TFBGA180
Abstract: No abstract text available
Text: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm D SOT570-2 A B ball A1 index area A A2 E A1 detail X C e1 e ∅v M C A B b 1/2 e P N M L K J H G F E D C B A ball A1
|
Original
|
TFBGA180:
OT570-2
TFBGA180
|
PDF
|
MO-195
Abstract: TFBGA180 TFBGA-180
Text: PDF: 2001 Jun 25 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 10 x 10 x 0.8 mm A B D SOT640-1 ball A1 index area A E A2 A1 C e1 1/2 e e detail X y y1 C ∅v M C A B b ∅w M C V U e T R P
|
Original
|
TFBGA180:
OT640-1
MO-195
MO-195
TFBGA180
TFBGA-180
|
PDF
|
Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT640-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
|
Original
|
TFBGA180
OT640-1
OT640-1
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 1/2 e e ball A1 index area P N M L K J H G F E D C B A shape optional 4x y1 C ∅v M C A B
|
Original
|
TFBGA180:
OT570-1
MO-216
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls SOT570-3 A B D ball A1 index area E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b M M C C A B C y y1 C P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 2 3 4 5 6 7 8 9 10 11
|
Original
|
TFBGA180:
OT570-3
|
PDF
|
TFBGA180
Abstract: TFBGA-180 e 1220 sot570
Text: PDF: 2000 Nov 02 Philips Semiconductors Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm D SOT570-2 A B ball A1 index area A E A2 A1 detail X C e1 v M B y y1 C ∅w M b e v M A P N M L K J H G F E D C B A
|
Original
|
TFBGA180:
OT570-2
TFBGA180
TFBGA-180
e 1220
sot570
|
PDF
|
Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT570-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
|
Original
|
TFBGA180
OT570-2
OT570-2
|
PDF
|
Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT570-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
|
Original
|
TFBGA180
OT570-1
OT570-1
|
PDF
|
MO-216
Abstract: SOT-57 TFBGA180 TFBGA-180
Text: PDF: 2003 Jul 17 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 1/2 e e ball A1 index area P N M L K J H G F
|
Original
|
TFBGA180:
OT570-1
MO-216
MO-216
SOT-57
TFBGA180
TFBGA-180
|
PDF
|
Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT570-3 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
|
Original
|
TFBGA180
OT570-3
OT570-3
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm D SOT570-2 A B ball A1 index area A E A2 A1 detail X C e1 e y1 C ∅v M C A B ∅wM C b 1/2 e y P N e M L K J H e2 G F 1/2 e E D C B ball A1 index area A 1
|
Original
|
TFBGA180:
OT570-2
EURO12
|
PDF
|
MO-195
Abstract: TFBGA180
Text: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 10 x 10 x 0.8 mm A B D SOT640-1 ball A1 index area A E A2 A1 detail X C e1 e y y1 C ∅v M C A B b 1/2 e ∅w M C V U e T R P
|
Original
|
TFBGA180:
OT640-1
MO-195
MO-195
TFBGA180
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 10 x 10 x 0.8 mm A B D SOT640-1 ball A1 index area A E A2 A1 C e1 e V T P M K H F D B ball A1 index area detail X y y1 C ∅v M C A B b 1/2 e ∅w M C U e R N L e2 J
|
Original
|
TFBGA180:
OT640-1
MO-195
|
PDF
|
TFBGA180
Abstract: No abstract text available
Text: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 1/2 e e P N M L K J H G F E D C B A shape optional 4x
|
Original
|
TFBGA180:
OT570-1
TFBGA180
|
PDF
|
|
|
11-90
Abstract: TFBGA180 sot570
Text: PDF: 2000 Mar 08 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A P N M e L
|
Original
|
TFBGA180:
OT570-1
11-90
TFBGA180
sot570
|
PDF
|
intel date code marking NAND Flash
Abstract: ARMv5TE instruction set MLC nand 2012 153 ball eMMC memory flash controller usb state machine for ahb to apb bridge iNAND eMMC 4 41 emmc spi bridge emmc bga 162 LPC3130FET180
Text: LPC3130/3131 Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller Rev. 2 — 29 May 2012 Product data sheet 1. General description The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB 2.0 On-The-Go OTG , up to 192 KB SRAM, NAND flash controller, flexible external bus
|
Original
|
LPC3130/3131
ARM926EJ-S
LPC3130/3131
10-bit
LPC3130
intel date code marking NAND Flash
ARMv5TE instruction set
MLC nand 2012
153 ball eMMC memory
flash controller usb
state machine for ahb to apb bridge
iNAND eMMC 4 41
emmc spi bridge
emmc bga 162
LPC3130FET180
|
PDF
|
TFBGA180
Abstract: 12MHz oscillator LPC2364 LPC2368 LPC2458 LPC2468 TFBGA100 TFBGA208 Future Designs
Text: SAB-TFBGAxxx SAB-TFBGAxxx Socket Adapter Boards for USB-ICP-LPC2K The SAB-TFBGAxxx Socket Adapter Boards extend the capability of our popular USB In-Circuit Programmer for NXP Semiconductors LPC2xx devices to allow the user to program and test these devices outside of their
|
Original
|
TFBGA100,
TFBGA180
TFBGA208.
