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Catalog Datasheet	MFG & Type	PDF	Document Tags
qfn 3x3 tray dimension Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	PDF	UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
XC2S150pq208 Abstract: xc2s50-pq208 XCV1000EFG680-6C XC2S150PQ208-5C XC2S200ePQ208 XC2S300EPQ208-6C xcv1000efg680 XCV300BG432 2S50E-PQ208-6C XC3S1000-FG456-4C Text: LogiCORE PCI32 Interface v3.0 DS206 October 28, 2003 Introduction Data Sheet, v3.0.116 LogiCORE Facts With the Xilinx LogiCORE PCI Interface, a designer can build a customized, fully PCI 2.3-compliant core with the highest possible sustained performance, 528 Mbytes/sec.	Original	PDF	PCI32 DS206 32-bit, 32-bit 64/32-bit PC32/33 XC2S150pq208 xc2s50-pq208 XCV1000EFG680-6C XC2S150PQ208-5C XC2S200ePQ208 XC2S300EPQ208-6C xcv1000efg680 XCV300BG432 2S50E-PQ208-6C XC3S1000-FG456-4C
xilinx topside marking Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	PDF	UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
xilinx part marking Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	PDF	UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
JEDS51-2 Abstract: xc4010e-pq208 XAPP415 xc4013e-pq240 xc73144bg225 PG223-XC4013E JC JB jt Malico xcv1000efg680 Text: Application Note: Packaging R Packaging Thermal Management XAPP415 v1.0 December 19, 2001 Thermal Management Modern high-speed logic devices consume appreciable amount of electrical energy. This energy invariably turns into heat. Higher device integration drives technologies to produce	Original	PDF	XAPP415 JEDS51-2 xc4010e-pq208 XAPP415 xc4013e-pq240 xc73144bg225 PG223-XC4013E JC JB jt Malico xcv1000efg680
PQFP240 Abstract: XP560E-FBGA484 XCV200E-PQ240 xcv2000e-bg560 XCV100E-FG256 XCV100Efg256 PQFP208 XILINX XCV600E-BG432 XP704E-PBGA676 XCV400E-PQ240 Text: XPressArray 0.18µ Hybrid Gate Array 1.0 Key Features • Supports LVTTL, LVCMOS, PCI, PCI-X, AGP-2X, HSTL, SSTL, GTL/+, LVPECL, LVDS, BLVDS • 1.8V, 2.5V and 3.3V capable I/O • True 3.3V and 5V tolerance with no external resistor necessary • Up to 832 user I/Os	Original	PDF	240K-PQFP208 XP220E-FBGA324 XP164E-FBGA144 XP164E-LQFP144 XP220E-PQFP208 XP220E-PQFP240 XP270E-FBGA324 XP270E-PBGA356 PQFP240 XP560E-FBGA484 XCV200E-PQ240 xcv2000e-bg560 XCV100E-FG256 XCV100Efg256 PQFP208 XILINX XCV600E-BG432 XP704E-PBGA676 XCV400E-PQ240
XC2S200PQ208 Abstract: XC2S100PQ208-5C XC2S50PQ208-5C xc2s50-pq208 XCV300BG432 XC2S200pq208 pin configuration XC2S150PQ208 XCV1000EFG680-6C XC2S100PQ208 PCI32 Text: LogiCORE PCI32 Interface v3.0 DS206 July 15, 2004 Product Specification v3.0.129 Features LogiCORE Facts • Fully PCI 2.3-compliant core, 32-bit, 66/33 MHz interface PCI32 Resource Utilization 1 • Customizable, programmable, single-chip solution • Predefined implementation for predictable timing	Original	PDF	PCI32 DS206 32-bit, XC2S200PQ208 XC2S100PQ208-5C XC2S50PQ208-5C xc2s50-pq208 XCV300BG432 XC2S200pq208 pin configuration XC2S150PQ208 XCV1000EFG680-6C XC2S100PQ208
