Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA352 package SOT581-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA352
OT581-1
OT581-1
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Untitled
Abstract: No abstract text available
Text: E-BGA352-3535-1.27D4 Uniti nn - - H - - 1 April 2004
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E-BGA352-3535-1
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Untitled
Abstract: No abstract text available
Text: BGA352-T-3535-1.27C4 Unit: nn X X c o in +i in c OJ uuuuuuuuuui rgg U U U U U U U U U U L T O = e ^ *-Q 0, 15 S ni . n 1. 27 0, 635 1, 625 i r i 1 A B C D E F G H J K L M N P R T U V V Y AAABACADAEAF 1 oooooiioooooi ooooooooooooí1 2 oooooooooooooooooooooooooo
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TW92X
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Untitled
Abstract: No abstract text available
Text: E-BGA352-3535-1.27D4
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E-BGA352-3535-1
27D4E-BGA352-3535-1
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BGA352
Abstract: sot581
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA352: plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A AF AE AC AA W U R N L J G E
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BGA352:
OT581-1
BGA352
sot581
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SF-BGA352A-B-11
Abstract: No abstract text available
Text: D Package Code: BGA352A C 31.75mm [1.250"] 0.64mm [0.025"] typ. See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] typ. 31.75mm [1.250"] X 1.27mm [0.050"] Top View reference only 2 Ø 0.40mm [Ø 0.0156"] tooling hole X2 (optional)
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BGA352A
SF-BGA352A-B-11
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353512
Abstract: No abstract text available
Text: P-BGA352-3535-1.27 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 3.90 TYP. 2/Oct. 28, 1996
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P-BGA352-3535-1
353512
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Untitled
Abstract: No abstract text available
Text: BGA352-T-3535-1.27D4 Unit: nn X X c o in +i in c OJ uuuuuuuuuui rgg U U U U U U U U U U L T O = e ^ *-Q 0, 15 S ni . n 1. 27 0, 635 1, 625 i r i 1 A B C D E F G H J K L M N P R T U V V Y AAABACADAEAF 1 oooooiioooooi ooooooooooooí1 2 oooooooooooooooooooooooooo
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TW92X
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PBGA352
Abstract: BGA352 P-BGA-352 PBGA3523535
Text: P-BGA352-3535-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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P-BGA352-3535-1
PBGA352
BGA352
P-BGA-352
PBGA3523535
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SF-BGA352B-B-11
Abstract: No abstract text available
Text: C Package Code: BGA352B D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.508 mm [0.020"] dia pads
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BGA352B
FR4/G10
26X26
SF-BGA352B-B-11
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Untitled
Abstract: No abstract text available
Text: T-BGA352-3535-1.27-4 Unit : mm T-BGA352-3535-1.27-4 j»0.75±0.15 l ^ jÿ 0 i m [S [ ABI C1.0 10.635 I OOOOOOOOOOOO OIOOOOOOOOOOOOO o o o o o o o o o o o o olo o o o o o o o o o o o o OOOOOOOOOOOO O'Oo o o o o o o o o o o o o o o o o o o o o o o o olo o o o o o o o o o o o o
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T-BGA352-3535-1
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BGA352
Abstract: MS-034 ED-7311-9A
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA352: plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C AF AE AD AC AB AA Y W
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BGA352:
OT581-1
MS-034
ED-7311-9A
BGA352
MS-034
ED-7311-9A
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LS-BGA352B-11
Abstract: No abstract text available
Text: Tooling hole X2 BGA352B Ø 0.0156" (2x) (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] Top View (reference only) 1.00mm [0.039"] pitch typ. X Variable 0.508 mm [0.020"] dia pads 0.50mm [0.020"] 1 5.33mm [0.210"]
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BGA352B
FR4/G10
LS-BGA352B-11
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PRBG0352DA-A
Abstract: No abstract text available
Text: JEITA Package Code P-BGA352-35x35-1.27 RENESAS Code PRBG0352DA-A D MASS[Typ.] 3.6g A A D1 ZD A1 b S AB e ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 352F7X-A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
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P-BGA352-35x35-1
PRBG0352DA-A
352F7X-A
PRBG0352DA-A
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Untitled
Abstract: No abstract text available
Text: P-BGA352-P-3535-1.27 5 パッケージ材質 ボール材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Sn/Pb 3.90 TYP. 2 版/96.8.12
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P-BGA352-P-3535-1
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IEC968
Abstract: Equator BSP-15 sad transistor A11b BSP-15-400 DRGB 001 A ac3 decoder toslink PAL to ITU-R BT.601/656 Decoder BSP15 BSP-15 IEC958
Text: Datasheet BSP-15 Processor Datasheet Equator Technologies, Inc. Revision H September 6, 2002 Document Number: HWR.BSP15.DS.REV.H Datasheet BSP-15 Processor Datasheet Revision H September 6, 2002 Copyright 2002 Equator Technologies, Inc. All rights reserved.
