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    MC20B Search Results

    MC20B Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    MQ80960MC-20/B
    		Rochester Electronics LLC 80960MC - 32-Bit Microprocessor With Floating Point Unit and MMU Visit Rochester Electronics LLC Buy
    SF Impression Pixel

    MC20B Price and Stock

    Microchip Technology Inc BM78SPP05MC2-0B04AA

    RF TXRX MODULE BLUETOOTH SMD
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    Microchip Technology Inc BM78SPP05MC2-0B02AA

    RF TXRX MODULE BLUETOOTH SMD
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    DigiKey BM78SPP05MC2-0B02AA Tray 408 1
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    Microchip Technology Inc BM78SPPS5MC2-0B02AA

    RF TXRX MOD BLUETOOTH CHIP SMD
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    DigiKey BM78SPPS5MC2-0B02AA Tray 344 1
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    RF TXRX MOD BLUETOOTH CHIP SMD
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    DigiKey BM78SPPS5MC2-0B04AA Tray 318 1
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    Microchip Technology Inc BM78SPPS5MC2-0B06AA

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    DigiKey BM78SPPS5MC2-0B06AA Tray 168 1
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    Find more MC20B price and stock on Findchips.com

    MC20B Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    MC20B
    		National Semiconductor 20 Lead Ceramic Small Outline Package, EPROM Original PDF
    MC2/0BCX
    		3M Connectors, Interconnects - Terminals - Wire Splice Connectors - CONN SPLICE 2/0 AWG CRIMP Original PDF

    MC20B Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    MC20B

    Contextual Info: 20 Lead Ceramic Small Outline Package EPROM NS Package Number MC20B All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


    Original     		MC20B MC20B PDF

    transistor BC 458

    Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
    Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and


    Original     		MS011795 transistor BC 458 transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE PDF

    iso 1043-1

    Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
    Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


    Original     		MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A PDF

    MC20B

    Abstract: CERAMIC SMALL OUTLINE PACKAGE CSOP MC16A MC20A MC24A MC28A MC28B csop16 csop
    Contextual Info: Ceramic Small Outline Package CSOP 16 Lead Ceramic Small Outline Package NS package Number MC16A 2000 National Semiconductor Corporation MS101110 www.national.com Ceramic Small Outline Package (CSOP) August 1999 Ceramic Small Outline Package (CSOP) 20 Lead Ceramic Small Outline Package


    Original     		MC16A MS101110 MC20A MC20B MC24A MC28A MC20B CERAMIC SMALL OUTLINE PACKAGE CSOP MC16A MC20A MC24A MC28A MC28B csop16 csop PDF

    iso 1043-1

    Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
    Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


    Original     		MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray PDF

    transistor BC 458

    Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
    Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and


    Original     		PDF