L-23014-01
Abstract: L24002 mitsubishi cdram
Text: L-21001-0B MITSUBISHI ELECTRIC Mitsubishi DRAM Technical Direction High Performance, Low Power,High Density,High Speed etc. High Density Wide Bit Organization 1G High Speed 512M Direct Rambus TM x32 256M DDR 128M SDRAM EDO Fast Page 64M DRAM Self Refresh
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L-21001-0B
L-21002-0I
x4/x8/x16
L-23014-01
L24002
mitsubishi cdram
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64M-DRAM
Abstract: No abstract text available
Text: INFORMATION NOTE Second Generation 64M - DRAM Characterisation Data 10.96 INFO64M4.DOC 64M-DRAM This information note is intended to provide technical information on the SIEMENS second generation 64M-DRAM Dynamic Access Memories operating at the 3.3 V VCC
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INFO64M4
64M-DRAM
HYB3164
400/800/160AJ/AT
405/805/165AJ/AT
64M-DRAM
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L24002
Abstract: NAND "read disturb" 1GB Toshiba 512 NAND MLC FLASH BGA PC133 registered reference design CMOS 0.8mm process cross Lithium battery CR2025 sony M2V28S30AVP M5M51008CFP
Text: Future On Chips MITSUBISHI SEMICONDUCTORS MITSUBISHI ELECTRIC CORPORATION ULSI Memory Memory Series Series ULSI RAM/MCP/FLASH New Data Package http://www.mitsubishichips.com Jul. 2000 MITSUBISHI ELECTRIC L-11002-01 CONTENTS General Business Operation Network and Production Facilities
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L-11002-01
64MDRAM
64MSDRAM
128MSDRAM
256MSDRAM
144MRDRAM
L24002
NAND "read disturb" 1GB
Toshiba 512 NAND MLC FLASH BGA
PC133 registered reference design
CMOS 0.8mm process cross
Lithium battery CR2025 sony
M2V28S30AVP
M5M51008CFP
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sandisk micro sd card pin
Abstract: MCP 1Gb nand 512mb dram 130 256K x 16 DRAM FPM cross reference Toshiba NAND MLC FLASH BGA TSOP 48 Package nand memory toshiba MCP 1Gb 512Mb 130 PC133 registered reference design L7103 02bjxx ulsi
Text: Future On Chips MITSUBISHI SEMICONDUCTORS MITSUBISHI ELECTRIC CORPORATION ULSI Memory Memory Series Series ULSI RAM/MCP/FLASH New Data Package http://www.mitsubishichips.com Jul. 2000 L-11002-01 MITSUBISHI ELECTRIC CONTENTS 1. General 1 2. DRAM 9 3. Low Power SRAM
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L-11002-01
L-11003-0I
sandisk micro sd card pin
MCP 1Gb nand 512mb dram 130
256K x 16 DRAM FPM cross reference
Toshiba NAND MLC FLASH BGA
TSOP 48 Package nand memory toshiba
MCP 1Gb 512Mb 130
PC133 registered reference design
L7103
02bjxx
ulsi
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3164165
Abstract: TSOP-II-32 GPJ05855 hyb3165165 cmos dram 8m x 16 TSOPII-50 3165165AT 64M-DRAM marking AJ 7 3164805
Text: HYB 3164 5 400/5 AJ/AT -40/-50/-60 64M x 4 - Bit Dynamic RAM HYB 3164(5)800/5 AJ/AT -40/-50/-60 8M x 8 - Bit Dynamic RAM HYB 3164(5,6)160/5 AT -40/-50/-60 4M x 16 -Bit Dynamic RAM INFORMATION NOTE 64M - Bit DYNAMIC MEMORIES (Second Generation) General Information
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Info64M3
64M-Bit
HYB3164
400/800/160AJ/AT
405/805/165AJ/AT
400mil
SOJ-24
3164165
TSOP-II-32
GPJ05855
hyb3165165
cmos dram 8m x 16
TSOPII-50
3165165AT
64M-DRAM
marking AJ 7
3164805
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4mx16 edo
Abstract: M5M465165 ta 9812
