ANSYS 12 Search Results

Contextual Info: Computer modeling of transport phenomena in RF ablation applicator Adriana Druma, PhD Aavid Thermalloy 1 2015 ANSYS, Inc. April 20, 2015 ANSYS Confidential Company information Aavid is a privately held company, founded in 1964 as Aavid Engineering Aavid has been the world leader in thermal management solutions and partner of choice for electronics

IRF830

Contextual Info: IRF830 Iß ANSYS Power Field Effect Tïansistor aiCTRomcs LIMITED N-Channel Enhancement Mode • Silicon Gate for Fast Switching Speeds • Low R d s oii to Minimize On-Losses, Specified at Elevated Temperature • Rugged — SO A is Power Dissipation Limited

BDX54

Abstract: BDX54C BDX54 circuit BDX53 BDX53A BDX53B BDX53C BDX54A BDX54B
Contextual Info: c i h ANSYS BDX54, BDX54A, BDX54B, BDX54C PNP SILICON POWER DARLINGTONS m C TR O M C S LIMITED • Designed for Complementary Use with BDX53, BDX53A, BDX53B and BDX53C • 60 W at 25°C Case Temperature • 8 A Continuous Collector Current TO-220 PACKAGE TOP VIEW

SC2092-400-15

Abstract: SC2092-600-15
Contextual Info: íh ANSYS QP OftQO QFRIFQ m CTRO M CS SILICON CONTROLLED RECTIFIERS L I M I T E D LP PACKAGE TOP VIEW 2 A Continuous On-State Current 15 A Surge-Current G Glass Passivated Wafer A K 400 V to 600 V Off-State Voltage Max lGT of 200 |jA LP PACKAGE WITH FORMED LEADS

sun* sparcstation 20

Abstract: HP 9000 A500 Motherboard dell precision 690 Accelgraphics aic-7880 ansys TD-400 pentium pro memory management indigo mechanical engineering project
Contextual Info: Pentium Pro Processor Workstation Performance Brief June 1997 Order Number: 242999-003 Pentium Pro Processor Workstation Performance Brief Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or

Contextual Info: Freescale Semiconductor Application Note Document Number: AN4473 Rev. 1.0, 9/2012 Compact Thermal Model for Dual 24 V High Side Switch Family 1 Introduction This application note describes the R/C thermal models of the MC06XS4200, MC10XS4200, and MC20XS4200 devices.

Motherboard dell precision 690

Abstract: aic-7880 RS6000 ibm 478 motherboard HP 9000 A500 Motherboard dell seagate logic board seagate hard disks seagate ST15150N Accelgraphics
Contextual Info: Pentium Pro Processor Workstation Performance Brief September 1996 Order Number: 242999-001 Pentium Pro Processor Workstation Performance Brief Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or

ansys darveaux

Abstract: JXA8900R IPACK2005-73239 pitarresi 53RD IPACK2005 Ansys led 5800-LV SMD 5AG A333
Contextual Info: Proceedings of IPACK2005 Proceedings of IPACK2005 ASME InterPACK '05 ASME InterPACK July 17-22, San Francisco, California,'05 USA July 17-22, San Francisco, California, USA IPACK2005-73239 IPACK2005-73239 Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD

ansys darveaux

Abstract: pitarresi ansys optimization BGA Ball Crack 8L-10L
Contextual Info: Solder Joint Reliability Model with Modified Darveaux’s Equations for the micro SMD Wafer Level-Chip Scale Package Family L. Zhang, R. Sitaraman*, V. Patwardhan, L. Nguyen, and N. Kelkar National Semiconductor Corporation 3707 Tahoe Way, M/S 19-100 Santa Clara, CA 95051

Contextual Info: Quick Reference Guide High Speed Backplane Interconnect Solutions The emergence of faster data rates, and decreasing signal rise times, requires better performing, high speed connectors. TE Connectivity’s broad portfolio of high speed backplane connectors provides system designers the flexibility they require to solve their

BUSBAR calculation

Abstract: BUSBAR calculation datasheet rogers busbar Ansys led A copper busbar voltage drop i300a busbar design ansys BUSBAR Fz2400
Contextual Info: Thermal Properties of Power Terminals in High Power IGBT Modules A. Cosaert1, M. Beulque1, M. Wölz2, O. Schilling2, H. Sandmann2, R. Spanke2, K. Appelhoff2 1 2 Rogers NV, Gent, Belgium eupec GmbH, Warstein, Germany Abstract Power dissipation in the leads of IGBT modules has to be taken into account for modern inverter design. This is

intel+Socket+775+pinout

Abstract: MEGTRON 6
Contextual Info: Design Guidelines for 100 Gbps - CFP2 Interface 2014.01.16 AN-684 Subscribe Send Feedback This document shows an example layout design that implements a 4 x 25/28 Gbps CFP2 module interface that meets the insertion and return loss mask requirements proposed in the working clause draft version

