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    TB451 Price and Stock

    STMicroelectronics VD6282TB45-1

    SENSOR OPT AMBIENT
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    DigiKey VD6282TB45-1 Bulk 5,000
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    • 10000 $1.34911
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    Festo ELGR-TB-45-100-0H

    TOOTHED BELT AXIS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey ELGR-TB-45-100-0H Bulk 1
    • 1 $733.08
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    Festo ELGR-TB-45-1000-0H

    TOOTHED BELT AXIS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey ELGR-TB-45-1000-0H Bulk 1
    • 1 $912.58
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    Festo EPCE-TB-45-10-FL-ST-M-H1-PLK-AA

    ELECTRIC CYLINDER UNIT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey EPCE-TB-45-10-FL-ST-M-H1-PLK-AA Bulk 1
    • 1 $803.38
    • 10 $803.38
    • 100 $803.38
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    STMicroelectronics VD6282TB45/1

    ALS (AMBIENT LIGHT SENSOR) - Tape and Reel (Alt: VD6282TB45/1)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas VD6282TB45/1 Reel 53 Weeks, 1 Days 5,000
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    Mouser Electronics VD6282TB45/1
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    Find more TB451 price and stock on Findchips.com

    TB451 Datasheets (8)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    TB451616B121B Tecstar Inductor: Bead: Chip: 120: Bulk Original PDF
    TB451616B121T Tecstar Inductor: Bead: Chip: 120: T/R Original PDF
    TB451616B221B Tecstar Inductor: Bead: Chip: 220: Bulk Original PDF
    TB451616B470T Tecstar Inductor: Bead: Chip: 47: T/R Original PDF
    TB451616B601B Tecstar Inductor: Bead: Chip: 600: Bulk Original PDF
    TB451616B601T Tecstar Inductor: Bead: Chip: 600: T/R Original PDF
    TB451616B680B Tecstar Inductor: Bead: Chip: 68: Bulk Original PDF
    TB451616B680T Tecstar Inductor: Bead: Chip: 68: T/R Original PDF

    TB451 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W5x5.25 5X5 ARRAY 25 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP Rev 1, 2/13 2.000 2.600 ±0.030 X 25X 0.320 ± 0.030 Y E D 2.600 ±0.030 C B 0.500 A 0.10 (4X) 0.300 1 PIN 1 (A1 CORNER) 2 3 4


    Original     		040mm 5M-1994, SPP-010. TB451 com/data/tb/tb451 PDF

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W4x4.16C WLCSP 0.5mm PITCH WAFER LEVEL CHIP SCALE PACKAGE Rev 1, 05/14 1.500 X Y 2.160 ±0.030 0.500 D C 16x 0.320 ±0.030 2.160 ±0.030 B A 0.330 (4X) 1 PIN 1 (A1 CORNER) 0.10 2 4 3 0.330


    Original     		5M-1994, SPP-010. TB451 TB451. PDF

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W8x8.64 8x8 Array 64 Balls Wafer Level Chip Scale Package Rev 0, 4/14 X 4.025 ± 0.030 Y 0.500 64x 0.320 ± 0.030 H G F 4.025 ± 0.030 E D C B 0.263 A 4X 0.10 1 2 3 4 5 6 0.250 PIN 1 (A1 CORNER)


    Original     		060mm ASMEY14 com/data/tb/tb451 PDF

    Untitled

    Abstract: No abstract text available
    Text: 2.5MHz Integrated Power Management IC with I2C Compatible Interface ISL80083 Features ISL80083 is an integrated mini Power Management IC mini-PMIC for powering low-voltage microprocessor, or applications using a single Li-Ion or Li-Polymer cell battery to


    Original     		ISL80083 ISL80083 33MHz 800mA 300mA, 5M-1994, SPP-010. TB451 com/data/tb/tb451 PDF

    Untitled

    Abstract: No abstract text available
    Text: High Efficient 2-Channel White LED Driver for Smartphone Backlighting ISL97698 Features The ISL97698 is a highly integrated 2-channel LED driver for white LED WLED backlit TFT-LCD panels. The device is comprised of a synchronous boost converter and two low-side


