PACKAGE OUTLINE Search Results

d1ca

Abstract: S10VB STO-220 s4vb 67 s15vb s4vb AX057 AX06 AX078 S2VB
Contextual Info: OUTLINE DIMENSIONS Fig. 1 Package: AX057 Fig. 2 Package: AX06 Fig. 3 Package: AX06 Fig. 4 Package: AX06 Fig. 5 Package: AX078 Fig. 6 Package: AX10 Fig. 7 Package: AX10 Fig. 8 Package: AX14 Fig. 9 Package: AX14 1 • 8 0 0 • 6 3 4 • 3 6 5 4 OUTLINE DIMENSIONS

TO111 package

Abstract: TO61 package TO63 package MOSFET F24 S06 rectifier
Contextual Info: PACKAGE OUTLINE DRAWINGS TO-18 PACKAGE TO-5 PACKAGE —seâtaao h i m TO-33 PACKAGE 0Ct9 t?s 1 tf— II i-t 4'fiC> ?y H TO-72 PACKAGE TO-3 PACKAGE MODIFIED TO-3 PACKAGE 60mil pins SE* Ft t -L SEATU 'i "01I6 02' °’6 .225 205 JO -66 PACKAGE F-24 PACKAGE

FX609LG

Abstract: FX609 FX609J FX609L2 FX609P6
Contextual Info: FX609P6 package discontinued 1 FX609P6 package discontinued 2 FX609P6 package discontinued 3 FX609P6 package discontinued 4 FX609P6 package discontinued 5 Package Outlines Handling Precautions The FX609 is available in the package styles outlined below. Pin 1 identification marking is shown on the relevant

Contextual Info: FX609P6 package discontinued 1 FX609P6 package discontinued 2 FX609P6 package discontinued 3 FX609P6 package discontinued 4 FX609P6 package discontinued 5 Package Outlines Handling Precautions The FX609 is available in the package styles outlined below. Pin 1 identification marking is shown on the relevant

34-pin

Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Pin Shrunk Small Outline Packag O20 1 Package Diagram 28-Lead Shrunk Small Outline Package O28 34-Pin Shrunk Small Outline Package O34 2 Package Diagram 48-Lead Shrunk Small Outline Package O48 56-Lead Shrunk Small Outline Package O56

TSOP 48 Package

Abstract: TSOP 56 Package Application of Z44 Small-outline The Diode Data Book with Package Outlines transistor outline package 3 TSOP 44 Package TSOP-II 44 Z-56
Contextual Info: Package Diagram Thin Small Outline Packages 16-Lead Thin Shrunk Small Outline Package 4.40 MM Body Z16 1 Package Diagram 28-Lead Thin Small Outline Package Z28 Thin Small Outline Packages 2 Package Diagram 32-Lead Thin Small Outline Package Z32 3 Package Diagram

Contextual Info: Power Small Outline Package PSOP 8 Lead Power Small Outline Package NS Package Number MWA08A 1999 National Semiconductor Corporation MS101185 www.national.com Power Small Outline Package (PSOP) May 1999 16 Lead Power Small Outline Package NS Package Number MWA16A

CDIP14

Abstract: cdip28 SSOP20 300 mil MS-012AB MS-012AC SO20 sot73-1 sot94 150AH CDIP-14
Contextual Info: INTEGRATED CIRCUITS DATA SHEET Package outlines Package information January 1995 File under Integrated Circuits, IC04 Philips Semiconductors Package information Package outlines INDEX PACKAGE VERSIONS DESCRIPTION PAGE SO SOT108-1 plastic small outline package; 14 leads; body width 3.9 mm

32TSOP

Contextual Info: PACKAGE INFORMATION 1. OUTLINE DIMENSIONS FOR CDIP PACKAGE 2. OUTLINE DIMENSIONS FOR .600 FAMILY PDIP PACKAGE 3. OUTLINE DIMENSIONS FOR .300 FAMILY SOP PACKAGE 4. OUTLINE DIMENSIONS FOR .330 FAMILY SOP PACKAGE 5. OUTLINE DIMENSIONS FOR .450 FAMILY SOP PACKAGE

MC20B

Abstract: CERAMIC SMALL OUTLINE PACKAGE CSOP MC16A MC20A MC24A MC28A MC28B csop16 csop
Contextual Info: Ceramic Small Outline Package CSOP 16 Lead Ceramic Small Outline Package NS package Number MC16A 2000 National Semiconductor Corporation MS101110 www.national.com Ceramic Small Outline Package (CSOP) August 1999 Ceramic Small Outline Package (CSOP) 20 Lead Ceramic Small Outline Package