ansys optimization

Abstract: ansys economic industry and company analysis NEC Systems computer engineering msc diode ansys cfd hp inkjet chip
Contextual Info: Manufacturing Industry Solutions on HPC Platforms Dr. Paresh G. Pattani Vice President NEC Systems, Inc. Overview l HPC Solutions for Manufacturing Industry l NEC HPC Platforms Offerings l Intel Itanium processor- based NEC server AzusA l ISV Applications Enabling Plans

alutronic

Abstract: ikcs22f60 IKCS22F60xx igbt subcircuit IGBT1 infineon
Contextual Info: Application Note, V1.1, September 2008 Control integrated Power System CIPOS Thermal Performance of the IKCS22F60xx AN-CIPOS-2 Author: P. Türkes http://www.infineon.com/CIPOS Power Management & Drives N e v e r s t o p t h i n k i n g Control integrated Power System (CIPOS™)

Altera Flip Chip BGA warpage

Abstract: thick bga die size crack flip chip ajinomoto Flip Chip Substrate DSASW0010612 ansys BGA cte underfill with or without underfill
Contextual Info: Accurate Predictions of Flip Chip BGA Warpage Yuan Li Altera Corporation 101 Innovation Dr, M/S 4202 San Jose, CA 95134 ysli@altera.com, 408 544-7508 Abstract Organic flip chip BGA has been quickly adopted as the mainstream package solution for high speed, high density and

CY27S03A

Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
Contextual Info: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability

CY7C9101

Abstract: CY7C510 CY7C190 cy7c189 G30-88 CY7c910 EA 9394 cy3341 CY6116 cy7c901
Contextual Info: fax id: 8511 Thermal Management Thermal Management and Component Reliability One of the key variables determining the long-term reliability of an integrated circuit is the junction temperature of the device during operation. Long-term reliability of the semiconductor chip degrades proportionally with increasing temperatures following an exponential function described by the

V3300

Abstract: V3400 V5200 V7200 V7350 7811 world
Contextual Info: 7811 FireGLV3300DS v2 5/10/06 10:45 AM Page 1 Entry-Level | 128MB • Powered by ATI’s next generation FireGL graphics processor unit with Avivo™ Technology • Scalable ultra-threaded architecture with 2 Parallel Geometry Engines and 4 Pixel Shader Processors

Rotary Power Generators

Abstract: rotating rectifier ansys bridge rectifier 500a, 217F 600V300A full wave rectifier 1 PHASE
Contextual Info: Rotary Power Generators Sensitron • 221 West Industry Court · Deer Park, NY 11729-4681 · Phone 631 586 7600 · Fax (631) 242 9798 · World Wide Web - www.sensitron.com · E-mail - sales@sensitron.com 148-1007 Rotating Rectifier Assemblies Sensitron www.sensitron.com/rotating.asp

LD-CU3536AF

Abstract: photometric data lamps hanging pendant Ansys led indoor ceiling fixture Cree optics pendant incandescent luminaire pendant
Contextual Info: Cree XLamp MP-L EasyWhite Pendant Luminaire Reference Design Application Note This application note demonstrates a remarkably simple way to incorporate the Cree XLamp® MP-L EasyWhite™ LED into a pendant light, a popular hanging luminaire that has traditionally used A-form incandescent bulbs and

ansys

Abstract: tyra 2.5mm DC power jack Ansys led
Contextual Info: Cree XLamp® MP-L EasyWhite Referenzdesign für Pendelleuchten Anwendungsempfehlung Die vorliegende Anwendungsempfehlung zeigt eine denkbar simple Methode zur Integration der Cree XLamp® MP-L EasyWhite™ LED in eine Pendelleuchte, eine beliebte Hängelampe, bei der traditionell A-Lampen

underfill

Abstract: cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate
Contextual Info: Reliability Study of High-Pin-Count Flip-Chip BGA Yuan Li, John Xie, Tarun Verma and Vincent Wang Altera Corp. 101 Innovation Drive, San Jose, CA 95134 ysli@altera.com Abstract A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package

ansys

Abstract: ansys optimization WIN32 pentium "II Xeon" ON733 Pentium II Xeon cosmos 2000
Contextual Info: Intel Corporate Standard for On-screen presentations. Math Kernel Library Intel Corporation November, 1999 Copyright 1999, Intel Corporation. All rights reserved. G-Number The Math Kernel Library MKL has been developed by Intel as part of its emphasis on tools (compilers, VTune analyzer) and libraries which

V5200

Abstract: ATI FireGL V5200 dvi dual link V3300 V3400 V7200 V7350 maxon ati shader v5200 ati
Contextual Info: 7809 FireGLV5200DS v2 5/8/06 11:34 AM Page 1 Mid-Range | 256MB • Powered by ATI’s next generation FireGL graphics processor unit with Avivo™ Technology • Scalable ultra-threaded architecture with 5 Parallel Geometry Engines and 12 Pixel Shader Processors