ANSYS 12 Search Results

ANSYS 12 Result Highlights (5)

Part	Manufacturer	Description
FLAC1000	Amphenol Communications Solutions	FLA Shorting Cap NEMA ANSI C136.41, Shorting Contacts
FLBC70354001	Amphenol Communications Solutions	FLB Dome, NEMA ANSI C136.41, 76mm, 35mm Height, Black
FLBC70602001	Amphenol Communications Solutions	FLB Dome, NEMA ANSI C136.41, 76mm, 60mm Height, Clear
FLBC70756001	Amphenol Communications Solutions	FLB Dome, NEMA ANSI C136.41, 76mm, 75mm Height, Translucent
FLBC70134001	Amphenol Communications Solutions	FLB Dome, NEMA ANSI C136.41, 76mm, 130mm Height, Black

ANSYS 12 Price and Stock

Filter by Manufacturer


3M X5004X-ANSI
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	X5004X-ANSI					1 $421.69 10 $409.13 100 $409.13 1000 $409.13 10000 $409.13	Buy Now
3M U5B-ANSI
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	U5B-ANSI					1 $171.43 10 $163.83 100 $163.83 1000 $163.83 10000 $163.83	Buy Now
3M X5012VX-ANSI
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	X5012VX-ANSI					1 $421.69 10 $409.13 100 $409.13 1000 $409.13 10000 $409.13	Buy Now
3M X5004VX-ANSI
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	X5004VX-ANSI					1 $421.69 10 $409.13 100 $409.13 1000 $409.13 10000 $409.13	Buy Now
3M X5005VX-ANSI
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	X5005VX-ANSI					1 $421.69 10 $409.13 100 $409.13 1000 $409.13 10000 $409.13	Buy Now

