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    MB81464-10

    Abstract: No abstract text available
    Text: Section 1 NMOS DRAMs — At a Glance Pag« Devlo* Maximum A co « m Tim« na Capacity 1-3 MBS1256-10 -12 100 120 262144 bits (262144wx 1b) -15 150 16-pin 16-pin 18-pin 18-pad Plastic Ceramic Plastic Ceramic DIP. ZIP DIP LCC LCC 1-25 MB81257-10 -12 -1 5 100


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    PDF MBS1256-10 MB81257-10 MB81464-10 262144wx 16-pin 18-pin 18-pad

    LCC 18 Pin Package

    Abstract: 26PIN 26-PIN MB81C466-10 20-PIN
    Text: Section 2 CMOS DRAMs — At a Glance Maximum Acc««« Tlm« n« Capacity Package Option« 262144 bits (262144wx 1b) 16-pin 18-pin Plastic Plastic DIP LCC 262144 bits (65536w x 4b) 18-pin 18-pin 20-pin 18-pin 18-pin 20-pin 26-pin Plastic Ceramic Plastic Plastic


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    PDF MB81C258-10 MB81C466-10 MB81C1000-70 MB81C1000A-60 MB81C1001-70 MB81C1001A-60 MB81C1002-70 MB81C1002A-60 MB81C4256-70 MB81C4256A-60 LCC 18 Pin Package 26PIN 26-PIN 20-PIN

    65536

    Abstract: No abstract text available
    Text: Section 2 BiCMOS ECL RAMs — At a Glance Pag« Davie* Maximum Accaaa Tim * <na 2-3 MBM10C490-15 15 65536 bits 65536WX 1b) 22-pin 2-13 MBM100C490-15 15 65536 bits (65536WX 1b) 22-pin Ceramic DIP, FPT 24-pad Plastic LCC 24-pad Ceramic LCC 2-23 MBM10C494-15


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    PDF MBM10C490-15 MBM100C490-15 65536WX 6384W 262144wx 5536W 22-pin 65536

    "24 pin" DRAM

    Abstract: mb81c1501
    Text: Section 3 Application Specific DRAM s — Page Devfc« Maximum Accesa Tima na 3-3 MB81461-12 -15 120 150 A t a Glance Capacity Package Options ORAM: 262144 bits (65536W x 4b) 1016 bits (256w x 4b) 24- pin Plastic DIP, ZIP SAM : 3-35 MB81461B-12 -15 120 150


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    PDF MB81461-12 MB81461B-12 5536W 262144wx4b) 512wx4b) 262144wx 93760W 293760w "24 pin" DRAM mb81c1501