package Code: BGA208A C 20.32mm [0.800"] See BGA pattern code to the right for actual pattern layout Y X Top View reference only 1.27mm [0.050"] 20.32mm [0.800"] 2 0.36mm [0.014"] dia. 0.69mm 5.33mm 3.74mm [0.147"] [0.210"] B 1 Ø 0.64mm pad [Ø 0.025"]
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BGA208A
FR4/G10
SF-BGA208A-B-11
BGA208
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16X16
Abstract: SF-BGA208C-B-11 16x16 bga
Text: C Package Code: BGA208C D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]
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BGA208C
FR4/G10
16X16
SF-BGA208C-B-11
16X16
16x16 bga
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA208 package SOT595-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA208
OT595-1
OT595-1
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SF-BGA208B-B-11
Abstract: No abstract text available
Text: D Package Code: BGA208B C 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.76mm [0.030"] X 24.13mm [0.950"] Top View reference only 1.27mm [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA208B
FR4/G10
SF-BGA208B-B-11
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PDF
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bga208
Abstract: sot595 package outline bga208
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA208: plastic ball grid array package; 208 balls; body 17 x 17 x 1.20 mm SOT595-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X k k e1 b e C v M B ∅w M y y1 C v M A T R e P N M L K J e1 H G F
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BGA208:
OT595-1
1SOT595-1
bga208
sot595
package outline bga208
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PDF
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package outline bga208
Abstract: SOT-595 BGA208 MS-034
Text: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA208: plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm SOT595-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C T e R P N M L K J e2 H
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BGA208:
OT595-1
MS-034
package outline bga208
SOT-595
BGA208
MS-034
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PDF
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Mask Set Errata MPC563XM_1M35Y Rev. 28 JAN 2013 Mask Set Errata for Mask 1M35Y Introduction This report applies to mask 1M35Y for these products: • MPC563XM Errata ID Errata Title 3521 DECFIL: Soft reset failures at the end of filtering
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MPC563XM
1M35Y
1M35Y
MPC563XM
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smd part marking G14 mosfet
Abstract: smd part marking G14 sot MB39C308 MARKING CO6 NEC 41-A 002 LDMOS NEC
Text: FUJITSU MICROELECTRONICS DATA SHEET DS04-27261-5E ASSP for Power Management Applications of Ultra Mobile PC 6ch DC/DC Converter IC for LPIA Platform VR MB39C308 • DESCRIPTION The MB39C308 is a 6ch DC/DC buck converter LSI, which integrates all of necessary power supplies for UltraMobile PC powered by 2-cell Li-ion battery. And the MB39C308 uses current mode topology with N-channel
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DS04-27261-5E
MB39C308
MB39C308
smd part marking G14 mosfet
smd part marking G14 sot
MARKING CO6
NEC 41-A 002
LDMOS NEC
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PDF
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IDT70T631
Abstract: A18L
Text: Features ◆ ◆ ◆ ◆ ◆ ◆ ◆ IDT70T633/1S HIGH-SPEED 2.5V 512/256K x 18 ASYNCHRONOUS DUAL-PORT STATIC RAM WITH 3.3V 0R 2.5V INTERFACE ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed access – Commercial: 8/10/12/15ns max.
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IDT70T633/1S
512/256K
8/10/12/15ns
10/12ns
IDT70T633/1
IDT70T631
A18L
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SPC563M64
Abstract: SPC564A80 SPC564A chip amp ta 8268 e200z448n3 e200z4 PowerPC core Reference manual PCR131 K20 LQFP144 SPC564A80L7 flexcan spc56
Text: SPC564A80B4, SPC564A80L7 32-bit MCU family built on the embedded Power Architecture Preliminary data Features • ■ 150 MHz e200z4 Power Architecture core – Variable length instruction encoding VLE – Superscalar architecture with 2 execution units
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SPC564A80B4,
SPC564A80L7
32-bit
e200z4
24-entry
SPC563M64
SPC564A80
SPC564A
chip amp ta 8268
e200z448n3
e200z4 PowerPC core Reference manual
PCR131
K20 LQFP144
SPC564A80L7
flexcan spc56
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PDF
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IDT70T631
Abstract: 70T633
Text: Features ◆ ◆ ◆ ◆ ◆ ◆ ◆ IDT70T633/1S HIGH-SPEED 2.5V 512/256K x 18 ASYNCHRONOUS DUAL-PORT STATIC RAM WITH 3.3V 0R 2.5V INTERFACE ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed access – Commercial: 8/10/12/15ns max.
