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    HX640 Price and Stock

    Pulse Electronics Corporation HX6400NL

    MODULE QUAD 1GPP 1:1 SMT TU
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    DigiKey HX6400NL Tray 342 1
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    Avnet Americas HX6400NL Tube 938 10 Weeks 60
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    Mouser Electronics HX6400NL
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    Verical HX6400NL 116 2
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    Newark HX6400NL Bulk 120
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    Onlinecomponents.com HX6400NL 120
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    TTI HX6400NL Tube 120
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    Master Electronics HX6400NL 120
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    Sager HX6400NL 120
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    Pulse Electronics Corporation HX6400NLT

    MDL QUAD 1GPP 1:1 SM TR
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    DigiKey HX6400NLT Cut Tape 70 1
    • 1 $25.58
    • 10 $21.945
    • 100 $20.3746
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    HX6400NLT Digi-Reel 70 1
    • 1 $25.58
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    HX6400NLT Reel 170
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    Avnet Americas HX6400NLT Reel 10 Weeks 170
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    Mouser Electronics HX6400NLT
    • 1 $25.58
    • 10 $21.95
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    Newark HX6400NLT Reel 170
    • 1 $19.28
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    Onlinecomponents.com HX6400NLT
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    TTI HX6400NLT Reel 170
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    Lattice Semiconductor Corporation ICE40HX640-VQ100

    IC FPGA 67 I/O 100TQFP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey ICE40HX640-VQ100 Tray
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    Pulse Electronics Corporation HX6409NL

    - Trays (Alt: HX6409NL)
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    Avnet Americas HX6409NL Tray 8 Weeks 120
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    HX640 Datasheets (51)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    HX6400NL Pulse Electronics MODULE QUAD 1GPP 1:1 SMT TU Original PDF
    HX6408 Honeywell 512K x 8 STATIC RAM-SOI Original PDF
    HX6408 Honeywell 512k x 8 STATIC RAM Original PDF
    HX6408-BFM Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KBFM Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KBHM Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KBNM Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KBRN Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KEHM Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KENM Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KERN Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KQFM Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KQHN Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KQNN Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KSFN Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KSRM Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KVFM Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KVHN Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KVNN Honeywell 512K x 8 STATIC RAM- SOI Original PDF
    HX6408KVRN Honeywell 512K x 8 STATIC RAM- SOI Original PDF

    HX640 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: HX6408 Advanced Information HX6408 512k x 8 STATIC RAM The 512K x 8 Radiation Hardened Static RAM is a high The RICMOS V low power process is a SOI CMOS performance 524,288 word x 8-bit static random access technology with an 80 Å gate oxide and a minimum


    Original
    HX6408 PDF

    x-ray cmos

    Abstract: HX6409 6409D 6218 FIFO 065um capacitor enw
    Text: FIFO – HX6409/HX6218/HX6136 First-In First-Out Memory HX6409/HX6218/HX6136 The HX6409, HX6218, and HX6136 are high speed, low power, first-in first-out memories with clocked read and write interfaces. The HX6409 is a 4096-word by 9bit memory array; the HX6218 is a 2048-word by 18-bit


    Original
    HX6409/HX6218/HX6136 HX6409, HX6218, HX6136 HX6409 4096-word HX6218 2048-word 18-bit x-ray cmos 6409D 6218 FIFO 065um capacitor enw PDF

    065um

    Abstract: No abstract text available
    Text: FIFO – HX6409/HX6218/HX6136 First-In First-Out Memory HX6409/HX6218/HX6136 The HX6409, HX6218, and HX6136 are high speed, low power, first-in first-out memories with clocked read and write interfaces. The HX6409 is a 4096-word by 9bit memory array; the HX6218 is a 2048-word by 18-bit


    Original
    HX6409/HX6218/HX6136 HX6409, HX6218, HX6136 HX6409 4096-word HX6218 2048-word 18-bit 065um PDF

    HX6409

    Abstract: D1878
    Text: Aerospace Electronics FIFO—SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 µm Process (Leff = 0.65µm) • Read/Write Cycle Times <35 ns (-55° to 125°C)


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    HX6409 HX6218 HX6136 1x106 1x1014 1x109 1x1011 HX6409 D1878 PDF

    Untitled

    Abstract: No abstract text available
    Text: FIFO - HX6409/HX6218/HX6136 First-In First-Out Memory HX6409/HX6218/HX6136 The HX6409, HX6218, and HX6136 are high speed, low In addition, the three FIFOs have an output enable pin power, first-in first-out memories with clocked read and write OE and a master reset pin (MR). The read (CKR)


