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    Central Semiconductor Corp BFY90-PBFREE

    RF TRANS NPN 15V 1.4GHZ TO72
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    DigiKey BFY90-PBFREE Box 2,718 1
    • 1 $6.45
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    Rochester Electronics LLC IRGP4790PBF

    IGBT 650V 140A TO247AC
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    DigiKey IRGP4790PBF Tube 74
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    Infineon Technologies AG IRGP4790PBF

    IGBT 650V TO-247
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    DigiKey IRGP4790PBF Tube
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    Rochester Electronics IRGP4790PBF 875 1
    • 1 $3.94
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    Vishay Semiconductors VS-30CPQ090PBF

    DIODE ARR SCHOTT 90V 15A TO247AC
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    DigiKey VS-30CPQ090PBF Tube 500
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    Air Electro Inc MS27466E25A90PB

    CORSAIR_
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    DigiKey MS27466E25A90PB Bulk 1
    • 1 $149.41
    • 10 $144.821
    • 100 $138.435
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    90PB Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: WED3C7410E16MC-XBHX 7410E RISC Microprocessor HiTCE Multichip Package OVERVIEW FEATURES The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and


    Original     		PDF WED3C7410E16MC-XBHX 7410E 7410E/SSRAM WED3C7410E16M-XBX, WED3C7558M-XBX WED3C750A8M-200BX WED3C7410E16MC-XBHX 63Pb/37SN) 63Sn/37Pb)

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    WED3C7410E16MC-XBHX

    Abstract: 7410E WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb WED3C7410E16MC
    Text: White Electronic Designs WED3C7410E16MC-XBHX 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16MC-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited


    Original     		PDF WED3C7410E16MC-XBHX 7410E WED3C7410E16MC-XBHX 7410E/SSRAM 16Mbits 200MHz 7410E WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb WED3C7410E16MC

    7410E

    Abstract: WED3C7410E16M-XBHX WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb10Sn block diagram of automatic flush system
    Text: White Electronic Designs WED3C7410E16M-XBHX PRELIMINARY* 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16M-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited


    Original     		PDF WED3C7410E16M-XBHX 7410E WED3C7410E16M-XBHX 7410E/SSRAM 400MHz 450MHz 16Mbits 200MHz WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb10Sn block diagram of automatic flush system

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WED3C755E8M-XBHX 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:


    Original     		PDF WED3C755E8M-XBHX 755E/SSRAM WED3C755E8M-XBHX 128Kx72 21mmx25mm, 300MHz/ 150MHz, 350MHz/175MHz) 66MHz

    ceramic rework

    Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability


    Original     		PDF 25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles

    Untitled

    Abstract: No abstract text available
    Text: WED3C755E8MC-XBHX 755E RISC Microprocessor HiTCE Multichip Package OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and


    Original     		PDF WED3C755E8MC-XBHX 755E/SSRAM WED3C7558MC-XBX WED3C755E8MC-XBHX 128Kx72

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    WED3C755E8MF

    Abstract: 90Pb WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8MF-XBX WED3C755E8M-XBX
    Text: White Electronic Designs WED3C755E8M-XBHX 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:


    Original     		PDF WED3C755E8M-XBHX 755E/SSRAM WED3C755E8M-XBHX WED3C755E8MF 90Pb WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8MF-XBX WED3C755E8M-XBX

    bt 1696

    Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
    Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are


    Original     		PDF

    NAND Flash Programmer with TSOP-48 adapter

    Abstract: INTEL Core i7 860 schematic diagram inverter lcd monitor fujitsu MB506 ULTRA HIGH FREQUENCY PRESCALER fujitsu LVDS vga MB89625R VHDL code simple calculator of lcd display JTag Emulator MB90F497 Millbrook BGA TBA 129-5
    Text: Master Product Selector Guide February 2001 Fujitsu Microelectronics, Inc. Contents Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Application Specific ICs ASICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


    Original     		PDF

    CBGA 255 motorola

    Abstract: 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin
    Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Semiconductor Products Sector Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in


    Original     		PDF AN1850/D CBGA 255 motorola 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin

    62Sn36Pb2Ag

    Abstract: 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302
    Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Freescale Semiconductor Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in


    Original     		PDF AN1850/D 62Sn36Pb2Ag 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302

    XQR4VSX55

    Abstract: CF1140 CF1509 AM3 pinout diagram VIRTEX 4 LX200 CF1144 xqr4vlx200 UG-496 UG070 am24 "pin compatible"
    Text: Virtex-4 QV FPGA FPGA Ceramic Ceramic Packaging and Packaging Pinout Specifications and [Guide Subtitle] [optional] UG496 v1.0 April 2, 2008 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development


