Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA352 package SOT581-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA352
OT581-1
OT581-1
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BGA352
Abstract: sot581
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA352: plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A AF AE AC AA W U R N L J G E
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BGA352:
OT581-1
BGA352
sot581
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BGA352
Abstract: MS-034 ED-7311-9A
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA352: plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C AF AE AD AC AB AA Y W
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Original
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BGA352:
OT581-1
MS-034
ED-7311-9A
BGA352
MS-034
ED-7311-9A
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PDF
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