CERAMIC LEADLESS CHIP CARRIER
Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 52 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC LCC-16C-F01
Text: LEADLESS CHIP CARRIER 16 PAD CERAMIC LCC-16C-F01 EIAJ code : ∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50mil Package width x package length 250 × 250mil Sealing method Frit seal LCC-16C-F01 *Shape of PIN NO.1 INDEX : Subject to change without notice.
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LCC-16C-F01
QFN016-G-S250-1
50mil
250mil
16-pad
LCC-16C-F01)
C16003SC-2-2
CERAMIC LEADLESS CHIP CARRIER
CERAMIC LEADLESS CHIP CARRIER LCC 52
PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC
LCC-16C-F01
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Untitled
Abstract: No abstract text available
Text: 76 CY7C276 16K x 16 Reprogrammable PROM Features Functional Description • 0.8-micron CMOS for optimum speed/power • High speed — 25-ns access time • 16-bit-wide words • Three programmable chip selects • Programmable output enable • 44-pin PLCC and 44-pin LCC packages
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CY7C276
25-ns
16-bit-wide
44-pin
CY7C276
16K-word
16-bit
44-pin
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CY7C276-25JC
Abstract: CY7C276 CY7C276-25HC CY7C276-30JC
Text: 1CY7C276 CY7C276 16K x 16 Reprogrammable PROM Features Functional Description • 0.8-micron CMOS for optimum speed/power • High speed — 25-ns access time • 16-bit-wide words • Three programmable chip selects • Programmable output enable • 44-pin PLCC and 44-pin LCC packages
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1CY7C276
CY7C276
25-ns
16-bit-wide
44-pin
CY7C276
16K-word
16-bit
CY7C276-25JC
CY7C276-25HC
CY7C276-30JC
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AS4LC1M16
Abstract: No abstract text available
Text: AS4LC1M16 883C 1 MEG x 16 DRAM AUSTIN SEMICONDUCTOR, INC. PRELIMINARY DRAM 1 MEG x 16 DRAM 3.3V, EDO PAGE MODE, OPTIONAL EXTENDED REFRESH AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • MIL-STD 883 • SMD Planned 44/50-Pin SOJ/LCC/Gull Wing
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AS4LC1M16
44/50-Pin
450mil
024-cycle
180mW
AS4LC1M16
DS000020
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PDF
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CY7C276-25JC
Abstract: C276 CY7C276 CY7C276-25HC C2761 CY7C276-30JC c2762 C2767
Text: 1CY 7C27 6 CY7C276 16K x 16 Reprogrammable PROM Features Functional Description • 0.8-micron CMOS for optimum speed/power The CY7C276 is a high-performance 16K-word by 16-bit CMOS PROM. It is available in a 44-pin PLCC/CLCC and a 44-pin LCC packages, and is 100% reprogrammable in windowed packages. The memory cells utilize proven EPROM
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CY7C276
CY7C276
16K-word
16-bit
44-pin
25-ns
16-bit-wide
CY7C276-25JC
C276
CY7C276-25HC
C2761
CY7C276-30JC
c2762
C2767
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PDF
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MT4C1259
Abstract: No abstract text available
Text: MT4C1259 883C 256K x 1 DRAM AUSTIN SEMICONDUCTOR, INC. DRAM 256K x 1 DRAM FAST PAGE MODE AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • MIL-STD-883 18-Pin LCC 16-Pin DIP (D-2) 2 /W/E /R/A/S NC AD AZ MARKING • Timing 100ns access 120ns access
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MT4C1259
MIL-STD-883
18-Pin
150mW
256-cycle
16-Pin
MIL-STD-883
DS000015
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PDF
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66171-300
Abstract: 66171 K2710 4N49 Micropac* 66171
Text: 66171 PROTON RADIATION TOLERANT, QUAD CHANNEL, HERMETIC 20 PIN LCC, OPTICALLY COUPLED ISOLATOR OPTOELECTRONIC PRODUCTS DIVISION 04/16/2009 Features: Applications: • • • • • • • • • • • High Reliability Base lead provided for conventional transistor
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magnetic sensor circuit diagram
Abstract: differential magnetoresistive sensor HMC1052L HMC1052 "Magnetic Sensor" Designing With Magnetoresistive Sensors magnetoresistive honeywell sensor Magnetic Sensing magnetic sensor
Text: HMC1052L Advance Information SENSOR PRODUCTS 2-AXIS MAGNETIC SENSOR Features • · · · · · · Miniature 16-Pin LCC Package 3 x 3 x 0.9mm Two AMR Bridges in One Package Wide Field Range of +/- 6 Gauss 1.0 mV/V/gauss Sensitivity High Accuracy Compassing
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Original
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HMC1052L
16-Pin
HMC1052L
HMC1052
magnetic sensor circuit diagram
differential magnetoresistive sensor
"Magnetic Sensor"
Designing With Magnetoresistive Sensors
magnetoresistive
honeywell sensor
