TP240 Search Results

TP242

Abstract: TP236 TP238 TP239 TP240 TP243
Contextual Info: Steel Switch Boxes 31/2" DEEP SWITCH BOXES – GANGABLE – 18.0 CUBIC INCH CAPACITY 2" WIDE x 3" LONG FOR NONMETALLIC CABLE – CLAMPS IN EACH END Steel Boxes TP236 TP238 TP239 TP242 TP243 Cat. # Bracket Ground Pigtail Ears TP236 TP238 TP239 TP240 TP242

Contextual Info: Installation Guide Installation Guide for OM13320 Preliminary 1 — 9/6/2013 Installation Guide Document information Info Content Keywords Abstract Installation Guide for the Fm+ Development Board OM13260 Kit NXP Semiconductors Revision history Rev Date

6JK3

Abstract: BC733 bc735 usb common mode choke BC380 BC628 MMDR BC148 pin configuration BC702 Wistron Corporation
Contextual Info: A B C D E D H2 BLOCK DIAGRAMVER.-4 Project Code 4 4,5 3 ICS 94239 M/B D/D LAUNCH CDROM IR 2ND HDD DESKTOP CPU For ENG Willamette For M/P Northwood CLK GEN 6 0.18u 1.3G~1.8G G768D 0.13u 2.0G~2.4G 500mA; 600mA 15 7,8 9,10,11 3 2002/06/06 DDR*2 MCH 15 ATI P6

BCM5784

Abstract: JV50-TR RT8205A RS880 SCD1U16V2KX-3GP SB710 AMD SB710 tps51125 RS880M ICS9LPRS480BKL
Contextual Info: 5 4 3 2 Project code: 91.4FN01.001 PCB P/N : 48.4FN01.001 REVISION : 09230- -1 JV50-TR Block Diagram DDR2 PCB STACKUP 667/800MHz AMD Caspian CPU S1G3 35W 667/800 MHz 16,17 D 1 DDR2 667/800 MHz 16,17 G792 35 IN OUT INPUTS HDMI LAN DY Codec A-Link 4X4 AZALIA

88SE6121

Abstract: wpc8763ldg G5281RC1U-GP 88se6 AN-22 1D05V Wistron Corporation SC10U10V5KX-2GP H2434 wistron
Contextual Info: PCB STACKUP Project code: 91.4U601.001 PCB P/N : 07204-SC Revision : MAKI Block Diagram L1: L2: L3: L4: L5: L6: L7: L8: Mobile CPU CLK GEN. Merom 479 2G/2.33G ICS 9LPRS365 3 2.0G : 71.MEROM.A0U 2.33G : 71.MEROM.B0U 71.09502.00W HOST BUS G792 42 DOCK CRT & TV-OUT

SM 630 finger print module

Abstract: ADP3208J RTS5158E SE330U2VDM-L-GP USB232 WPCE776 BQ24740 CT3528 ADP3208 EMC2102-DZK-GP
Contextual Info: A B C D SYSTEM DC/DC LZ2 Block Diagram 4 E Project code: PCB P/N Revision : : INPUTS Penryn SV 35W 3 5V_S5 3D3V_S5 EMC2102 DDR2 socket PCB 8-LAYER STACKUP INPUTS 15 DCBATOUT 1D8V_S3 667/800/1066MHz@1.05V GND R.G.B DDR2 socket 3 TPS51100 APL5912 1D8V_S3 APL5912

MOSFET 2301

Abstract: cxd9872 cxd9872k a6019 ah41 cps ec nvs mbx149 MMC2301 a6806 TX39D80VC1GAA transistor c1093
Contextual Info: M C N 5 4 3 2 1 Schematics Page Index Title / Revision / Change Date B Date 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 Page

AR5212

Abstract: ar5312 diode 39b2 AR5112 AR5213 AR5211 st c739 FD507 U508-3 AR533 Ct516
Contextual Info: 7 Schematic Diagrams and PCB Silkscreen 7-1 MAIN BOARD 7-1-1 Schematic Diagrams X05 7-1 This Document can not be used without Samsung’s authorization. 7 Schematic Diagrams and PCB Silkscreen 7-1-1 a Main Board Schematic Sheet 2 of 40(Operation Block Diagram)