    Original     		ISL97698 ISL97698 SPP-010. com/data/tb/tb451 FN8417 PDF

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W9x9.62 9X9 ARRAY 62 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE Rev 0, 2/13 3.200 3.690±0.030 Y 0.400 X I H G F 3.690±0.030 3.200 E 0.400 D C B A 0.10 1 4X TOP VIEW 0.400 3 4 5


    Original     		ASMEY14 SPP-010. com/data/tb/tb451 PDF

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W3x3.9E 3x3 ARRAY 9 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE Rev 0, 8/14 X Y 1.410 ± 0.030 0.400 C 9 x 0.265 ± 0.035 1.410 ± 0.030 B 0.305 A 4X 0.10 1 TOP VIEW 2 3 PIN 1 (A1 CORNER)


    Original     		SPP-010. TB451. PDF

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W5x5.25E 5X5 ARRAY 25 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE With BSC Rev 0, 1/14 Y X 2.070 ± 0.030 25x 0.265 ± 0.035 E D 1.600 C 2.330 ± 0.030 B 0.400 A 0.365 0.10 1 (4X)


    Original     		5M-1994, SPP-010. TB451 tb45/tb451 PDF

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W4x5.20M 20 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP 0.4mm PITCH Rev 0, 01/15 X Y 0.400 1.74 ±0.030 20x 0.265 ±0.035 E D C 2.15 ±0.030 B A (4X) 0.10 PIN 1 (A1 CORNER) TOP VIEW 0.275 1 2


    Original     		SPP-010. TB451. PDF

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W8x9.72A 72 Ball Wafer Level Chip Scale Package WLCSP 0.4mm Pitch Rev 0, 2/15 X Y 0.400 3.270±0.030 J 72x 0.265 ±0.035 H G F E 3.670 ±0.030 D C B 0.2350 A (4X) 0.10 1 TOP VIEW PIN 1 (A1 CORNER)


    Original     		SPP-010. com/data/tb/tb451 PDF

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W7x8.46 7X8 ARRAY 46 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE Rev 0, 11/12 2.400 2.820±0.030 1.600 X 0.400 Y H PRELIMINARY G 0.200 F E 3.310±0.030 2.000 D 2.800 C B A 4X 0.10


    Original     		ASMEY14 SPP-010. com/data/tb/tb451 PDF

    Untitled

    Abstract: No abstract text available
    Text: High Efficiency Buck-Boost Regulator with 4.5A Switches ISL91110 Features The ISL91110 is a high-current buck-boost switching regulator for systems using new battery chemistries. It uses Intersil’s proprietary buck-boost algorithm to maintain voltage regulation


    Original     		ISL91110 ISL91110 5M-1994, SPP-010. TB451 com/data/tb/tb451 FN8434 PDF

    ISL99203IIZ-T

    Abstract: No abstract text available
    Text: ISL99203 Features The ISL99203 is a fully integrated high efficiency class-D mono amplifier combined with a capfree headphone amplifier. It is designed to maximize performance for mobile phone applications while saving valuable board space. The application circuit requires a minimum


    Original     		ISL99203 ISL99203 400mW 5m-1994, SPP-10. com/data/tb/TB451 FN7547 ISL99203IIZ-T PDF

    Untitled

    Abstract: No abstract text available
    Text: DATASHEET Precision Digital Power Monitor with Real Time Alerts ISL28025 Features The ISL28025 is a bidirectional high-side and low-side digital current sense and voltage monitor with a serial interface. The device monitors power supply current and voltage and


    Original     		ISL28025 ISL28025 5M-1994, SPP-010. TB451. FN8388 PDF

    ASME-14

    Abstract: 684Z AN557 ISL84684II ISL84684IIZ-T MAX4684 MAX4685
    Text: ISL84684II Data Sheet November 3, 2005 Ultra Low ON-Resistance, Low Voltage, Single Supply, Dual SPDT Analog Switch in Chipscale Package The Intersil ISL84684II device is a low ON-resistance, low voltage, bidirectional, dual single-pole/double-throw SPDT