LG ai 0068

Abstract: sot162ag jedec Package TO-39
Contextual Info: Philips Semiconductors Objective specification Package information Package outlines PACKAGES Packages in ascending order of packages outline version PACKAGE OUTLINE VERSION CODE RENAMED PACKAGE VERSION CODE (NON­ STANDARD) PACKAGE NAME DESCRIPTION PAGE

MARKING SMD T43

Abstract: siemens Package Outlines Plastic Package siemens Package Outlines smd marking l5 7750a
Contextual Info: Package Outlines SIEMENS Mem ory Com ponents P-DIP-20-2 Plastic Package Plastic dual in-line package P-SOJ-26/20-1 (SMD) Plastic Package (Plastic small outline J-lead) P-SOJ-26/20-5 (SMD) Plastic Package (Plastic dual in-line package) P-SO J-28-2 (SMD) Plastic Package

Application of Z44

Contextual Info: Package Diagram Thin Small Outline Packages 8-Lead Thin Shrunk Small Outline Package 4.40 MM Body Z8 51-85093 1 Package Diagram 16-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z16 51-85091 2 Package Diagram 28-Lead Thin Small Outline Package Z28

MSA14

Abstract: MSC16 MQA20 MQA24 MSA20 MSA24 MQA16 MS48A
Contextual Info: Shrink Small Outline Package SSOP 14 Lead Molded Shrink Small Outline Package NS Package Number MSA14 2000 National Semiconductor Corporation MS101170 www.national.com Shrink Small Outline Package (SSOP) May 1999 Shrink Small Outline Package (SSOP) 14 Lead Molded Shrink Small Outline Package

51-85062-C

Abstract: package
Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Lead 5.3 mm Shrunk Small Outline Package O20 51-85077-*C 1 Package Diagram 24-Lead (5.3 mm) Shrunk Small Outline Package O24 51-85078-* 2 Package Diagram 28-Lead (5.3 mm) Shrunk Small Outline Package O28

1653G

Contextual Info: v00.0909 C-20 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-20 Package Outline Drawing Package Information Package Type C-20 Package Weight [1] 16.53g Spacer Weight 4.6g [1] Does not include connectors, or mounting hardware B - 24 NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR

O28 Package

Abstract: small outline
Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Pin Shrunk Small Outline Package O20 51-85077-B 1 Package Diagram 28-Lead 210-Mil Shrunk Small Outline Package O28 51-85079-B 28-Lead (150-Mil) Shrunk Small Outline Package O29 51-85072-B 2 Package Diagram

hssop

Abstract: 32 QFP PACKAGE thermal resistance mitsubishi mounting technology
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES ORDERING INFORMATION TABLE OF CONTENTS 1 . GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION 3. PACKAGE STRUCTURE 4. PACKAGE CODING CONVENTIONS 5. PACKAGE LINE-UP 2 . DETAILED DIAGRAM OF PACKAGE OUTLINES

DIP40

Abstract: LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1
Contextual Info: PACKAGE INFORMATION Page Index DIP LQFP QFP SIL SO SSOP VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)

pmfp

Abstract: SO8 package MS-012AA VSO40 SOT176-1 075E03 SOT144-1
Contextual Info: PACKAGE INFORMATION Page Index DIP PMFP SO VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

54-LEAD

Abstract: 173e
Contextual Info: Package Diagram Thin Small Outline Packages 8-Lead Thin Shrunk Small Outline Package 4.40 MM Body Z8 51-85093 1 Package Diagram 14-Lead Thin Shrunk Small Outline Package (4.40-mm Body) Z14 51-85117 2 Package Diagram 16-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z16

Contextual Info: Package Diagram Thin Small Outline Packages 8-Lead Thin Shrunk Small Outline Package 4.40 MM Body Z8 51-85093 1 Package Diagram 14-Lead Thin Shrunk Small Outline Package (4.40-mm Body) Z14 51-85117 2 Package Diagram 16-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z16

tensolite

Contextual Info: v01.0310 C-11 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-11 Package Outline Drawing Package Information NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. PLATING: GOLD PLATE OVER NICKEL PLATE Package Type C-11 Package Weight [1] 20 gms [2] 4. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].

ZR28

Contextual Info: Package Diagram Reverse Thin Small Outline Package 28-Lead Reverse Type 1 Thin Small Outline Package 8x13.4 mm ZR28 51-85074-*F 1 Package Diagram 32-Lead Reverse Thin Small Outline Package ZR32 51-85089-*C 2