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    IKO International Inc WS6095

    Thrust Bearing, Thrust Needle Roller Bearing, Inner Ring | IKO International Inc. WS6095
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS WS6095 Bulk 1
    • 1 $64.43
    • 10 $61.21
    • 100 $57.99
    • 1000 $57.99
    • 10000 $57.99
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    Hubbell Wiring Device-Kellems LWS609

    AL LADDER,WALL SLEEVE,6H,09W
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Sager LWS609 1
    • 1 $295.43
    • 10 $283.28
    • 100 $283.28
    • 1000 $283.28
    • 10000 $283.28
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    WS609 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    Alpha WS609

    Abstract: Yamaichi TQFP 244 MO-194AA MO-193 MO-194 tssop 16 exposed pad stencil Alpha WS609 solder TSSOP YAMAICHI SOCKET MO-194AC SN74LVC16xxx
    Text: TVSOP Application Brief December 1996 SCBA009B List of Revisions Draft 1.00 Draft 1.01 Draft 1.20 Draft 1.3 Initial Issue Minor formatting changes Rename to Application Brief, change JEDEC registration number references to MO-193 for all TVSOP, update thermal graphs, delete


    Original     		PDF SCBA009B MO-193 IC51-0142-2074-MF IC51-0162-2073-MF IC51-0202-2072-MF IC51-0242-2071-MF IC51-0482-2069-MF IC51-0562-2067-MF IC51-0802-2077-MF IC51-1002-2076-MF Alpha WS609 Yamaichi TQFP 244 MO-194AA MO-194 tssop 16 exposed pad stencil Alpha WS609 solder TSSOP YAMAICHI SOCKET MO-194AC SN74LVC16xxx

    reballing

    Abstract: Alpha WS609 solder reflow hot air BGA solder paste alpha WS609 WS609 Lead Free reflow soldering profile BGA BGA PROFILING BGA Ball Crack Alpha WS609 reball
    Text: BGA REBALLING INSTRUCTIONS Notice Mention of third-party products is for informational purposes only and constitutes neither an endorsement nor a recommendation. Emulation Techology assumes no responsibility with regard to the performance of these products.


    Original     		PDF

    solder paste alpha WS609

    Abstract: ic51-0142 WS609 Alpha WS609 solder AHC244 AKXXX TSSOP YAMAICHI SOCKET MO-194 MO-194AF 194-AA
    Text: Thin Very Small-Outline Package TVSOP SCBA009D February 2001 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest


    Original     		PDF SCBA009D solder paste alpha WS609 ic51-0142 WS609 Alpha WS609 solder AHC244 AKXXX TSSOP YAMAICHI SOCKET MO-194 MO-194AF 194-AA

    Virtex-6 reflow

    Abstract: WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320
    Text: Device Reliability Report First Quarter 2010 UG116 v5.9 May 4, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, p∅ost, or transmit the


    Original     		PDF UG116 611GU FGG676 FFG1152 Virtex-6 reflow WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    Alpha WS609 solder

    Abstract: Kester steam aging system solder paste alpha WS609 7406D mountaingate kester solder paste WS609 TL082 s05d SHINKO WS609
    Text: PALLADIUM LEAD FINISH USER'S MANUAL DOUGLAS W. ROMM INTRODUCTION Texas Instruments has introduced a revolutionary new lead finish into the Semiconductor industry. This plating technology consists of a copper base metal plated with nickel and palladium. The palladium acts as


    Original     		PDF

    XCV100 TQ144

    Abstract: XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116
    Text: Device Reliability Report First Quarter 2009 [optional] UG116 v5.5 June 15, 2009 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG116 611GU FGG676 FFG1152 XCV100 TQ144 XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116

    solder paste alpha WS609

    Abstract: WS609 ic51-0142 TSSOP YAMAICHI SOCKET MO-194 028089 CM92 MO-194AB MO-194AD
    Text: Thin Very Small-Outline Package TVSOP SCBA009E April 2001 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest


    Original     		PDF SCBA009E solder paste alpha WS609 WS609 ic51-0142 TSSOP YAMAICHI SOCKET MO-194 028089 CM92 MO-194AB MO-194AD

    Untitled

    Abstract: No abstract text available
    Text: V•I Chip – BCM Bus Converter Module TM B048K096T24 + + –K – • >96% efficiency • 240 Watt 360 Watt for 1 ms • 125°C operation • High density – up to 960 W/in3 • <1 µs transient response • Small footprint – 240 W/in • >3.5 million hours MTBF


    Original     		PDF B048K096T24 02/04/10M

    Alpha WS609

    Abstract: solder paste alpha WS609 WS609 Screen Printer DEK 265GS TSSOP YAMAICHI Socket 14 leads cc fuji IC51-0562 socket TSSOP YAMAICHI SOCKET SCBA009A mutual capacitance touch screens 2000
    Text: TVSOP Application Brief August 1996 draft 1.2 SCBA009A The Thin Very Small Outline Package (TVSOP) Acknowledgment The authors wish to acknowledge the following persons and corporations for their invaluable assistance in the preparation of this document.