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IDT70T633/1S
512/256K
8/10/12/15ns
10/12ns
IDT70T633/1
IDT70T631
70T633
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PDF
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tube 5670
Abstract: 5670 tube IDT70T631 IDT BGA256
Text: Features ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ IDT70T633/1S HIGH-SPEED 2.5V 512/256K x 18 ASYNCHRONOUS DUAL-PORT STATIC RAM WITH 3.3V 0R 2.5V INTERFACE ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed access
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IDT70T633/1S
512/256K
8/10/12/15ns
10/12ns
IDT70T633/1
144-pin
DD-144)
F-08-01
70T651/9
70T633/1
tube 5670
5670 tube
IDT70T631
IDT BGA256
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PDF
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108 option k5
Abstract: 70T633
Text: Features ◆ ◆ ◆ ◆ ◆ ◆ ◆ IDT70T633/1S HIGH-SPEED 2.5V 512/256K x 18 ASYNCHRONOUS DUAL-PORT STATIC RAM WITH 3.3V 0R 2.5V INTERFACE ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed access – Commercial: 8/10/12/15ns max.
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512/256K
IDT70T633/1S
8/10/12/15ns
10/12ns
IDT70T633/1
108 option k5
70T633
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PDF
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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PDF
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IDT70T631
Abstract: 70T633
Text: Features ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ IDT70T633/1S HIGH-SPEED 2.5V 512/256K x 18 ASYNCHRONOUS DUAL-PORT STATIC RAM WITH 3.3V 0R 2.5V INTERFACE ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed access
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IDT70T633/1S
512/256K
8/10/12/15ns
10/12ns
IDT70T633/1
144-pin
DD-144)
F-08-01
IDT70T631
70T633
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PDF
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Bosch 30549
Abstract: Knock bosch 0 261 231 148 heart beat sensor 1157 C90LC ssy 1920 MPC5634 MPC5634M MPC563x bosch Knock sensor 0 261 231 148 eMIOS200
Text: MPC5634M Microcontroller Reference Manual Devices Supported: MPC5634M MPC5633M MPC5632M MPC5634MRM Rev. 4 27 May 2010 MPC5634M Microcontroller Reference Manual, Rev. 4 Freescale Semiconductor 1 Preliminary—Subject to Change Without Notice MPC5634M Microcontroller Reference Manual, Rev. 4
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MPC5634M
MPC5634M
MPC5633M
MPC5632M
MPC5634MRM
Bosch 30549
Knock bosch 0 261 231 148
heart beat sensor 1157
C90LC
ssy 1920
MPC5634
MPC563x
bosch Knock sensor 0 261 231 148
eMIOS200
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ST10F275
Abstract: ST10F296 embflash ST10F252 ST10F276 ST10F2xx ST10 ST10F275 tqfp 180NM st bga208
Text: ST10 family Advanced 16-bit microcontroller solutions STMicroelectronics’ ST10 microcontroller family offers a wide range of devices for use in the automotive market. It combines high CPU performance with high peripheral functionality and enhanced I/O-capabilities. The ST10 architecture is a 16-bit
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16-bit
16-bit
64MHz,
40-bit
832KB.