Text: A L-21038-01 MITSUBISHI ELECTRIC 64MDRAM 3rd Generation Definition of Part-Number M5M4 XX XX X B X - X X T U 3rd Generation f Density / Refresh Word Organization Mode Package Speed Item Self Refresh 65 - 64M / 4K 64ms 67 - 64M / 8K ( 64ms) 40 - 16Mx4 80 - 8Mx8
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L-21038-01
64MDRAM
16Mx4
400mil
400milTSOPII
L-21039-0B
M5M467400BJ
M5M467400BTP
M5M467800BJ
4mx16 edo
M5M465165
ta 9812
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M5M465805ATP
Abstract: 4mx16 edo M5M465400ATP
Text: • A . MITSUBISHI ELECTRIC - L-21011-01 MITSUBISHI 2nd Generation 64MDRAM Series ~h Part Number Word Organization / Refresh / Function Package Speed Item Self Refresh Production M5M467400AJ
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L-21011-01
64MDRAM
M5M467400AJ
M5M467400ATP
M5M467800AJ
M5M467800ATP
M5M465400AJ
M5M465400ATP
M5M465800AJ
M5M465800ATP
M5M465805ATP
4mx16 edo
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Untitled
Abstract: No abstract text available
Text: L-21021-01 MITSUBISHI ELECTRIC \ 64MDRAM x4/x8 Package Outline (SOJ) +0.05 0.2 0,02 - r - 'S J cn ö o^+11OÑ 2.85±0.1 J A MITSUBISHI L-21022-01 ELECTRIC 64MDRAM (x4/x8) Package Outline (TSOP II) 11.76+0.2 • n n n n n n n n n n n n n n n n J dUUUUUUUUUUUUUUU
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L-21021-01
64MDRAM
L-21022-01
L-21023-01
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Untitled
Abstract: No abstract text available
Text: A MITSUBISHI L-21019-01 ELECTRIC 64MDRAM 16Mx4, 8Mx8 Pin Configuration 8M X 8 16M X 4 Vcc DQ1 DQ2 D03 D 04 NC Vcc /W /RAS AO Al A2 A3 A4 A5 Vcc Vcc DQ1 DQ2 NC NC NC NC AV /RAS AO Al A2 A3 A4 A5 Vcc W 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32Pin SOJ or TSOP2
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L-21019-01
64MDRAM
16Mx4,
32Pin
L-21020-01
4MX16)
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Untitled
Abstract: No abstract text available
Text: r MITSUBISHI ELECTRIC - Mitsubishi Technical Direction of DRAM High Performance, Low Power,Hig h Density,High Speed etc. High Density L-21001-01 MITSUBISHI ELECTRIC -
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L-21001-01
L-21007-0A
64MDRAM
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Untitled
Abstract: No abstract text available
Text: HYB39S6440x/80x/16xT 64MBit Synchronous DRAM SIEM EN 64 MBit Synchronous DRAM Advanced Information • High Performance: Multiple Burst Operation -8 -10 Units fCK 125 100 MHz tCK3 8 10 ns tAC3 7 8 ns Automatic Command and Read with Single Controlled Write
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HYB39S6440x/80x/16xT
64MBit
P-TSOPII-54
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BT 804
Abstract: No abstract text available
Text: SIEMENS Contents Page In tro d u c tio n .9 Sum m ary o f T ypes incl. ordering codes . 13
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32-Bit
B166-H6993-X-7600,
BT 804
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BA0A11
Abstract: 39S64800T-80 39S648Q0T-10 SMD MARKING CODE aO9
Text: HYB39S6440X/8ÖX/16xT 64MBit Synchronous DRAM SIEM ENS 64 MBit Synchronous DRAM Advanced Information • High Performance: • Multiple Burst Read with Operation Single Write -8 -10 Units fCK 125 100 MHz tCK3 8 10 ns • Data Mask for Read / Write control x4, x8
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HYB39S6440X/8
X/16xT
64MBit
P-TSOPII-54
400mil
B39S6440X/80X/16xT
PII-54
400mil,
TSOPN-54
BA0A11
39S64800T-80
39S648Q0T-10
SMD MARKING CODE aO9
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