TFBGA180
Abstract: No abstract text available
Text: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm D SOT570-2 A B ball A1 index area A A2 E A1 detail X C e1 e ∅v M C A B b 1/2 e P N M L K J H G F E D C B A ball A1
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TFBGA180:
OT570-2
TFBGA180
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 1/2 e e ball A1 index area P N M L K J H G F E D C B A shape optional 4x y1 C ∅v M C A B
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TFBGA180:
OT570-1
MO-216
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls SOT570-3 A B D ball A1 index area E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b M M C C A B C y y1 C P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 2 3 4 5 6 7 8 9 10 11
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TFBGA180:
OT570-3
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TFBGA180
Abstract: TFBGA-180 e 1220 sot570
Text: PDF: 2000 Nov 02 Philips Semiconductors Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm D SOT570-2 A B ball A1 index area A E A2 A1 detail X C e1 v M B y y1 C ∅w M b e v M A P N M L K J H G F E D C B A
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TFBGA180:
OT570-2
TFBGA180
TFBGA-180
e 1220
sot570
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT570-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA180
OT570-2
OT570-2
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT570-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA180
OT570-1
OT570-1
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PDF
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MO-216
Abstract: SOT-57 TFBGA180 TFBGA-180
Text: PDF: 2003 Jul 17 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 1/2 e e ball A1 index area P N M L K J H G F
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TFBGA180:
OT570-1
MO-216
MO-216
SOT-57
TFBGA180
TFBGA-180
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT570-3 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA180
OT570-3
OT570-3
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm D SOT570-2 A B ball A1 index area A E A2 A1 detail X C e1 e y1 C ∅v M C A B ∅wM C b 1/2 e y P N e M L K J H e2 G F 1/2 e E D C B ball A1 index area A 1
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TFBGA180:
OT570-2
EURO12
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PDF
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TFBGA180
Abstract: No abstract text available
Text: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 1/2 e e P N M L K J H G F E D C B A shape optional 4x
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TFBGA180:
OT570-1
TFBGA180
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PDF
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11-90
Abstract: TFBGA180 sot570
Text: PDF: 2000 Mar 08 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A P N M e L
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TFBGA180:
OT570-1
11-90
TFBGA180
sot570
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PDF
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intel date code marking NAND Flash
Abstract: ARMv5TE instruction set MLC nand 2012 153 ball eMMC memory flash controller usb state machine for ahb to apb bridge iNAND eMMC 4 41 emmc spi bridge emmc bga 162 LPC3130FET180
Text: LPC3130/3131 Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller Rev. 2 — 29 May 2012 Product data sheet 1. General description The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB 2.0 On-The-Go OTG , up to 192 KB SRAM, NAND flash controller, flexible external bus
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LPC3130/3131
ARM926EJ-S
LPC3130/3131
10-bit
LPC3130
intel date code marking NAND Flash
ARMv5TE instruction set
MLC nand 2012
153 ball eMMC memory
flash controller usb
state machine for ahb to apb bridge
iNAND eMMC 4 41
emmc spi bridge
emmc bga 162
LPC3130FET180
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PDF
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LPC2000
Abstract: LPC2458 LPC2458FET180 TFBGA180 m81I
Text: LPC2458 Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface Rev. 02 — 25 November 2008 Product data sheet 1. General description NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bit
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LPC2458
16-bit/32-bit
LPC2458
16-bit/32-bit
128-bit
LPC2000
LPC2000
LPC2458FET180
TFBGA180
m81I
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PDF
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LPC24XX
Abstract: timer video tms 9937 LPC2478FBD208 mst 702 lf LPC2468 pcb LPC2478 ARM7TDMI motor driver ic 7324 LPC247x LPC2478 pcb LPC2468FBD208
Text: UM10237 LPC24XX User manual Rev. 04 — 26 August 2009 User manual Document information Info Content Keywords LPC2400, LPC2458, LPC2420, LPC2460, LPC2468, LPC2470, LPC2478, ARM, ARM7, 32-bit, Single-chip, External memory interface, USB 2.0, Device, Host, OTG, Ethernet, CAN, I2S, I2C, SPI, UART, PWM, IRC,
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UM10237
LPC24XX
LPC2400,
LPC2458,
LPC2420,
LPC2460,
LPC2468,
LPC2470,
LPC2478,
32-bit,
timer video tms 9937
LPC2478FBD208
mst 702 lf
LPC2468 pcb
LPC2478 ARM7TDMI