XILINX/part marking Hot Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	PDF	UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
BFG95 Abstract: No abstract text available Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL	Original	PDF	UG112 UG072, UG075, XAPP427, BFG95
XC2S200PQ208 Abstract: XC2S200pq208 pin configuration XC2S300EPQ208-6C XC2S150PQ XC2S150PQ208-5C verilog hdl code for parity generator XCV300BG432 XC2S100PQ208-5C xc2s150pq208 PCI32 Text: LogiCORE PCI32 Interface v3.0 DS206 April 26, 2004 Introduction Product Specification v3.0.128 LogiCORE Facts With the Xilinx LogiCORE PCI Interface, a designer can build a customized, fully PCI 2.3-compliant core with the highest possible sustained performance, 528 Mbytes/sec.	Original	PDF	PCI32 DS206 32-bit, XC2S200PQ208 XC2S200pq208 pin configuration XC2S300EPQ208-6C XC2S150PQ XC2S150PQ208-5C verilog hdl code for parity generator XCV300BG432 XC2S100PQ208-5C xc2s150pq208
XC2S200PQ208 Abstract: xc2s50-pq208 XC2S100PQ208-5C XC2S150PQ208-5C XC4VSX35-FF668-10C XC3S1200E-FG400-5C3 XC3S500E-FT256 XC3S1400AFG484 XC2S100-PQ208-5C ds206 Text: om PCI 32 Interface v3 and v4 DS206 February 15, 2007 Product Specification v3 & v4 161 Features LogiCORE Facts • Fully PCI™ 3.0-compliant LogiCORE™, 32-bit, 66/33 MHz interface Resource Utilization1 PCI32 v4 PCI32 v3 • Customizable, programmable, single-chip solution	Original	PDF	PCITM32 DS206 32-bit, PCI32 XC2S200PQ208 xc2s50-pq208 XC2S100PQ208-5C XC2S150PQ208-5C XC4VSX35-FF668-10C XC3S1200E-FG400-5C3 XC3S500E-FT256 XC3S1400AFG484 XC2S100-PQ208-5C
XC2S200PQ208 Abstract: xc2s50-pq208 XC2S150PQ208-5C XC2S300EPQ208-6C xc3s1000fg456-4c XC3S1000-FG456 XC2S100PQ208 xc3s1000fg456 XC2S200pq208 pin configuration XCV300BG432 Text: LogiCORE PCI Interface v3.0 DS207 April 26, 2004 Product Specification v3.0.128 Introduction With the Xilinx LogiCORE PCI Interface, a designer can build a customized PCI 2.3-compliant core with the highest possible sustained performance of 528 MB/sec.	Original	PDF	DS207 PCI64 64/32-bit, PCI64/66 PCI64/33, XC2VP20. XC2VP50; XC2S200PQ208 xc2s50-pq208 XC2S150PQ208-5C XC2S300EPQ208-6C xc3s1000fg456-4c XC3S1000-FG456 XC2S100PQ208 xc3s1000fg456 XC2S200pq208 pin configuration XCV300BG432
XC3S1200E-FG400-5C Abstract: XC3S1400AFG484 XC2S300E-FG456 XC4VFX20-FF672 xc4vlx25ff668 xc2s150fg456 XC2S150-FG456 XC2S200-FG456-6C vhdl code for 3 bit parity checker XC2S150FG456-6C Text: PCI 64 Interface v3 and v4 DS205 February 15, 2007 Product Specification v3 161 & v4 Features LogiCORE Facts Resource Utilization1 • Fully PCI™ 3.0-compliant LogiCORE™, 64-bit, 66/33 MHz interface Slice Four Input LUTs 565 724 • Customizable, programmable, single-chip solution	Original	PDF	DS205 64-bit, XC3S1200E-FG400-5C XC3S1400AFG484 XC2S300E-FG456 XC4VFX20-FF672 xc4vlx25ff668 xc2s150fg456 XC2S150-FG456 XC2S200-FG456-6C vhdl code for 3 bit parity checker XC2S150FG456-6C