CQ208
Abstract: PQFP208 MEB2 SY-PQ208-1
Text: EIA Standard Board Layout of Soldered Pad for QFP Devices Md e e e Ze Me b2 e I2 Zd Board Layout Soldered Pads Dimension for both CQ208 and PQ208 and prototype socket packages: (note: The following recommended dimension will take PQFP208, Prototype socket and CQ208 package
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CQ208
PQ208
PQFP208,
PQ/RQ208/CQ208*
SY-PQ208-1
PQFP208
MEB2
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MLCC CRACK
Abstract: CRACK mlcc mlcc soldering
Text: 4/25/00 70 Maxess Road ! Melville, New York 11747 631 396-7500 ! Fax (631) 396-7575 http:www.niccomp.com Technical Inquiries: tpmg@niccomp.com MECHANICAL FLEXURE CRACKING PRODUCTS: SMT CERAMIC CHIP CAPACITORS SERIES: NMC, NMC-E & NMC-H THE MOST COMMON CAUSE OF CERAMIC CHIP CAPACITOR FAILURE IS “SHORTED” – “LOW
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CB228
Abstract: F 115 025 CB-228 CB100 CB164 Fancort Industries
Text: CB PACKAGE TYPICAL FORM SPECIFICATION TABLE OPTION 1 FORM - LID FACING UP PITCH INCH LEADS/SIDE LEADS-TOTAL OPTION 2 FORM - LID FACING DOWN CB228 CB196 CB164 CB100 CB228 CB196 CB164 CB100 LID UP LID UP LID UP LID UP LID DOWN LID DOWN LID DOWN LID DOWN 0.025
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CB228
CB196
CB164
CB100
37ils)
CB228
F 115 025
CB-228
CB100
CB164
Fancort Industries
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PQ144
Abstract: PQ100 ACTEL qfp 352 SY-PQ208-2 TQ144
Text: EIA Standard Board Layout of Soldered Pad for QFP Devices Md e e e Ze Me b2 e I2 Zd Table 1 contains the board layout soldered pad dimensions for Actel Quad Flat Packs only. If you are using surface mount sockets for prototyping, see table 2 for layout dimensions.
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PQ100
PQ144
PQ1603
TQ144
TQ176
PQ144
CQ208
PQ208
ACTEL qfp 352
SY-PQ208-2
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SY-PQ208-2
Abstract: ACTEL qfp 352 CQ256 CQ208 SI-SX72-ACQ256SFG484 pq208 package SI-SX72ACQ256SFG484
Text: EIA Standard Board Layout of Soldered Pad for QFP Devices Md e e e Ze Positioning pin holes Z Me e b2 I2 Zd Table 1 contains the board layout soldered pad dimensions for Actel Quad Flat Packs only. If you are using surface mount sockets for prototyping, see table 2 for layout dimensions.
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PQ100
PQ144
PQ1603
TQ144
CQ208
PQ208
CQ208,
PQ208,
SY-PQ208-2
ACTEL qfp 352
CQ256
SI-SX72-ACQ256SFG484
pq208 package
SI-SX72ACQ256SFG484
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RT54SX72SCQ208
Abstract: CQ208 AC195 SY-PQ208-2 A54SX72A-PQ208 ACTEL CCGA to FBGA Adapter RT54SX32SCQ208 RT54SX32S-CQ208 FG484 A54SX32APQ
Text: Application Note AC195 Prototyping for the RTSX-S Enhanced Aerospace FPGA Introduction Actel provides radiation-tolerant FPGAs for space applications. However, since the enhanced environmental properties of radiation tolerant devices are not required during prototyping, inexpensive
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AC195
RT54SX72SCQ208
CQ208
AC195
SY-PQ208-2
A54SX72A-PQ208
ACTEL CCGA to FBGA Adapter
RT54SX32SCQ208
RT54SX32S-CQ208
FG484
A54SX32APQ
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54SXA
Abstract: DF1 Pinout A54SX32A SEU RT54SX-S
Text: Application Note Prototyping for the RT54SX-S Enhanced Aerospace FPGA Actel provides radiation tolerant FPGA devices for use in Aerospace applications. However, since the enhanced environmental properties of radiation tolerant devices are not required during prototyping, an inexpensive
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RT54SX-S
54SXA
DF1 Pinout
A54SX32A SEU
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Untitled
Abstract: No abstract text available
Text: Y p o n q n o Military Logic Cell Array Product Specification. See Note 1. F E A TU R ES Part Number • M IL-S T D -883 Class B Processing. Complies with paragraph 1.2.1 • Field-programmable gate array XC3090 Logic Capacity gates 9000 Configurable
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XC3090
TSC0097
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Untitled
Abstract: No abstract text available
Text: YPQfiQflR K Military Logic Cell Array Product Specification. S e e Note 1. FEATURES Part Number • M IL-S T D -883 Class B Processing. Complies with paragraph 1.2.1 • Field-programmable gate array • Low power CMOS static memory technology Logic Capacity
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XC3090
TSC0097
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Untitled
Abstract: No abstract text available
Text: XC3020B Military Logic Ceil Array Product Specification. S ee Note 1. FEA TU R ES Part Number Logic Capacity gates Configurable Logic Blocks User l/Os XC3020 2000 64 64 • M IL-S T D -883 Class B Processing. Complies with paragraph 1.2.1 • Field-programmable gate array
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XC3020B
XC3020
TSC0085
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Untitled
Abstract: No abstract text available
Text: Y p o n o n o H XILINX Military Logic Cell Array Product Specification. See Note 1. FEATURES Part Number Logic ConflgCapacity urable gates Logic Blocks User I/Os XC3090 9000 144 • MIL-STD-883 Class B Processing. Complies with paragraph 1.2.1 • Field-programmable gate array
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XC3090
MIL-STD-883
TSC0097
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Untitled
Abstract: No abstract text available
Text: XC3042B Military Logic Cell Array Product Specification. See Note 1. FEATURES Part Number • MIL-STD-883 Class B Processing. Complies with paragraph 1.2.1 • Field-programmable gate array XC3042 • Low power CMOS static memory technology Logic Capacity
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XC3042B
MIL-STD-883
XC3042
TSC0117
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XC3042B
Abstract: XC3042-PG84 Enplas fpq Enplas 64 pin
Text: XC3042B Military Logic Cell "Array Product Specification. See Note 1. FEATURES Part Number Logic Capacity gates XC3042 4200 • MIL-STD-883 Class B Processing. Complies with paragraph 1.2.1 • Field-programmable gate array • Low power CMOS static memory technology
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XC3042B
MIL-STD-883
TSC0117
XC3042-PG84
Enplas fpq
Enplas 64 pin
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Untitled
Abstract: No abstract text available
Text: XC3000 Logic Celi “Array Family Product Specification FEATURES The LCA user logic functions and interconnections are determined by the configuration program data stored in internal static memory cells. The program can be loaded in any of several modes to accommodate various system
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XC3000
XC1736
XC2000
XC3000
XC3020-70PC68C
XC2018
XC3020
PGA68,
PGA84
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