    Original     		ISL84684II ISL84684II FN6190 ASME-14 684Z AN557 ISL84684IIZ-T MAX4684 MAX4685 PDF

    AN1238

    Abstract: 14 pin ic dip datasheet all ic datasheet in one pdf file 40 pin dual IC socket 4 pin dip switch ISL84684IIEVAL1 all ic in one file ic 1238 ISL84684II 2 pin dip switch
    Text: ISL84684ii CSP to Dip Converter Board with Mounted IC Application Note January 6, 2006 AN1238.0 Purpose Features The handling and evaluation of tiny chipscale package CSP ICs can be difficult and cumbersome. In a typical lab environment it is impossible to solder the IC on to a PC


    Original     		ISL84684ii AN1238 14 pin ic dip datasheet all ic datasheet in one pdf file 40 pin dual IC socket 4 pin dip switch ISL84684IIEVAL1 all ic in one file ic 1238 2 pin dip switch PDF

    land pattern for WLCSP

    Abstract: JESD 95-1, SPP-010 asme jesd SPP-010 W5x5
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W5x5.25 5X5 ARRAY 25 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP Rev 0, 1/11 2.00 2.60 ±0.05 X 25X 0.32 ± 0.03 Y E D 2.60 ±0.05 2.00 C B 0.50 A d 0.10 (4X) 1 PIN 1 (A1 CORNER) 2 3 4 5 0.50


    Original     		5M-1994, SPP-010. 025mm NS/11 TB451 com/data/tb/tb451 land pattern for WLCSP JESD 95-1, SPP-010 asme jesd SPP-010 W5x5 PDF

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W3x3.9D 3x3 ARRAY 9 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE WITH BSC Rev 0, 1/14 X Y 1.410 ± 0.030 0.400 C 9 x 0.265 ± 0.035 1.410 ± 0.030 B 0.305 A (4X) 0.10 1 TOP VIEW 2 3


    Original     		040BSC SPP-010. TB451 tb45/tb451 PDF

    SPP-010

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W4x4.16E 4X4 ARRAY 16 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE Rev 0, 2/13 X 1.200 1.780±0.030 Y D C 16x 0.265±0.035 1.780±0.030 0.200 B 0.400 A 0.290 1 0.10 TOP VIEW 4X 3 4


    Original     		ASMEY14 SPP-010. com/data/tb/tb451 SPP-010 PDF

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W6x7.42 42 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP 0.40mm PITCH Rev 0, 2/15 X Y 0.400 2.80 ±0.030 G 42x 0.265 ±0.035 F E 3.20 ±0.030 D C B 0.400 A 1 0.10 (4X) PIN 1 (A1 CORNER) 2 4 5 6


    Original     		SPP-010. TB451. PDF

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W4x5.20J 20 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP 0.4mm Pitch  Rev 1, 1/15 X Y 0.400 1.64 ± 0.030 E D 20x 0.265 ±0.035 2.18 ±0.030 C B A (4X) 0.10 PIN 1 (A1 CORNER) TOP VIEW 0.290


    Original     		SPP-010. TB451. PDF

    SPP-010

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W2x2.4 4 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP 0.4mm PITCH Rev 3, 5/15 X 0.975 ±0.020 Y 0.400 B 1.155 ±0.020 4x 0.265±0.035 (4x) 0.10 PIN 1 (A1 CORNER) 0.3775 A 1 2 0.2875 TOP VIEW BOTTOM VIEW


    Original     		SPP-010. com/data/tb/tb451 SPP-010 PDF

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing W11x11.121B 121 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP 0.5mm pitch Rev 0, 2/14 5.526±0.030 X 0.500 Y 121x 0.320±0.030 L K J H G 5.540±0.030 F E D C B 0.270 A (4X) 1 0.10 2 3 4 5 6 7 8


    Original     		W11x11 SPP-010. TB451. PDF

    ipc-cm-770

    Abstract: WLCSP stencil design WLCSP smt X-RAY INSPECTION wlcsp inspection WLCSP chip mount intersil standard part marking WLCSP WLCSP chip attach key pad 3x4
    Text: PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices Technical Brief Introduction There is an industry-wide trend towards using the smallest package possible for a given pin-count. This is driven primarily by the handheld products market where the trend


    Original     		05mmx1 TB451 ipc-cm-770 WLCSP stencil design WLCSP smt X-RAY INSPECTION wlcsp inspection WLCSP chip mount intersil standard part marking WLCSP WLCSP chip attach key pad 3x4 PDF