    Original
    HX6409/HX6218/HX6136 HX6409, HX6218, HX6136 HX6409 4096-word HX6218 2048-word 18-bit PDF

    HX6409

    Abstract: No abstract text available
    Text: Aerospace Electronics FIFO—SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 µm Process (Leff = 0.65µm) • Read/Write Cycle Times <35 ns (-55° to 125°C)


    Original
    HX6409 HX6218 HX6136 1x106 1x1014 1x109 1x1011 HX6409 PDF

    900198

    Abstract: HX6408
    Text: Aerospace Electronics Advance Information 512K x 8 STATIC RAM—SOI HX6408 FEATURES RADIATION OTHER • Fabricated with RICMOS V Silicon On Insulator SOI 0.35 µm Process (Leff = 0.28 µm) • Read/Write Cycle Times ≤ 20 ns, (3.3 V), 0 to 80°C ≤ 25 ns, (3.3 V), -55 to 125°C


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    HX6408 3x105 1X106 1x1014 1x1010 1x1012 1x10-10 900198 HX6408 PDF

    Untitled

    Abstract: No abstract text available
    Text: HX6409/HX6218/HX6136 First-In First-Out Memory The HX6409, HX6218, and HX6136 are high speed, low power, first-in first-out FIFO memories with clocked read and write interfaces. The HX6409 is a 4096-word by 9-bit memory array; the HX6218 is a 2048-word by 18-bit memory array; and the HX6136


    Original
    HX6409/HX6218/HX6136 HX6409, HX6218, HX6136 HX6409 4096-word HX6218 2048-word 18-bit HX6136 PDF

    Untitled

    Abstract: No abstract text available
    Text: HX6408 512K x 8 STATIC RAM The monolithic 512K x 8 Radiation Hardened Static RAM is a high performance 524,288 word x 8-bit static random access memory. It is fabricated with Honeywell’s radiation hardened technology. It is QML qualified and is designed for use in systems


    Original
    HX6408 710mW 40MHz ADS-14132 PDF

    NSL 32 equivalent

    Abstract: HX6408
    Text: HX6408 Advanced Information HX6408 512k x 8 STATIC RAM The 512K x 8 Radiation Hardened Static RAM is a high The RICMOS V low power process is a SOI CMOS performance 524,288 word x 8-bit static random access technology with an 80 Å gate oxide and a minimum


    Original
    HX6408 NSL 32 equivalent HX6408 PDF

    NSL 32 equivalent

    Abstract: HX6408
    Text: Aerospace Electronics Advance Information 512K x 8 STATIC RAM—SOI HX6408 FEATURES RADIATION OTHER • Fabricated with RICMOS V Silicon On Insulator SOI 0.35 µm Process (Leff = 0.28 µm) • Read/Write Cycle Times ≤ 20 ns, (3.3 V), 0 to 80°C ≤ 25 ns, (3.3 V), -55 to 125°C


    Original
    HX6408 3x105 1X106 1x1014 1x1010 1x1012 1x10-10 NSL 32 equivalent HX6408 PDF

    honeywell memory sram

    Abstract: hx6408 HXS6408
    Text: HXS6408 HXS6408 512k x 8 STATIC RAM The monolithic 512k x 8 Radiation Hardened Static RAM is a high performance 524,288 word x 8-bit static random access memory, fabricated with Honeywell’s 150nm silicon-on-insulator CMOS S150 technology. It is designed for use in low voltage systems operating


    Original
    HXS6408 150nm HXS6408 22CFR honeywell memory sram hx6408 PDF

    HX6408

    Abstract: No abstract text available
    Text: HRT6408 512K x 8 STATIC RAM The monolithic 512k x 8 Radiation Tolerant Static RAM is a high performance 524,288 word x 8-bit static random access memory, fabricated with Honeywell’s 150nm silicon-on-insulator CMOS S150 technology. It is designed for use in low


    Original
    HRT6408 150nm ADS-14194 HX6408 PDF

    Untitled

    Abstract: No abstract text available
    Text: iCE40 HX-Series Ultra Low-Power mobileFPGA™ Family R SiliconBlue December 15, 2011 1.1 Preliminary Data Sheet Figure 1: iCE40 HX-Series Family Architectural Features  HX-Series - Tablet targeted series optimized for high performance Low cost package offerings