winbond wpce773la0dg

Abstract: VT1702S G1454R41U ICS9LPRS480BKLFT SCD1U25V3KX-GP MMBT3904-4-GP c5696 WPCE773LA0DG 1gp transistor winbond 25x16
Contextual Info: 5 4 3 2 SJM50-PU Block Diagram 1 SYSTEM DC/DC Project code: 91.4FC01.001 PCB P/N : 48.4FC01.0SB REVISION : 08256-SB 40 TPS51125 INPUTS OUTPUTS 5V_S5 8A 3D3V_S5(6A) 5V_AUX_S5 DCBATOUT D AMD Giffin CPU S1G2 (35W) Thermal Sensor CLK GEN. SMSC 31 Video RAM 4,5,6,7

smd code wKX

Abstract: samsung nc110 samsung nc108 AR5112 TP2322 ELM7S08WS TP2320 smd zG sot 23 TP2323 GND194
Contextual Info: [ Z zhtz|unGwyvwypl{hy€ Y X {opzGkvj|tlu{Gjvu{hpuzGjvumpklu{phs wyvwypl{hy€Gpumvyth{pvuG{oh{Gpz zhtz|unGlslj{yvupjzGjvNzGwyvwly{€U kvGuv{GkpzjsvzlG{vGvyGk|wspjh{lGmvyGv{olyz ljlw{GhzGh|{ovyplkGi€Gzhtz|unU k k jpjospk j i jw|GGGGGGaG ihuphzVkv{ohu j—GzŒ›GaG tjoTtGvkltR

9lprs480bkl

Abstract: TPS5117 MX25L1605DM2I 9lprs4 P4SSMJ24PT-GP 71094 WISTRON RS780M SC10U25V6KX-1GP C3782
Contextual Info: 5 4 3 2 PCB Layer Stackup Ferrari 7 GT Block Diagram DIMM1 D DDR2 SODIMM DIMM2 AMD DDR II 667/800 OUT Power Switch G577BR91U New card Mini Card Port Replicator Giffin S1g2 Socket DDR II 667/800 16x16 L1: Component L2: GND L3: Signal L4: VCC L5: GND L6: Signal

K0321

Abstract: 9lprs WPCE773LA0DG finger probe USB48MHZ g822 1D05V foxconn TPS2231 RT9025-25PSP-GP
Contextual Info: 5 Crystal 14.318MHz 4 2 DDR3 37 15 667/800/1066MHz@1.05V CRT SWITCH PI5C3257QE AGTL+ CPU I/F INTEGRATED GRAHPICS PCIex16 LVDS, CRT I/F 46 ICH9M OZ711MZ030,31 SPI BIOS 4MB 6 PCIe ports 42 PCI/PCI BRIDGE 38 MIC In ACPI 2.0 12 USB 2.0/1.1 ports High Definition Audio

WPC8763

Abstract: RTM875 winbond wpc8763 RTM875-606-LF-GP Sil3531 SC10U25V6KX-1GP hy5rs123235b SCD1U16V2KX-3GP alc662 wistron
Contextual Info: 5 4 ME3 Block Diagram 3 2 Intel CPU D G792 4,5,6 REALTEK RTM875 22 3 5V_S3 DCBATOUT INPUTS 7,8,9,10,11,12 13,14 1D05V_S0 1D8V_S3 nVIDIA DDR I/F LVDS, CRT I/F OUTPUTS 15 DCBATOUT INTEGRATED GRAHPICS DDRII 667 Channel B D MAX8743 Crestline-GM/GML AGTL+ CPU I/F

54B2

Abstract: HH-1M1608-600JT 20B3 diode tp807 TP889 hh-1m1608 RC410M IR 30D1 7E TP828 t9504
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents Sheet 1. COVER Sheet 2 - 7. DIAGRAM Block/Power & ANNOTATIONS

bc733

Abstract: PLW3216S 74BC645 bc732 TSLCX74 BC242 foxconn BC148 pin configuration 6JK3 wistron
Contextual Info: A B C D H2 BLOCK DIAGRAM E 2002/02/18 VER.S2 Project Code Project Code 4 4,5 DESKTOP CPU For ENG Willamette For M/P Northwood 3 CLK GEN ICS 94239 M/B D/D LAUNCH CDROM IR 2ND HDD 0.18u 1.3G~1.5G 0.13u 2.0G~2.4G 6 G768D 48.41T01.001 48.41T02.001 48.41T03.001

