MC16A Search Results

MC20B

Abstract: CERAMIC SMALL OUTLINE PACKAGE CSOP MC16A MC20A MC24A MC28A MC28B csop16 csop
Contextual Info: Ceramic Small Outline Package CSOP 16 Lead Ceramic Small Outline Package NS package Number MC16A 2000 National Semiconductor Corporation MS101110 www.national.com Ceramic Small Outline Package (CSOP) August 1999 Ceramic Small Outline Package (CSOP) 20 Lead Ceramic Small Outline Package

MC16A

Contextual Info: 16 Lead Ceramic Small Outline Package NS Package Number MC16A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL

transistor BC 458

Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and

iso 1043-1

Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container

Contextual Info: SM T N ETW O R KS P R E C I S I O N T H N F I L M T E C H N O L O G Y S a n d w ic h , 50 M il P itc h , Dual-In-Line R e s is to r N e tw o rk s T h in F il m MO S eries F eatures • High precision NiCr thin film resistor networks SOP networks with low tolerance and TCR.

iso 1043-1

Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container

transistor BC 458

Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and