ST10F296
832KFlash/68KRam
FLST10F0206
ST10F275
ST10F296
embflash
ST10F252
ST10F276
ST10F2xx
ST10
ST10F275 tqfp
180NM
st bga208
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linflex uart example
Abstract: bga 208 PACKAGE E6723 mpc5606 mpc560xb errata NEXUS FLASH ERASE 00FF BGA208 MPC5606S SPC563M
Text: Freescale Semiconductor Device Errata MPC5606S0M25V Rev. 3 10/19/10 MPC5606S MCU Family Device Errata Introduction This device errata applies to the following products: • MPC5606S e5118PS : QuadSPI Interface may not achieve 64MHz Description The QuadSPI Interface may not achieve 64MHz in all instances. As QuadSPI is a round trip protocol, the
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MPC5606S0M25V
MPC5606S
MPC5606S
e5118PS
64MHz
64MHz
linflex uart example
bga 208 PACKAGE
E6723
mpc5606
mpc560xb errata
NEXUS FLASH ERASE
00FF
BGA208
SPC563M
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PDF
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MB39C3
Abstract: marking co6 MPLC0730L M1 smd N channel FET MB39C30 mark b14 smd diode marking lx5d smd diode T42 MPLC073 CH1 B15 diode smd
Text: FUJITSU MICROELECTRONICS DATA SHEET DS04-27261-6E ASSP for Power Management Applications of Ultra Mobile PC 6ch DC/DC Converter IC for LPIA Platform VR MB39C308 • DESCRIPTION The MB39C308 is a 6ch DC/DC buck converter LSI, which integrates all of necessary power supplies for UltraMobile PC powered by 2-cell Li-ion battery. And the MB39C308 uses current mode topology with N-channel
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DS04-27261-6E
MB39C308
MB39C308
MB39C3
marking co6
MPLC0730L
M1 smd N channel FET
MB39C30
mark b14 smd diode
marking lx5d
smd diode T42
MPLC073
CH1 B15 diode smd
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PDF
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RNS003
Abstract: VISHAY CRCW0603100 MICRON NAND u-boot CR1632 holder mosfet p321 HX1188 ADSP-526 04025A180JAT2A Coin based mobile battery charger seminar W17 SOT23-3
Text: ADSP-BF526 EZ-Board Evaluation System Manual TM Revision 1.1, February 2010 Part Number 82-000212-01 Analog Devices, Inc. One Technology Way Norwood, Mass. 02062-9106 a Copyright Information 2010 Analog Devices, Inc., ALL RIGHTS RESERVED. This document may not be reproduced in any form without prior, express written
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ADSP-BF526
use-21
RNS003
VISHAY CRCW0603100
MICRON NAND u-boot
CR1632 holder
mosfet p321
HX1188
ADSP-526
04025A180JAT2A
Coin based mobile battery charger seminar
W17 SOT23-3
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Untitled
Abstract: No abstract text available
Text: SPC564A74B4, SPC564A74L7, SPC564A80B4, SPC564A80L7 32-bit MCU family built on the embedded Power Architecture Features • ■ ■ ■ 150 MHz e200z4 Power Architecture® core – Variable length instruction encoding VLE – Superscalar architecture with 2 execution
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SPC564A74B4,
SPC564A74L7,
SPC564A80B4,
SPC564A80L7
32-bit
e200z4
LBGA208
PBGA324
LQFP176
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PDF
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EL34
Abstract: LX4 F8 MPLC073 TDK L5 3225 K11 ech8 pattern EL34 circuit C3225JB0J107M 27261 AL46
Text: FUJITSU MICROELECTRONICS 数据手册 DS04–27261–4Z ASSP Ultra Mobile PC 电源用 支持 LPIA 平台 6 路通道 DC/DC 转换器 IC MB39C308 • 概要 MB39C308 是一款 6 路通道降压 DC/DC 转换器 IC。该芯片专为使用两节锂离子电池的 Ultra Mobile PC 设计，将 UMPC
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MB39C308
EL34
LX4 F8
MPLC073
TDK L5
3225 K11
ech8 pattern
EL34 circuit
C3225JB0J107M
27261
AL46
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PDF
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ST10F275
Abstract: ST10F296 ST10F276 180NM ST10F2xx ST10F275 QFP ST10F273 ST10F251 st10 family TQFP100
Text: ST10 family 16-bit microcontrollers for automotive applications June 2006 www.st.com 16-bit microcontroller for automotive applications The ST10 family, STMicroelectronics’ industry-standard 16-bit microcontrollers, provide pin-compatible alternatives with enhanced scalable Flash
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16-bit
BRST10AU0306
ST10F275
ST10F296
ST10F276
180NM
ST10F2xx
ST10F275 QFP
ST10F273
ST10F251
st10 family
TQFP100
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PDF
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