jsm 5800
Abstract: 5800-LV 1200C JEOL SEM Ishida scale Cu6Sn5
Text: The Anomalous Microstructural, Tensile and Aging Response of Thin Cast Sn3.9Ag0.6Cu Lead Free Solder Qiang Xiao,1 Luu Nguyen,2 William D. Armstrong1,3 1. Department of Mechanical Engineering, University of Wyoming, Laramie, WY 82071. 2. National Semiconductor Corporation, Santa Clara, CA 95052. 3. Email: wda@uwyo.edu
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as-1200C
1200C.
as-1800C
1800C.
jsm 5800
5800-LV
1200C
JEOL SEM
Ishida scale
Cu6Sn5
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sac 405
Abstract: WLCSP flip chip IPACK2005 sensors mttf WLCSP chip mount SAC405 thetaja wlcsp "sac 405"
Text: The Effect of Electromigration on Eutectic SnPb and Pb-free Solders in Wafer Level-Chip Scale Packages Joanne Huang1, Stephen Gee2, Luu Nguyen2, King-Ning Tu1 1 Department of Materials Science and Engineering, University of California - Los Angeles, Los Angeles,
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IPACK200573417.
sac 405
WLCSP flip chip
IPACK2005
sensors mttf
WLCSP chip mount
SAC405
thetaja wlcsp
"sac 405"
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AN-1187
Abstract: SAC405 JESD22-B111 MO-220 MO-229 SAC305 2L SOT23-5 AN1187 nsmd smd JEDEC SMT reflow profile
Text: ご注意：この日本語アプリケーション・ノートは参考資料として提供しており内容 が最新でない場合があります。製品のご検討およびご採用に際しては、必ず 最新の英文アプリケーション・ノートをご確認ください。
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AN-1187
AN-1187
SAC405
JESD22-B111
MO-220
MO-229
SAC305
2L SOT23-5
AN1187
nsmd smd
JEDEC SMT reflow profile
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screen emulsion
Abstract: P8002355 P8002392 63Sn37Pb
Text: Application Note Soldering Guidelines for Module PCB Mounting Rev 14 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers general guidelines for PCB second level interconnect design when assembling with ANADIGICS’ module products.
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pcb warpage in ipc standard
Abstract: IPC-9701A SAC405 IPC-9702 BGA PACKAGE thermal resistance Freescale ipc 9702 945 motherboard circuit semiconductor cross reference "IPC 1752" gold SAC387
Text: Q2, 2010 Flip Chip Plastic Ball Grid Array FC-PBGA Application Note Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm Off. All other product or service names are the property of their respective owners. 2010 Freescale Semiconductor, Inc.
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2850KT
Abstract: 2850MT 1200 RTV 1N5550 1N6515 2850FT RTV-615 scotchcast epoxy potting material diode with piv of 40v
Text: APPENDIX B Diode Thermal Analysis Controlling junction temperature is key to reliable semiconductor package design. High voltage diodes present unique junction temperature problems which must be addressed. In high voltage diodes, heat is generated primarily by:
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1N6515
1N5550
2850KT
2850MT
1200 RTV
1N5550
1N6515
2850FT
RTV-615
scotchcast epoxy
potting material
diode with piv of 40v
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Untitled
Abstract: No abstract text available
Text: General Multilayer Ceramic Capacitors MLCC is an electronic part that temporarily stores an electrical charge and the most prevalent type of capacitor today. New technologies have enabled the MLCC manufacturers to follow the trend dictated by smaller and smaller electronic devices such as Cellular telephones, Computers, DSC, DVC
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CL31A
Abstract: CL05A CL10B104KB8
Text: June 2009 Passive components Sales Office ● Head Office 206, Cheomdansaneop Road, Youngtong-gu, Suwon, Kyonggi Province 443- 743, Korea Europe Te l: +82-31-210 -6328 E-mail:james.pyun@samsung.com America Te l: +82- 31- 210 - 6794 E-mail:randy.kim@samsung.com
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kevin0130
CL31A
CL05A
CL10B104KB8
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MP 7721
Abstract: IEC6068-2-58 IPC 7351/7355 IPC-7351 to252 IPC 7355 JESD22-A111 JEDEC-J-STD-20 JESD22B-102 MICA WAFER J-STD-033
Text: Additional Information, DS1, March 2008 Recommendations for Assembly of Infineon TO Packages Edition 2008-03 Published by Infineon Technologies AG 81726 München, Germany 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or
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IPC/EIA/JEDEC-J-STD-001
J-STD-033/-020
JESD22-B102
MP 7721
IEC6068-2-58
IPC 7351/7355
IPC-7351 to252
IPC 7355
JESD22-A111
JEDEC-J-STD-20
JESD22B-102
MICA WAFER
J-STD-033
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Multicore 96SC
Abstract: 96SC soldering temperature CR32 recommended reflow profile LPCC2x2 multicore solder paste CR32 JEDEC SMT reflow profile 629002 5988-7963EN multicore solder paste 2C
Text: The LPCC2x2 Package Application Note 1316 1. Introduction Avago’s LPCC2x2 package is a highly thermal efficient leadless package offering improved RF response over a wide operating frequency, DC - 6 GHz. The exposed die-attach paddle acts as a device grounding, heat
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5988-7963EN
Multicore 96SC
96SC soldering temperature
CR32 recommended reflow profile
LPCC2x2
multicore solder paste
CR32
JEDEC SMT reflow profile
629002
multicore solder paste 2C
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SF-BGA208F-B-62
Abstract: No abstract text available
Text: Detail A 14mm [0.551"] 0.89mm [0.035"] 2.83mm [0.112"] Top View 12mm [0.472"] 14mm [0.551"] 1mm [0.039"] CONTACT DATA Accepts 0.20mm - 0.33mm Diameter pins 3-finger 37/25 gram, Initial insertion force with 0.254mm/0.203mm dia. pin 30/22 gram, normal force (with 0.254mm/0.203mm dia. pin)
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254mm/0