Magnetic Sensing
magnetic sensor
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PDF
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LCC 18 Pin Package
Abstract: 26PIN 26-PIN MB81C466-10 20-PIN
Text: Section 2 CMOS DRAMs — At a Glance Maximum Acc««« Tlm« n« Capacity Package Option« 262144 bits (262144wx 1b) 16-pin 18-pin Plastic Plastic DIP LCC 262144 bits (65536w x 4b) 18-pin 18-pin 20-pin 18-pin 18-pin 20-pin 26-pin Plastic Ceramic Plastic Plastic
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MB81C258-10
MB81C466-10
MB81C1000-70
MB81C1000A-60
MB81C1001-70
MB81C1001A-60
MB81C1002-70
MB81C1002A-60
MB81C4256-70
MB81C4256A-60
LCC 18 Pin Package
26PIN
26-PIN
20-PIN
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PDF
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Untitled
Abstract: No abstract text available
Text: p yp: v « *1 X X CY7C276 - 16Kx 16 Reprogrammable PROM Features Functional Description • The CY7C276 is a high-performance 16K-word by 16-bit CMOS PROM. It is available in a 44-pin PLCC/CLCC and a 44-pin LCC packages, and is 100% reprogrammable in w in
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OCR Scan
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CY7C276
CY7C276
16K-word
16-bit
44-pin
CY7C276,
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PDF
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W184-5
Abstract: D10DE
Text: CY7C273 PRELIMINARY CYPRESS SEMICONDUCTOR Features • 0.8-micron CMOS for optimum speed/ power • High speed — 40 ns access time • 16-bit-wide words • 40-pin, 600-mil-wide DIP packages • 44-pin PLCC and 44-pin LCC packages • Direct replacement for EPROMs
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OCR Scan
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CY7C273
16-bit-wide
40-pin,
600-mil-wide
44-pin
CY7C273
16K-word
16-bit
W184-5
D10DE
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PDF
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0-32k
Abstract: CERAMIC PIN GRID ARRAY 120 pins 6A14
Text: £ n jS ¡^ DPV32X16A Dense-Pac Microsystems, Inc. 0 _ 32K X 16 UVEPROM PGA MODULE PRELIMINARY DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired
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OCR Scan
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dpv32XI6A
DPV32X16A
40pin
250ns
l/OO-1/015
30a04902
0-32k
CERAMIC PIN GRID ARRAY 120 pins
6A14
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PDF
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Untitled
Abstract: No abstract text available
Text: CY7C276 PRELIMINARY CYPRESS SEMICONDUCTOR • 0.8-micron CMOS for optimum speed/ power • High speed — 25 ns access time • • • • 16-bit-wide words Three programmable chip selects Programmable output enable 44-pin PLCC and 44>pin LCC packages • 100% reprogrammable in windowed
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OCR Scan
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CY7C276
16-bit-wide
44-pin
CY7C276
CY7C276,
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PDF
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Untitled
Abstract: No abstract text available
Text: DPV64X16A Dense-Pac Microsystems, Inc. 64KX 16 UVEPROM PGA MODULE O PRELIMINARY DESCRIPTION: The DPV64X16A is a 40-pin Pin Grid Array PGA consisting of two 64K X 8 U VEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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OCR Scan
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DPV64X16A
DPV64X16A
40-pin
250ns
150ns
200ns
128KX8
64KX16
30A049-01
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PDF
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Untitled
Abstract: No abstract text available
Text: DPS8X16A Dense-Pac Microsystems, Inc. HIGH SPEED 8K X 16 CMOS SRAM PCA MODULE O PRELIMINARY DESCRIPTION: The DPS8X16A is a 40-pin Pin Grid Array PGA consisting of two 8K X 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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OCR Scan
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DPS8X16A
DPS8X16A
40-pin
150ns
30A05000
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PDF
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A54LC1M16
Abstract: S6DR AS4LC1W16
Text: DRAM 1 MEG x 16 DRAM 3.3V, EDO PAGE MODE, OPTIONAL EXTENDED REFRESH AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • MIL-STD 883 • SMD Planned 44/50-Pin SOJ/LCC/Gull Wing 450mil FEATURES • JEDEC- and industry-standard xl6 timing, functions,
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OCR Scan
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44/50-Pin
450mil
024-cycle
180mW
MIL-STD-883
AS4LC1M16
DS000020
A54LC1M16
S6DR