motor driver ic 7324
LPC247x
LPC2478 pcb
LPC2468FBD208
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PDF
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CE-ATA version 1.1
Abstract: No abstract text available
Text: LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals Rev. 3.5 — 11 October 2012 Preliminary data sheet 1. General description The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embedded
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LPC4350/30/20/10
32-bit
LPC4350/30/20/10
sys146
LPC4350
CE-ATA version 1.1
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PDF
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CE-ATA version 1.1
Abstract: NXP P60
Text: LPC1850/30/20/10 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller Rev. 3.1 — 15 December 2011 Preliminary data sheet 1. General description The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embedded
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LPC1850/30/20/10
32-bit
LPC1850/30/20/10
include54
LPC1850
CE-ATA version 1.1
NXP P60
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PDF
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Untitled
Abstract: No abstract text available
Text: LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals Rev. 2.1 — 23 September 2011 Objective data sheet 1. General description The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embedded
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LPC4350/30/20/10
32-bit
LPC4350/30/20/10
LPC4350
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PDF
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sdram pcb layout
Abstract: No abstract text available
Text: LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals Rev. 3 — 5 December 2011 Objective data sheet 1. General description The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embedded
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LPC4350/30/20/10
32-bit
LPC4350/30/20/10
LPC4350
sdram pcb layout
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PDF
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voltage regulator 7133-1
Abstract: No abstract text available
Text: LPC1850/30/20/10 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller Rev. 3 — 6 December 2011 Preliminary data sheet 1. General description The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embedded
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LPC1850/30/20/10
32-bit
LPC1850/30/20/10
LPC1850
voltage regulator 7133-1
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PDF
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Untitled
Abstract: No abstract text available
Text: LPC1850/30/20/10 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller Rev. 5.1 — 9 August 2012 Preliminary data sheet 1. General description The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embedded
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LPC1850/30/20/10
32-bit
LPC1850/30/20/10
LPC1850
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PDF
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LPC1778FET
Abstract: No abstract text available
Text: LPC178x/7x 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC Rev. 3 — 27 December 2011 Objective data sheet 1. General description The LPC178x/7x is an ARM Cortex-M3 based microcontroller for embedded applications
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LPC178x/7x
32-bit
LPC178x/7x
LPC178X
LPC1778FET
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PDF
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Untitled
Abstract: No abstract text available
Text: LPC1850/30/20/10 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller Rev. 6.1 — 7 February 2013 Product data sheet 1. General description The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embedded
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LPC1850/30/20/10
32-bit
LPC1850/30/20/10
LPC1850
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PDF
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lpc13xx
Abstract: Tag 8506 4440 IC mp3 player circuit diagram emmc EXT_CSD ts 8808 bluetooth mp3 player circuit diagram 339pe
Text: D D R R A A A A A FT FT FT FT FT D R R A A FT FT FT FT A A R R D D D D R R A FT FT FT A A R R D D D R A F FT FT A A R R D D User manual D Rev. 1.03 — 27 May 2010 R R R LPC3130/31 User manual D D D UM10314 D FT FT A A R R D D D R A FT D R A Document information
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UM10314
LPC3130/31
LPC3130,
LPC3131,
lpc13xx
Tag 8506
4440 IC mp3 player circuit diagram
emmc EXT_CSD
ts 8808
bluetooth mp3 player circuit diagram
339pe
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PDF
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lpc43
Abstract: No abstract text available
Text: LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals Rev. 3.4 — 4 September 2012 Preliminary data sheet 1. General description The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embedded
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LPC4350/30/20/10
32-bit
LPC4350/30/20/10
LPC4350
lpc43
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PDF
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