203mm
254mm0
FR4/G10
SF-BGA208F-B-62
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SP005
Abstract: SA965 SP005-76 116E
Text: !" WIN SUN TECHNOLOGY COMPANY PROFILE Philosophy & value,competence,milestone……………………01 !" TVS SMD Transient Voltage Suppresors Application…………………………………………………………………02
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tektronix type 576 curve tracer
Abstract: heat exchanger 96Sn4Ag tektronix 576 curve tracer 100N IRF6601 IRF6602 cardwell FR4 substrate 1.6mm
Text: The Mechanical Ruggedness of DirectFET TM Stuart Cardwell & Arthur Woodworth International Rectifier, Holland Road, Hurst Green, Oxted, Surrey, RH8 9BB, UK as presented at PCIM Europe 02 Abstract This paper outlines the mechanical tests TM performed on the DirectFET , the reasons for
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bga 0,8 mm
Abstract: tray matrix bga AN-1126 MO-151 fine BGA thermal profile an1126
Text: National Semiconductor Application Note 1126 December 2000 CONTENTS Introduction Package Overview PBGA Construction EBGA Construction Package Handling/Shipping Media Design Recommendations Solder Pad Geometry Escape Routing Guidlines Via Density Assembly Recommendations
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62Sn36Pb2Ag
Abstract: SnAgCu 63sn37pb pbga package weight 62Sn-36Pb-2Ag sn-pb-ag solder paste
Text: Motorola PowerQUICC II MPC8250A Pb-Free Packaging Information Motorola SPS, NCSD – Q2 2003 – Rev. 1 - Page 1 Motorola General Business Information MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. Motorola, Inc. 2002.
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MPC8250A
516-pin
27x27
26x26
MPC8250A,
62Sn36Pb2Ag
SnAgCu
63sn37pb
pbga package weight
62Sn-36Pb-2Ag
sn-pb-ag solder paste
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Lead Free reflow soldering profile BGA
Abstract: Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181
Text: Freescale Semiconductor Engineering Bulletin EB635 Rev. 2, 4/2005 Lead-Free BGA Solder Joint Assembly Evaluation To support a cleaner environment, meet market demands, and comply with international commercial standards and requirements, many integrated circuit devices are migrating to ball-grid array
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EB635
Lead Free reflow soldering profile BGA
Solder Paste, Indium, Type 3
reflow soldering profile BGA
"BGA Rework Practices",
5SN3
BGA PROFILING
EB635
Soldering guidelines
Indalloy 181
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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0.3mm pitch csp package
Abstract: AN-1187 DAP 08 PCB design for 0.2mm pitch csp package DAP 07 dap sot 23-5 SAC405 LDA08B MO-220 MO-229
Text: Table of Contents Introduction . 2 Package Overview . 2
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AN-1187
0.3mm pitch csp package
AN-1187
DAP 08
PCB design for 0.2mm pitch csp package
DAP 07
dap sot 23-5
SAC405
LDA08B
MO-220
MO-229
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4419B
Abstract: C0805C225K9RACTU ECJ-1VB1H103K PCC1784CT-ND R04003 63Sn37Pb Sonoscan
Text: HELP3TM Dual-band Cellular/PCS WCDMA Power Amplifier Module Application Note HELP3TM Dual-band WCDMA Power Amplifier Module Rev 3 Relevant products • AWT6221 General Description This ANADIGICS 3 mm x 5 mm hetero-junction bipolar provide optimum performance in a 50 Ω system, and
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AWT6221
4419B
C0805C225K9RACTU
ECJ-1VB1H103K
PCC1784CT-ND
R04003
63Sn37Pb
Sonoscan
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sharp laser diodes
Abstract: OC100G
Text: Table of Contents PAGE SURFACE MOUNT MOLDED DIODES 30ns 420mA, 2000V . 08 - 09 70ns 50mA - 250mA, 150mA - 500mA, 2000V - 5000V .
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420mA,
250mA,
150mA
500mA,
750mA
2000mA,
800mA
1500mA
3500mA,
sharp laser diodes
OC100G
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CBGA 255 motorola
Abstract: 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin
Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Semiconductor Products Sector Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in
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AN1850/D
CBGA 255 motorola
90Pb10Sn
cte table epoxy
BGA cte
pbga package weight
cte table epoxy substrate
AN-1850
360-Pin
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CL31A
Abstract: CL05A
Text: August 2009 MULTILAYER CERAMIC CAPACITORS We, Samsung, declare that our component MLCC is produced in accordance with EU RoHS directive. 1. RoHS Compliance and restriction of Br The following restricted materials are not used in packaging materials as well as products in compliance with the law and restriction.
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kevin0130
CL31A
CL05A
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AN-1187
Abstract: MO-220 MO-229 package tray design dwg
Text: Table of Contents Introduction . 2 Package Overview . 2
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AN-1187
AN-1187
MO-220
MO-229
package tray design dwg
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FR4 substrate fiberglass
Abstract: copper bond wire
Text: CHIP APPLICATION NOTES VMI chip rectifiers are an excellent choice for surface mount applications requiring high voltage and a small package size. Chips are available with voltages of 1800V and recovery times of 30ns. The chips are leadless silicon die. They are hermetically sealed with non-cavity glass passivation. Top and bottom terminations can be silver or gold
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OCR Scan
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