d 1380
Abstract: symb TSOP40B
Text: Memory Products - PACKAGE OUTLINE and MECHANICAL DATA mm Symb Typ Min A inches Max Typ Min 1.20 0.047 A1 0.05 0.15 0.002 0.006 A2 0.95 1.05 0.037 0.041 B 0.17 0.27 0.007 0.011 C 0.10 0.21 0.004 0.008 D 13.80 14.20 0.543 0.559 D1 12.30 12.50 0.484 0.492 E 9.90
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TSOP40B
d 1380
symb
TSOP40B
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pioneer PAL 007 A
Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
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Untitled
Abstract: No abstract text available
Text: REVISIONS NO. 1 2.0 • Note 6 2 1.5 +0.1/-0.0 DIA DESCRIPTION 18.0 was 18.45 DATE 2/16/94 Was Closed Tool BY RJB 7/1/94 T.S. 5/11/95 SDC 14.2 • Note 6 was 1 3 4.0 • See Note 1 28.4 •Note 6 A 0.30 ± 0.05 142 and 28.4 was 1.75 2.5 3 14.2 • Note 6 45 °
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100mm
TSOP40-B
TSOP40
A0713-92-1
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TSOP-48 pcb LAYOUT
Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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land pattern for TSOP 2-44
Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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IPC-J-STD-001
Abstract: TRAY DAEWON TSOP 6n1 tube IPC-JSTD-001 VHH10-6N1 Intel Corporation esd flash small outline package guide DAEWON tray 48 optical Pick-Up head venturi meter R08-01-FOGO
Text: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.5 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Process Procedures
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footprint so44
Abstract: 9977 IC SOCKET TSOP48 TSOP32 FOOTPRINT ST1355 52 pin plcc socket ST19GF34 PSDSoft ST19AF08 serial flash 256Mb fast erase spi
Text: MEMORY SELECTOR Leading Edge Memories • 1999 GO Why a Broad Range? Leading Edge Memories OTP and UV EPROMs Flash Memories Serial and Parallel EEPROMs ASM and Memory Card ICs Memory Systems and NVRAMs BROAD RANGE STMicroelectronics is a world leader in non-volatile memories, manufacturing a broad
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operat911)
D-90449
BRMEMSEL/0699
footprint so44
9977
IC SOCKET TSOP48
TSOP32 FOOTPRINT
ST1355
52 pin plcc socket
ST19GF34
PSDSoft
ST19AF08
serial flash 256Mb fast erase spi
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m27c640
Abstract: M27C642 M28C801 M27C1024 M27C1001 M27C2001 M27C202 M27C256B TSOP40B M27C4001
Text: OTP and UV EPROM Products eprom.st.com STM i c r o e l e c t r o n i c s More Intelligent Solutions OTP and UV EPROM Products OTP and UV EPROM Products OTP and UV EPROM LONG-TERM COMMITMENT STMicroelectronics supports the EPROM market with a strong commitment and
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80ns/3V)
M27W800
x8/x16
100ns
90ns/3V)
BREPROM/0101
m27c640
M27C642
M28C801
M27C1024
M27C1001
M27C2001
M27C202
M27C256B
TSOP40B
M27C4001
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M29F STMicroelectronics
Abstract: FBGA48 M29F160D M29F160DB FPGA48 "NOR Flash" 4MB 4MB flash bios chip 8 pin M28W160C M29F002B M29F102B
Text: Flash Memories Industry Standard, Advanced Architecture and Solid-State Storage flash.st.com STM i c r o e l e c t r o n i c s More Intelligent Solutions Flash Memories Industry Standard, Advanced Architecture and Solid-State Storage Flash Memories A B R OA D R A N G E
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M58LW064B
x16/x32)
M29F STMicroelectronics
FBGA48
M29F160D
M29F160DB
FPGA48
"NOR Flash" 4MB
4MB flash bios chip 8 pin
M28W160C
M29F002B
M29F102B
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DAEWON tray tsop 48LD
Abstract: nikon v12B 6n1 tube IPC-J-STD-001 nikon GRAINGER TRAY TSOP 56LD daewon TRAY DAEWON TSOP venturi meter
Text: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.4 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Procedures
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256k x8 SRAM 5V
Abstract: ST95080 rom 1K x8 mod 10 asynchronous ST1335 M28V210 M6280 3.3 -35Y M48Z09
Text: MEMORY PRODUCTS SELECTOR GUIDE A D) OTP Memory - 5V range Type M27C64A M27C256B M87C257 M27C512 M27C1001* M27C1024* M27C2001* M27C405* M27C4001 M27C4002 M27C801 Size 64K 256K 256K 512K 1 Meg 1 Meg 2 Meg 4 Meg 4 Meg 4 Meg 8 Meg Organisation Access Time ns)
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M27C64A
M27C256B
M87C257
M27C512
M27C1001*
M27C1024*
M27C2001*
M27C405*
M27C4001
M27C4002
256k x8 SRAM 5V
ST95080
rom 1K x8
mod 10 asynchronous
ST1335
M28V210
M6280
3.3 -35Y
M48Z09
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M93C46BN1
Abstract: PLCC32 512k M24C32MN1 M93S46RBN1 ST24C04M1 M2716-1F1 200N1 M28F512-15C1 M27C1024-12F7 M27C256B-20C7
Text: MEMORIES and SMARTCARD PRODUCTS NON VOLATILE MEMORIES UV EPROM - NMOS Size Part Number Organis. Speed ns VCC Range ICC / Stby Temperature Range (°C) Package 16K M2716-1F1 x8 350 5V ± 10% 100mA/25mA 0 to 70 FDIP24W 16K M2716-1F6 x8 350 5V ± 10% 100mA/25mA
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M2716-1F1
M2716-1F6
M2716F1
M2716F6
M2732A-2F1
M2732AF1
M2732AF6
M2732A-3F1
M2764A-1F1
M2764A-20F1
M93C46BN1
PLCC32 512k
M24C32MN1
M93S46RBN1
ST24C04M1
200N1
M28F512-15C1
M27C1024-12F7
M27C256B-20C7
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PAL 007 pioneer
Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
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