AS4LC1W16
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PDF
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Untitled
Abstract: No abstract text available
Text: IDT7MC4005 16 K x 16 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES: • High-density 256K CM OS static RAM module • Fast access time; 15ns max. • Low profile 36-pin sidebraze ceramic DSIP (Dual Single In line Package) • Surface mounted LCC components mounted on a co-fired
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16KX16
IDT7MC4005
36-pin
7MC4005
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a841
Abstract: 36A6
Text: DPV128X16A □PM Dense-Pac Microsystems. Inc. ^ H IG H SPEED 128K X 16 UVEPROM PGA M O D U LE PRELIMINARY DESCRIPTION: The DPV128X16A is a 40-pin Pin Grid Array PGA consisting o f tw o 128K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired
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OCR Scan
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DPV128X16A
DPV128X16A
40-pin
250ns
VoA0-A16
30A04M0
a841
36A6
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PDF
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CY7C276-25JC
Abstract: CY7C276 C2768 tCKA
Text: CY7C276 CYPRESS SEMICONDUCTOR Features • 0.8-micron CMOS for optimum speed/ power • High speed for commercial and military — 25-ns access time • • • • 16-bit-wide words Three programmable chip selects Programmable output enable 44-pin PLCC and 44-pin LCC
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OCR Scan
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CY7C276
25-ns
16-bit-wide
44-pin
CY7C276
16K-word
16-bit
CY7C276-25JC
C2768
tCKA
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PDF
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LC 7258
Abstract: No abstract text available
Text: CY7C276 CYPRESS SEMICONDUCTOR Features • 0.8-micron CMOS for optimum speed/ power • High speed for commercial and military — 25-ns access time • • • • 16-bit-wide words Three programmable chip selects Programmable output enable 44-pin PLCC and 44-pin LCC
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OCR Scan
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CY7C276
25-ns
16-bit-wide
44-pin
CY7C276
CY7C276,
44-Lead
LC 7258
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PDF
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CY7B333
Abstract: No abstract text available
Text: I UOOO. O /O U /9 U Revision: Tuesday, December 22,1992 - CY7B333B PRELIMINARY CYPRESS " SEMICONDUCTOR General-Purpose Synchronous BiCMOS PLD • Available in 28-pin, 300-mil PDIP, cerDIP, PLCC, and LCC packages • Programmable security bit Features • 16 I/O macrocells, each having:
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CY7B333B
CY7B333
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PDF
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Untitled
Abstract: No abstract text available
Text: « ~ DPV64X16A 64K X 16 UVEPROM PGA MODULE Dense-Pac Microsystems, Inc. 0 PRELIMINARY D ESC R IPT IO N : The DPV64X16A is a 40-pin Pin Grid Array (PGA consisting of two 64K X 8 U V E P R O M devices in ceramic LCC packages surface mounted on a co-fired
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OCR Scan
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DPV64X16A
DPV64X16A
40-pin
120ns
150ns
200ns
250ns
128KX8
64KX16
30A049-01
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PDF
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Untitled
Abstract: No abstract text available
Text: AS4C1259 883C 256K X 1 DRAM AUSTIN SEM IC O N D U C TO R , INC. « p DRAM 256K x 1 DRAM FAST PAGE MODE AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • MIL-STD-883 18-Pin LCC 16-Pin DIP (D-2) FEATURES • Industry standard pinout and timing
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OCR Scan
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AS4C1259
MIL-STD-883
18-Pin
16-Pin
150mW
256-cycle
S000015
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PDF
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Untitled
Abstract: No abstract text available
Text: SHM-49 □MñSL High Speed, 0.01% Hybrid Sample/Hold PRELIMINARY PRODUCT DA TA MECHANICAL DIMENSIONS FEATURES • • • • 16 MHz small signal bandwidth Small 8 pin DIP or LCC package 200 nanoseconds maximum acquisition time to 0.01% 100 nanoseconds maximum sample/hold settling time
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OCR Scan
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SHM-49
SHM-49MC
SHM-49LC
SHM-49MM
SHM-49LM
SHM-49,
02048-1194/TEL
339-3000/TLX
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PDF
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