Find more ANSYS 12 price and stock on Findchips.com

ANSYS 12 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: Computer modeling of transport phenomena in RF ablation applicator Adriana Druma, PhD Aavid Thermalloy 1 2015 ANSYS, Inc. April 20, 2015 ANSYS Confidential Company information Aavid is a privately held company, founded in 1964 as Aavid Engineering Aavid has been the world leader in thermal management solutions and partner of choice for electronics	Original		PDF
sun* sparcstation 20 Abstract: HP 9000 A500 Motherboard dell precision 690 Accelgraphics aic-7880 ansys TD-400 pentium pro memory management indigo mechanical engineering project Text: Pentium Pro Processor Workstation Performance Brief June 1997 Order Number: 242999-003 Pentium Pro Processor Workstation Performance Brief Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or	Original	com/r5000/R5000 sun* sparcstation 20 HP 9000 A500 Motherboard dell precision 690 Accelgraphics aic-7880 ansys TD-400 pentium pro memory management indigo mechanical engineering project	PDF
Untitled Abstract: No abstract text available Text: Freescale Semiconductor Application Note Document Number: AN4473 Rev. 1.0, 9/2012 Compact Thermal Model for Dual 24 V High Side Switch Family 1 Introduction This application note describes the R/C thermal models of the MC06XS4200, MC10XS4200, and MC20XS4200 devices.	Original	AN4473 MC06XS4200, MC10XS4200, MC20XS4200 16-bit STR0326182960	PDF
Motherboard dell precision 690 Abstract: aic-7880 RS6000 ibm 478 motherboard HP 9000 A500 Motherboard dell seagate logic board seagate hard disks seagate ST15150N Accelgraphics Text: Pentium Pro Processor Workstation Performance Brief September 1996 Order Number: 242999-001 Pentium Pro Processor Workstation Performance Brief Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or	Original	com/r5000/R5000 Motherboard dell precision 690 aic-7880 RS6000 ibm 478 motherboard HP 9000 A500 Motherboard dell seagate logic board seagate hard disks seagate ST15150N Accelgraphics	PDF
ansys darveaux Abstract: JXA8900R IPACK2005-73239 pitarresi 53RD IPACK2005 Ansys led 5800-LV SMD 5AG A333 Text: Proceedings of IPACK2005 Proceedings of IPACK2005 ASME InterPACK '05 ASME InterPACK July 17-22, San Francisco, California,'05 USA July 17-22, San Francisco, California, USA IPACK2005-73239 IPACK2005-73239 Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD	Original	IPACK2005 IPACK2005-73239 ansys darveaux JXA8900R IPACK2005-73239 pitarresi 53RD IPACK2005 Ansys led 5800-LV SMD 5AG A333	PDF
ansys darveaux Abstract: pitarresi ansys optimization BGA Ball Crack 8L-10L Text: Solder Joint Reliability Model with Modified Darveaux’s Equations for the micro SMD Wafer Level-Chip Scale Package Family L. Zhang, R. Sitaraman*, V. Patwardhan, L. Nguyen, and N. Kelkar National Semiconductor Corporation 3707 Tahoe Way, M/S 19-100 Santa Clara, CA 95051	Original		PDF
Untitled Abstract: No abstract text available Text: Quick Reference Guide High Speed Backplane Interconnect Solutions The emergence of faster data rates, and decreasing signal rise times, requires better performing, high speed connectors. TE Connectivity’s broad portfolio of high speed backplane connectors provides system designers the flexibility they require to solve their	Original		PDF
BUSBAR calculation Abstract: BUSBAR calculation datasheet rogers busbar Ansys led A copper busbar voltage drop i300a busbar design ansys BUSBAR Fz2400 Text: Thermal Properties of Power Terminals in High Power IGBT Modules A. Cosaert1, M. Beulque1, M. Wölz2, O. Schilling2, H. Sandmann2, R. Spanke2, K. Appelhoff2 1 2 Rogers NV, Gent, Belgium eupec GmbH, Warstein, Germany Abstract Power dissipation in the leads of IGBT modules has to be taken into account for modern inverter design. This is	Original		PDF
intel+Socket+775+pinout Abstract: MEGTRON 6 Text: Design Guidelines for 100 Gbps - CFP2 Interface 2014.01.16 AN-684 Subscribe Send Feedback This document shows an example layout design that implements a 4 x 25/28 Gbps CFP2 module interface that meets the insertion and return loss mask requirements proposed in the working clause draft version	Original	AN-684 CEI-28G-VSR. CEI-28G-VSR transcei-28G-VSR intel+Socket+775+pinout MEGTRON 6	PDF
ansys optimization Abstract: ansys economic industry and company analysis NEC Systems computer engineering msc diode ansys cfd hp inkjet chip Text: Manufacturing Industry Solutions on HPC Platforms Dr. Paresh G. Pattani Vice President NEC Systems, Inc. Overview l HPC Solutions for Manufacturing Industry l NEC HPC Platforms Offerings l Intel Itanium processor- based NEC server AzusA l ISV Applications Enabling Plans	Original	Express5800, ansys optimization ansys economic industry and company analysis NEC Systems computer engineering msc diode ansys cfd hp inkjet chip	PDF
alutronic Abstract: ikcs22f60 IKCS22F60xx igbt subcircuit IGBT1 infineon Text: Application Note, V1.1, September 2008 Control integrated Power System CIPOS Thermal Performance of the IKCS22F60xx AN-CIPOS-2 Author: P. Türkes http://www.infineon.com/CIPOS Power Management & Drives N e v e r s t o p t h i n k i n g Control integrated Power System (CIPOS™)	Original	IKCS22F60xx alutronic ikcs22f60 IKCS22F60xx igbt subcircuit IGBT1 infineon	PDF
Untitled Abstract: No abstract text available Text: High Voltage RF LDMOS Technology for Broadcast Applications S.J.C.H. Theeuwen, W.J.A.M. Sneijers, J.G.E. Klappe, J.A.M. de Boet NXP Semiconductors, Gerstweg 2, 6534 AE, Nijmegen, The Netherlands steven.theeuwen@nxp.com, walter.sneyers@nxp.com, jos.klappe@nxp.com, jan.de.boet@nxp.com	Original	0-50V) 00-500W IEDM2006,	PDF
Altera Flip Chip BGA warpage Abstract: thick bga die size crack flip chip ajinomoto Flip Chip Substrate DSASW0010612 ansys BGA cte underfill with or without underfill Text: Accurate Predictions of Flip Chip BGA Warpage Yuan Li Altera Corporation 101 Innovation Dr, M/S 4202 San Jose, CA 95134 ysli@altera.com, 408 544-7508 Abstract Organic flip chip BGA has been quickly adopted as the mainstream package solution for high speed, high density and	Original		PDF
CY27S03A Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide Text: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability	Original	CY7C122 CY27S03A 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide	PDF