12MHz
SAB-TFBGA180
SAB-TFBGA100
SAB-TFBGA208
30-day
TFBGA180
12MHz oscillator
LPC2364
LPC2368
LPC2458
LPC2468
TFBGA100
TFBGA208
Future Designs
|
PDF
|
LPC2000
Abstract: LPC2458 LPC2458FET180 TFBGA180 m81I
Text: LPC2458 Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface Rev. 02 — 25 November 2008 Product data sheet 1. General description NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bit
|
Original
|
LPC2458
16-bit/32-bit
LPC2458
16-bit/32-bit
128-bit
LPC2000
LPC2000
LPC2458FET180
TFBGA180
m81I
|
PDF
|
LPC9221
Abstract: embedded c code to interface lpc2148 with sensor P89V51RD2 microcontroller LPC2148 i2c with sensor LPC925 p89v51rd2 LPC700 LPC2148 p89v51rd2 development board lpc1754
Text: April 2009 The choice for embedded technologies Our microcontroller offering combines the highest performance in Flash with the lowest power consumption in the smallest packages. A comprehensive portfolio of industryleading performers includes the latest 32-bit LPC3000, LPC2000, LPC1000, LH7A, LH7, and 8-bit LPC900, LPC700 and 80C51 families. We offer an easy migration path from
|
Original
|
32-bit
LPC3000,
LPC2000,
LPC1000,
LPC900,
LPC700
80C51
LPC3000
LPC9221
embedded c code to interface lpc2148 with sensor
P89V51RD2 microcontroller
LPC2148 i2c with sensor
LPC925
p89v51rd2
LPC2148
p89v51rd2 development board
lpc1754
|
PDF
|
6800-compatible
Abstract: LPC2888 LPC2880 TFBGA180
Text: AN10549 Design rules and schematics for LPC288x Rev. 02 — 1 June 2007 Application note Document information Info Content Keywords LPC2888, LPC2880, design rules, application schematic Abstract This application note provides design rules and application schematics for
|
Original
|
AN10549
LPC288x
LPC2888,
LPC2880,
LPC288x.
AN10549
6800-compatible
LPC2888
LPC2880
TFBGA180
|
PDF
|
LPC2148 i2c eeprom c code
Abstract: lcd c program using lpc2378 LPC2468 embedded c code to interface lpc2148 with sensor LPC932A1 LPC922 LPC932A lpc921 lpc935 ac motor control LPC2378 instruction cache
Text: August 2008 The choice for embedded technologies Our microcontroller offering combines the highest performance in Flash with the lowest power consumption in the smallest packages. A comprehensive portfolio of industryleading performers includes the latest 32-bit LPC3000, LPC2000, LPC1000, LH7A, LH7, and 8-bit LPC900, LPC700 and 80C51 families. We offer an easy migration path from
|
Original
|
32-bit
LPC3000,
LPC2000,
LPC1000,
LPC900,
LPC700
80C51
LPC3000
LPC2148 i2c eeprom c code
lcd c program using lpc2378
LPC2468
embedded c code to interface lpc2148 with sensor
LPC932A1
LPC922
LPC932A
lpc921
lpc935 ac motor control
LPC2378 instruction cache
|
PDF
|
LPC24XX
Abstract: timer video tms 9937 LPC2478FBD208 mst 702 lf LPC2468 pcb LPC2478 ARM7TDMI motor driver ic 7324 LPC247x LPC2478 pcb LPC2468FBD208
Text: UM10237 LPC24XX User manual Rev. 04 — 26 August 2009 User manual Document information Info Content Keywords LPC2400, LPC2458, LPC2420, LPC2460, LPC2468, LPC2470, LPC2478, ARM, ARM7, 32-bit, Single-chip, External memory interface, USB 2.0, Device, Host, OTG, Ethernet, CAN, I2S, I2C, SPI, UART, PWM, IRC,
|
Original
|
UM10237
LPC24XX
LPC2400,
LPC2458,
LPC2420,
LPC2460,
LPC2468,
LPC2470,
LPC2478,
32-bit,
timer video tms 9937
LPC2478FBD208
mst 702 lf
LPC2468 pcb
LPC2478 ARM7TDMI
motor driver ic 7324
LPC247x
LPC2478 pcb
LPC2468FBD208
|
PDF
|
LCD Module intel 8080
Abstract: movinand nand flash SPI LPC3131 PC 3131 VIA ARM926EJ-S ARM926EJ-S emmc spi bridge ARM926EJ DATA SHEET OF ARM9
Text: D D R R R R A A A A A FT FT FT FT FT D R R A A FT FT FT FT A A R R D D D D R R A FT FT FT A A R R D D D Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller R R R D D D F FT FT A A Preliminary data sheet A Rev. 1.01 — 21 May 2009
|
Original
|
ARM926EJ-S
LPC3130/3131
32-bit
ARM926EJ-S
LPC3130)
LCD Module intel 8080
movinand
nand flash SPI
LPC3131
PC 3131
VIA ARM926EJ-S
emmc spi bridge
ARM926EJ
DATA SHEET OF ARM9
|
PDF
|
LCD interface WITH ARM
Abstract: ARM microcontrollers data sheet ARM7TDMI-S external bus interface unit ALL DATA SHEET ARM v7 arm microprocessor data sheet ARM7 interfacing notes to LCD ARM7 microcontroller pin configuration block diagram of LCD interfacing with ARM7 LPC2880
Text: LPC2880; LPC2888 16/32-bit ARM microcontrollers; 8 kB cache, up to 1 MB flash, Hi-Speed USB 2.0 device, and SDRAM memory interface Rev. 03.01 — 30 January 2008 Product data sheet 1. General description The LPC2880/2888 is an ARM7-based microcontroller for portable applications requiring
|
Original
|
LPC2880;
LPC2888
16/32-bit
LPC2880/2888
LPC2880
LPC2888
LCD interface WITH ARM
ARM microcontrollers data sheet
ARM7TDMI-S external bus interface unit
ALL DATA SHEET
ARM v7
arm microprocessor data sheet
ARM7 interfacing notes to LCD
ARM7 microcontroller pin configuration
block diagram of LCD interfacing with ARM7
|
PDF
|