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BSP-15
BSP15
128-bit
IEC968
Equator BSP-15
sad transistor A11b
BSP-15-400
DRGB 001 A
ac3 decoder toslink
PAL to ITU-R BT.601/656 Decoder
IEC958
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TAS5412
Abstract: TAS5422 audio guide TAS5707 300w stereo amplifier with bass and treble TAS3308 TLV320AIC34 TMS320C6747 purepath studio bass treble using ne5532
Text: Audio Guide Class-AB, Class-D and Class-G Amplifiers, Audio Converters, Clocks, Digital Signal Processing, Interface, Switches and USB Audio www.ti.com/audio 1Q 2009 2 Audio Guide ➔ Table of Contents Audio Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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CG46713
Abstract: CG46194 CG46533 CG46134 CG46104
Text: FUJITSU Novem ber 1995 Edition 1.5 DATA S H E E T : CG/CE46 0.65 Micron High Performance, Low Power CMOS Gate Arrays Description The Fujitsu CG46 is a high performance, 0.65 |im drawn channel length, digital CMOS gate array family. The CE46 is a 0.65 urn drawn channel length, digital CMOS embedded gate array
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CG/CE46
CG46713
CG46194
CG46533
CG46134
CG46104
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130 nm CMOS standard cell library
Abstract: 130 nm CMOS standard cell library fujitsu 130 nm CMOS standard cell library ST
Text: June 1996 Edition 1.1 DATA SHEET : FU JITSU CE56 SERIES 0.5 MICRON HIGH PERFORMANCE/LOW POWER CMOS EMBEDDED ARRA YS DESCRIPTION CE56 SERIES PRODUCT SUMMARY The Fujitsu CE56 is a series of high performance CMOS embedded arrays offering diffused high speed RAMS, ROMS
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374T7Sfc.
cl75b
130 nm CMOS standard cell library
130 nm CMOS standard cell library fujitsu
130 nm CMOS standard cell library ST
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PXB 4325
Abstract: PXB 4310 W25 smd siemens k25 PXB4325E
Text: ICs for Communications ATM Switching Preprocessor ASP PXB 4325 E Version 1.1 Preliminary Data Sheet 08.98 DS 1 PXB 4325 E Revision History: Current Version: 08.98 Previous Version: None Page Page in previous (in current Version Version) Subjects (major changes since last revision)
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Device-List
Abstract: cf745 04 p 24LC211 lattice im4a3-32 CF775 MICROCHIP 29F008 im4a3-64 ks24c01 ep320ipc ALL-11P2
Text: Device List Adapter List Converter List for ALL-11 JUL. 2000 Introduction T he Device List lets you know exactly which devices the Universal Programmer currently supports. The Device List also lets you know which devices are supported directly by the standard DIP socket and which
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ALL-11
Z86E73
Z86E83
Z89371
ADP-Z89371/-PL
Z8E000
ADP-Z8E001
Z8E001
Device-List
cf745 04 p
24LC211
lattice im4a3-32
CF775 MICROCHIP
29F008
im4a3-64
ks24c01
ep320ipc
ALL-11P2
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SMD MARKING CODE 071 A01
Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods
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LCC-26P-M09
LCC-28P-M04
LCC-28P-M05
LCC-28P-M06
LCC-28P-M07
LCC-28C-A04
LCC-32P-M03
LCC-40P-M01
LCC-42P-M01
SMD MARKING CODE 071 A01
smd code 38P
LGA 1155 PIN diagram
MARKING CODE SMD IC A08
L QUAD Aluminum nitride
smd marking m05
LGA 1155 Socket PIN diagram
pitch 0.4 QFP 256p
marking code smd fujitsu
Texas Instruments epoxy Sumitomo
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C495 transistor
Abstract: r3272 MB2100H SN74LVC244A 14pin mc-156 32,768khz m1535d M1535 ah1 c541 c5470 EG-2121CA-125
Text: 4 3 2 1 D C B A D PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE
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VCC12V
IRFL9110
ML310
C495 transistor
r3272
MB2100H
SN74LVC244A 14pin
mc-156 32,768khz
m1535d
M1535
ah1 c541
c5470
EG-2121CA-125
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Bluetooth Energy Meter ckt diagram
Abstract: 94vo r29 Batteries Varta 500 rst 124 Touch pad synaptics Realistic sa-150 rotary encoder EC11 VT82C694X UB133X01 ALC200 humidity temperature sensor sh11
Text: SERVICE MANUAL & TROUBLESHOOTING GUIDE FOR 7170 BY： Richard Wang TESTING TECHNOLOGY DEPARTMENT / TSSC JUL. 2001 7170 N/B MAINTENANCE CONTENTS 1. Hardware Engineering Specification- 3
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FD501
FD504
FD502
FD503
Bluetooth Energy Meter ckt diagram
94vo r29
Batteries Varta 500 rst 124
Touch pad synaptics
Realistic sa-150
rotary encoder EC11
VT82C694X
UB133X01
ALC200
humidity temperature sensor sh11
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