V3300 Abstract: V3400 V5200 V7200 V7350 7811 world Text: 7811 FireGLV3300DS v2 5/10/06 10:45 AM Page 1 Entry-Level \| 128MB • Powered by ATI’s next generation FireGL graphics processor unit with Avivo™ Technology • Scalable ultra-threaded architecture with 2 Parallel Geometry Engines and 4 Pixel Shader Processors	Original	FireGLV3300DS 128MB 128MB 10-bit 16-bit V3300 V3400 V5200 V7200 V7350 7811 world	PDF
Rotary Power Generators Abstract: rotating rectifier ansys bridge rectifier 500a, 217F 600V300A full wave rectifier 1 PHASE Text: Rotary Power Generators Sensitron • 221 West Industry Court · Deer Park, NY 11729-4681 · Phone 631 586 7600 · Fax (631) 242 9798 · World Wide Web - www.sensitron.com · E-mail - sales@sensitron.com 148-1007 Rotating Rectifier Assemblies Sensitron www.sensitron.com/rotating.asp	Original	160oC Rotary Power Generators rotating rectifier ansys bridge rectifier 500a, 217F 600V300A full wave rectifier 1 PHASE	PDF
LD-CU3536AF Abstract: photometric data lamps hanging pendant Ansys led indoor ceiling fixture Cree optics pendant incandescent luminaire pendant Text: Cree XLamp MP-L EasyWhite Pendant Luminaire Reference Design Application Note This application note demonstrates a remarkably simple way to incorporate the Cree XLamp® MP-L EasyWhite™ LED into a pendant light, a popular hanging luminaire that has traditionally used A-form incandescent bulbs and	Original	CLD-AP40 LD-CU3536AF photometric data lamps hanging pendant Ansys led indoor ceiling fixture Cree optics pendant incandescent luminaire pendant	PDF
ansys Abstract: tyra 2.5mm DC power jack Ansys led Text: Cree XLamp® MP-L EasyWhite Referenzdesign für Pendelleuchten Anwendungsempfehlung Die vorliegende Anwendungsempfehlung zeigt eine denkbar simple Methode zur Integration der Cree XLamp® MP-L EasyWhite™ LED in eine Pendelleuchte, eine beliebte Hängelampe, bei der traditionell A-Lampen	Original	CLD-AP40 ansys tyra 2.5mm DC power jack Ansys led	PDF
underfill Abstract: cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate Text: Reliability Study of High-Pin-Count Flip-Chip BGA Yuan Li, John Xie, Tarun Verma and Vincent Wang Altera Corp. 101 Innovation Drive, San Jose, CA 95134 ysli@altera.com Abstract A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package	Original	12x10-6 17x10-6 6x10-6 underfill cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate	PDF
ansys Abstract: ansys optimization WIN32 pentium "II Xeon" ON733 Pentium II Xeon cosmos 2000 Text: Intel Corporate Standard for On-screen presentations. Math Kernel Library Intel Corporation November, 1999 Copyright 1999, Intel Corporation. All rights reserved. G-Number The Math Kernel Library MKL has been developed by Intel as part of its emphasis on tools (compilers, VTune analyzer) and libraries which	Original		PDF
V5200 Abstract: ATI FireGL V5200 dvi dual link V3300 V3400 V7200 V7350 maxon ati shader v5200 ati Text: 7809 FireGLV5200DS v2 5/8/06 11:34 AM Page 1 Mid-Range \| 256MB • Powered by ATI’s next generation FireGL graphics processor unit with Avivo™ Technology • Scalable ultra-threaded architecture with 5 Parallel Geometry Engines and 12 Pixel Shader Processors	Original	FireGLV5200DS 256MB 256MB 256-bit 10-bit 16-bit V5200 ATI FireGL V5200 dvi dual link V3300 V3400 V7200 V7350 maxon ati shader v5200 ati	PDF
IRF830 Abstract: No abstract text available Text: IRF830 Iß ANSYS Power Field Effect Tïansistor aiCTRomcs LIMITED N-Channel Enhancement Mode • Silicon Gate for Fast Switching Speeds • Low R d s oii to Minimize On-Losses, Specified at Elevated Temperature • Rugged — SO A is Power Dissipation Limited	OCR Scan	IRF830 IRF830	PDF
BDX54 Abstract: BDX54C BDX54 circuit BDX53 BDX53A BDX53B BDX53C BDX54A BDX54B Text: c i h ANSYS BDX54, BDX54A, BDX54B, BDX54C PNP SILICON POWER DARLINGTONS m C TR O M C S LIMITED • Designed for Complementary Use with BDX53, BDX53A, BDX53B and BDX53C • 60 W at 25°C Case Temperature • 8 A Continuous Collector Current TO-220 PACKAGE TOP VIEW	OCR Scan	BDX54, BDX54A, BDX54B, BDX54C T0-220 BDX53, BDX53A, BDX53B BDX53C BDX54 BDX54C BDX54 circuit BDX53 BDX53A BDX53C BDX54A BDX54B	PDF
SC2092-400-15 Abstract: SC2092-600-15 Text: íh ANSYS QP OftQO QFRIFQ m CTRO M CS SILICON CONTROLLED RECTIFIERS L I M I T E D LP PACKAGE TOP VIEW 2 A Continuous On-State Current 15 A Surge-Current G Glass Passivated Wafer A K 400 V to 600 V Off-State Voltage Max lGT of 200 \|jA LP PACKAGE WITH FORMED LEADS	OCR Scan	SC2092-400-15 SC2092-600-15	PDF

ANSYS 12 Search Results

ANSYS 12 Result Highlights (5)

ANSYS 12 Price and Stock

3M X5004X-ANSI

3M U5B-ANSI

3M X5012VX-ANSI

3M X5004VX-ANSI

3M X5005VX-ANSI

ANSYS 12 Datasheets Context Search

Untitled

sun* sparcstation 20

Untitled

Motherboard dell precision 690

ansys darveaux

ansys darveaux

Untitled

BUSBAR calculation

intel+Socket+775+pinout

ansys optimization

alutronic

Untitled

Altera Flip Chip BGA warpage

CY27S03A

V3300

Rotary Power Generators

LD-CU3536AF

ansys

underfill

ansys

V5200

IRF830

BDX54

SC2092-400-15