    Original     		PDF UG496 CF1140 CF1144 FX140 LX200 CF1509 XQR4VSX55 CF1140 CF1509 AM3 pinout diagram VIRTEX 4 LX200 CF1144 xqr4vlx200 UG-496 UG070 am24 "pin compatible"

    DPAK JEDEC OUTLINE

    Abstract: 12SNOFC Tamac4 eme6600cs KFC 1/2H 90Pb10Sn ISL9N2357D3ST application notes ISL9N306AD TAMAC-4 fdd6512a
    Text: Date Created: 3/3/2004 Date Issued: 3/11/2004 PCN # 20033404-A DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.


    Original     		PDF 0033404-A fairchildsem419D3ST HUF76429D3S HUF76609D3S HUF76619D3S HUF76629D3S ISL9N306AD3 ISL9N308AD3 ISL9N310AD3ST ISL9N315AD3 DPAK JEDEC OUTLINE 12SNOFC Tamac4 eme6600cs KFC 1/2H 90Pb10Sn ISL9N2357D3ST application notes ISL9N306AD TAMAC-4 fdd6512a

    90Pb 10Sn solder paste

    Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products Sector 3501 Ed Bluestein Blvd., MD: F25 Austin, Texas 78721 USA


    Original     		PDF 25x25x1 90Pb 10Sn solder paste 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WED3C7410E16M-400BHXX RISC Microprocessor HiTCE™ Multichip Package OVERVIEW *ADVANCED The WED3C7410E16M-400BHXX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is


    Original     		PDF WED3C7410E16M-400BHXX 7410E/SSRAM WED3C7410E16M-400BHXX 7410E 256Kx72 21mmx25mm, 400MHz 200MHz 100MHz

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WED3C755E8M-XBHX ADVANCED* 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:


    Original     		PDF WED3C755E8M-XBHX 755E/SSRAM WED3C755E8M-XBHX 128Kx72 21mmx25mm, 300MHz/ 150MHz, 350MHz/175MHz) 66MHz

    7410E

    Abstract: WED3C7410E16M-XBHX WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX
    Text: White Electronic Designs WED3C7410E16M-XBHX 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16M-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited


    Original     		PDF WED3C7410E16M-XBHX 7410E WED3C7410E16M-XBHX 7410E/SSRAM 7410E 133MHz WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX

    HD6305Y

    Abstract: No abstract text available
    Text: HD6305X2, HD63A05X2, HD63B05X2 CMOS MCU Microcomputer Unit The HD6305X2 is memory expandable versions o f the HD6305X0, which is C M O S 8-bit single chip microcomputer. A C P U , a clock generator, a 128-byte R A M , I/O terminals, two timers and a serial communication interface (S C I) are built in the


    OCR Scan     		PDF HD6305X2, HD63A05X2, HD63B05X2 HD6305X2 HD6305X0, 128-byte HD6305X2. HD6305X0 HD6305Y

    rhombus delay lines

    Abstract: No abstract text available
    Text: RHOMBUS INDUSTRIES INC 4SE D 772MT2D GG0G24Û fl • R H B ^ y . / ^ FAST & SCHOTTKY BUFFERED DELAY MODULES 10-TAP AUTO-INSERT, SURFACE MOUNT DIPS.IAITD-XXX, AITD-XXX SERIES PART NUMBER OUTPUT DELAY M TAP-TO-TAP DELAY (IK) "FA ITD -ll


    OCR Scan     		PDF 772MT2D GG0G24Û 10-TAP 910-596-l826 rhombus delay lines

    Untitled

    Abstract: No abstract text available
    Text: RHOMBUS INDUSTRIES INC 45E D • 7754=120 G 0 G G 2 4 4 D ■ R H B FAST & SCHOTTKY BUFFERED DELAY MODULES T-H7-13 5-1AP AUTO-INSERT, SURFACE MOUNT DIPS. AIDM , FAIDM, AM DM , FAMDM SERIES 5-TAP PART NUMBERS 14-PIN 8-PIN •"FAIDM-7 ••AIDM-9 ••FAIDM-11


    OCR Scan     		PDF T-H7-13 14-PIN FAIDM-11 AIDM-13 FAIDM-15 AIDM-17 AIDM-25 AIDM-30 AIDM-35 AIDM-40