TPS5117

Abstract: Toko 10mm WPC8763L NVIDIA G84 C1740 C2068 stac9228x5 C2073 2 webcam Schematic Diagram 0735A
Contextual Info: A B C D E CPU DC/DC Hawke Intel Discrete Block Diagram CLK GEN 1 ICS9LPRS365 ISL6262A Project code : 91.4W1001.001 PCB P/N : 48.4W101.0SA Revision : 07212-SA Intel Mobile CPU 4 Merom 4M FSB:667 or 800 MHz CRT LCD RGB CRT 17 51 GDDRIII 700MHz LVDS 18 HDMI 16

TP212

Abstract: TP230 TP219 TP216 TP218 TP224 TP214 TP242 15VDC TP208
Contextual Info: TOTAL POWER INTERNATIONAL, INC 1 5 WATT SINGLE and DUAL OUTPUT DC - DC CONVERTERS TP200 Series Features: • • • • • • • 50% Efficiency Regulated O utputs PI Input Filter 500 VDC Isolation Low Ripple and Noise Short C ircu it Protection Single and Dual O utput

U4B R950

Abstract: PC MOTHERBOARD GIGABYTE CIRCUIT diagram SCHEMATIC gigabyte MOTHERBOARD CIRCUIT diagram C828 3-pin transistor C1162 transistor C1162 gigabyte g31 MOTHERBOARD SERVICE MANUAL emp3128 transistor C1162 Scheme motorola r1009
Contextual Info: MPC8560 PowerQUICC III Torridon User’s Guide MPC8560UG Rev. 0.1 12/2004 PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE How to Reach Us: Home Page: www.freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370

Contextual Info: REVISION X CLT-1XX-XX-XX-D No OF POSITIONS -02 THRU -50 PER ROW DO NOT SCALE FROM THIS PRINT BODY SPECIFICATION -D: DOUBLE ROW LEAD STYLE -01: THROUGH HOLE (USE C-114-02-XX) (SEE NOTE 7) -03: THROUGH HOLE (USED C-114-03-XX) (NO OF POS x .0787 [2.00]) .005 [.13]

Contextual Info: TABLE 1 STYLE G -X1 -X3 "A" "B" .120 [3.05] .020 [.51] .075 [1.91] .016 [.41] S A M TE C 5 2 0 P A R K E A S T B L V D , N E W A L B A N Y , IN 4 7 1 5 0 P H O N E : 8 1 2 .9 4 4 .6 7 3 3 F A X : 8 1 2 .9 4 8 .5 0 4 7 e -M ail: IN F O @ S A M T E C .C O M

Contextual Info: REVISION H FC5-XX-XX-X-WT-X-XX DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] OPTION -TR: TAPE & REEL PACKAGING OPTION -K: DOT DOT APPLICATOR-KAPTON TAPE USE: K-DOT-.138-.250-.005 (FOR -01 LEAD STYLE ONLY) (SEE NOTE 6) No OF POSITION -15, -20, -25 DO NOT

PT-1-24-14-09

Contextual Info: TABLE 1 STYLE -X1 -X3 "A" "B" .120 [3.05] .020 [.51] .075 [1.91] .016 [.41] S A M TE C 52 0 P A R K E A S T B L V D , N E W A L B A N Y , IN 4 7 1 5 0 P H O N E : 8 1 2 .9 4 4 .6 7 3 3 F A X : 8 1 2 .9 4 8 .5 0 4 7 * e-M ail: IN F O @ S A M T E C .C O M C O D E: 55322

Contextual Info: NOTES: REVISION Q DO NOT SCALE FROM THIS PRINT SAL1-1XX-XX-XX-S-A-XX DESIGNED & DIMENSIONED 1. C REPRESENTS A CRITICAL DIMENSION. IN MILLIMETERS[INCHES] 2. BURR ALLOWANCE: .038[.0015] MAX. 3. MINIMUM PUSHOUT FORCE , CONTACTS, AND WELD TABS: .5 LB. 4. MAXIMUM ALLOWABLE BOW: .05[.002] INCH/INCH AFTER ASSEMBLY.

Contextual Info: REVISION CX DO NOT SCALE FROM THIS PRINT NOTES: SFM-1XX-XX-XXX-D-XXX 1. C REPRESENTS A CRITICAL DIMENSION. 2. MINIMUM PUSHOUT FORCE: .5 LB. C 3. COPLANARITY: .004[0.10] = POS 05 THRU 26 .006[0.15] = POS 27 THRU 50 4. TUBE ALL POSITIONS. PARTS TO BE TUBED WITH