    Original     		PDF SCBA009A IC51-0142-2074-MF IC51-0162-2073-MF IC51-0202-2072-MF IC51-0242-2071-MF IC51-0482-2069-MF IC51-0562-2067-MF IC51-0802-2077-MF IC51-1002-2076-MF IC51-0142-2074 Alpha WS609 solder paste alpha WS609 WS609 Screen Printer DEK 265GS TSSOP YAMAICHI Socket 14 leads cc fuji IC51-0562 socket TSSOP YAMAICHI SOCKET SCBA009A mutual capacitance touch screens 2000

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    SZZA004

    Abstract: Alpha WS-609 EIA-638 solder paste alpha WS609 ic shelf life Alpha WS609 solder solder paste alpha WS609 TECHNICAL Alpha WS-609 solder VIP98A WS609
    Text: Steam-Age Evaluation of Nickel/Palladium Lead Finish for Integrated Circuits SZZA004 September 1998 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest


    Original     		PDF SZZA004 ANSI/J-STD-002 WS-609. ANSI/EIA-638, SZZA004 Alpha WS-609 EIA-638 solder paste alpha WS609 ic shelf life Alpha WS609 solder solder paste alpha WS609 TECHNICAL Alpha WS-609 solder VIP98A WS609

    solder paste alpha WS609

    Abstract: WS609 TSSOP YAMAICHI SOCKET Alpha WS609 Yamaichi Electronics ic51-0142 cc fuji CM92 DELL PWB mutual capacitance touch screens 2000 MO-193
    Text: TVSOP Application Brief August 1996 draft 1.2 SCBA009A List of Revisions Draft 1.00 Draft 1.01 Draft 1.20 Initial Issue Minor formatting changes Rename to Application Brief, change JEDEC registration number references to MO-193 for all TVSOP, update thermal graphs, delete


    Original     		PDF SCBA009A MO-193 IC51-0142-2074-MF IC51-0162-2073-MF IC51-0202-2072-MF IC51-0242-2071-MF IC51-0482-2069-MF IC51-0562-2067-MF IC51-0802-2077-MF IC51-1002-2076-MF solder paste alpha WS609 WS609 TSSOP YAMAICHI SOCKET Alpha WS609 Yamaichi Electronics ic51-0142 cc fuji CM92 DELL PWB mutual capacitance touch screens 2000

    solder paste alpha WS609

    Abstract: WS609 Alpha WS609 solder cc fuji TSSOP YAMAICHI SOCKET Alpha WS609 dell monitor circuit diagram MO-194 scba009c reflow profile
    Text: Thin Very Small-Outline Package TVSOP SCBA009C March 1997 1 IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest


    Original     		PDF SCBA009C solder paste alpha WS609 WS609 Alpha WS609 solder cc fuji TSSOP YAMAICHI SOCKET Alpha WS609 dell monitor circuit diagram MO-194 scba009c reflow profile

    Alpha WS609 solder

    Abstract: mountaingate Kester steam aging system solder paste alpha WS609 ALS245 LS245 TL082 Dissolve Oxygen free energy matsua saw
    Text: PALLADIUM LEAD FINISH USER'S MANUAL DOUGLAS W. ROMM INTRODUCTION Texas Instruments has introduced a revolutionary new lead finish into the Semiconductor industry. This plating technology consists of a copper base metal plated with nickel and palladium. The palladium acts as


    Original     		PDF

    WS609

    Abstract: BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING XAPP426 Alpha WS609 Alpha WS609 solder C-145 FF1152
    Text: Application Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages XAPP426 v1.3 March 3, 2006 Summary Xilinx flip-chip BGA package is offered for Xilinx high-performance FPGA products. Unlike traditional packaging in which the die is attached to the substrate face up and the connection is


    Original     		PDF XAPP426 200-210oC 2050215oC. WS609 BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING XAPP426 Alpha WS609 Alpha WS609 solder C-145 FF1152

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    XC6SLX45t-fgg484

    Abstract: XC6SLX16-CSG324 XC6SLX100-FGG676 XC6SLX45 FGG484 x2 type ac capacitor XC6SLX16 FIT rate xc3s3400a UG116 XC95288 Virtex-6 reflow
    Text: Device Reliability Report Third Quarter 2010 UG116 v5.11 November 1, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Documentation”) to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG116 611GU FGG676 FFG1152 XC6SLX45t-fgg484 XC6SLX16-CSG324 XC6SLX100-FGG676 XC6SLX45 FGG484 x2 type ac capacitor XC6SLX16 FIT rate xc3s3400a UG116 XC95288 Virtex-6 reflow

    solder paste alpha WS609

    Abstract: WS609 Alpha WS609 solder entek Cu-56 epoxy adhesive paste cte table Alpha WS609 ceramic rework solder paste WS609 Cu-56 cbga
    Text: Ceramic Ball Grid Array Surface Mount Assembly Application Note 1298 1. Package Description Ceramic Ball Grid Array CBGA is a custom platform supporting a wide variety of performance applications. This package uses flip chip as the first level interconnection and solder ball as the second level


    Original     		PDF 5988-6603EN solder paste alpha WS609 WS609 Alpha WS609 solder entek Cu-56 epoxy adhesive paste cte table Alpha WS609 ceramic rework solder paste WS609 Cu-56 cbga