    Original
    iCE40â iCE40 iCE65 iCEman40HX iCE40HX 15-DEC-2011) PDF

    Untitled

    Abstract: No abstract text available
    Text: Honeywell Military & Space Products HX6409 HX6218 HX6136 FIFO— SOI FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 jim Process (Leff = 0.65|am) • Read/Write Cycle Times <35 ns (-55° to 125°C)


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    HX6409 HX6218 HX6136 1x106 1x101 1x109 PDF

    Untitled

    Abstract: No abstract text available
    Text: Honeywell Military & Space Products FIFO—SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 jam Process (Leff = 0.65|im) OTHER • Read/Write Cycle Times <35 ns (-55° to 125°C)


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    HX6409 HX6218 HX6136 1x106rad 1x101 1x109 PDF

    Untitled

    Abstract: No abstract text available
    Text: Aerospace Electronics FIFO— SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 |a,m Process (Leff = 0.65|a,m) • Read/Write Cycle Times <35 ns (-55° to 125°C)


    OCR Scan
    HX6409 HX6218 HX6136 1x106rad 1x101 1x109 PDF

    HX6408

    Abstract: No abstract text available
    Text: Honeywel Advance Information Aerospace Electronics HX6408 512K x 8 STATIC RAM— SOI FEATURES RADIATION OTHER • • Read/Write Cycle Times < 20 ns, 3.3 V , 0 to 80°C < 2 5 ns, (3.3 V), -55 to 125°C Fabricated with RICMOS V Silicon On Insulator (SOI) 0.35 |a,m Process (Leff = 0.28 |a,m)


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    1x101 36-Lead HX6408 HX6408 PDF

    Untitled

    Abstract: No abstract text available
    Text: Honeywell Military & Space Products FIFO— SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 |a,m Process (Leff = 0.65|a,m) • Read/Write Cycle Times <35 ns (-55° to 125°C)


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    HX6409 HX6218 HX6136 1x106rad 1x101 1x109 PDF

    Untitled

    Abstract: No abstract text available
    Text: Honeywell Military & Space Products Preliminary FIFO—SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 n.m Process (Lelf = 0.65}im) • Read/Write Cycle Times


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    HX6409 HX6218 HX6136 1x10U 1x109 PDF

    Untitled

    Abstract: No abstract text available
    Text: Honeywell Military & Space Products FIFO— SOI HX6409 HX6218 HX6136 FEATURES • • 1 K x 36, 2 K x 18, 4 K x 9 O rganizations Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 j^m Process (Leff = 0.65|am) OTHER • R ead/W rite Cycle Tim es <35 ns (-55° to 125°C)


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    1x10srad 1x1014 1x109 1x1011 1x1010 HX6409 HX6218 HX6136 PDF

    900198

    Abstract: HX6408 si02 1a15
    Text: Honeywel Advance Information 512K x 8 STATIC RAM—SOI HX6408 FEATURES RADIATION OTHER • Fabricated with RICMOS V Silicon on Insulator SOI 0.5 |a,m Process (Leff = 0.4 |a,m) • Read/Write Cycle Times < 2 5 ns (-55 to 125°C) • Total Dose Hardness >5x105rad(S i02)


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    5x105rad 1x109 1x101 40-Lead HX6408 900198 HX6408 si02 1a15 PDF

    NSL 32 equivalent

    Abstract: AVW smd AVW smd transistor
    Text: Honeywell Aerospace Electronics Advance Information 512K x 8 STATIC RAM—SOI HX6408 FEATURES RADIATION OTHER • • Read/Write Cycle Times < 20 ns, 3.3 V , 0 to 80°C < 25 ns, (3.3 V), -55 to 125°C Fabricated with RICMOS V Silicon On Insulator (SOI) 0.35 [im Process (Left = 0.28 |im)


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    36-Lead HX6408 5x105rad 1x101 NSL 32 equivalent AVW smd AVW smd transistor PDF

    RCA SK CROSS-REFERENCE

    Abstract: CD4003 2N2505 TF408 1N4465 250PA120 2N3017 pt 3570 trw rf pa189 Semicon volume 1
    Text: 1969 o < 00 x ic e uo <r\ *—4 rO O CM u J 'r < o o o CO r aJ. rfrr.~> y -< z X— < P“ -J Sem iconductor Annual At .0008" Dia. . . . there is no second source phire orifice insert. Tempress also created and supplied the tungsten carbide ultrasonic bonding tool and pioneered


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    PDF