Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA100 package SOT598-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA100
OT598-1
OT598-1
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Untitled
Abstract: No abstract text available
Text: U n it nn Feb,2005
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OCR Scan
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0-eifrI-00IVDEJl-dï
0-eifrI-00IVDEJl-d
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TFBGA100
Abstract: MO-216
Text: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm D SOT598-1 A B ball A1 index area A2 A E A1 detail X C e1 e 1/2 e ∅v M C A B b y1 C y ∅w M C K J e H G F e2
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TFBGA100:
OT598-1
MO-216
TFBGA100
MO-216
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Untitled
Abstract: No abstract text available
Text: P-TFBGA100-1415-0.80AZ Unii:» nn Feb.2005
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OCR Scan
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 6 x 6 x 0.8 mm D SOT777-1 A B ball A1 index area A E A2 A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C K J H e G F e2 E 1/2 e D C B A ball A1 index area 1 2
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TFBGA100:
OT777-1
MO-195
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls A B D SOT1329-1 ball A1 index area A E A2 A1 detail X e1 e C 1/2 e C A B C Øv Øw b y y1 C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X 5 mm scale
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TFBGA100:
OT1329-1
sot1329-1
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls B D SOT1012-1 A ball A1 index area E A2 A A1 detail X e1 1/2 e e ∅v ∅w b M M C C A B C y y1 C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X
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TFBGA100:
OT1012-1
MO-195
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm B D SOT926-1 A ball A1 index area A2 E A A1 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2
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TFBGA100:
OT926-1
OT926-17
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm D SOT598-1 A B ball A1 index area A E A2 A1 detail X C e1 e 1/2 e y1 C ∅v M C A B b y ∅w M C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2
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TFBGA100:
OT598-1
MO-216
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PDF
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Untitled
Abstract: No abstract text available
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm D SOT598-1 A B ball A1 index area A2 A E A1 detail X e1 b e C v M B ∅w M y y1 C v M A K J e H G F e1 E D C B
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TFBGA100:
OT598-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA100 package SOT777-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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Original
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TFBGA100
OT777-1
OT777-1
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PDF
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TFBGA100
Abstract: MO-195 sot777
Text: PDF: 2002 Jun 21 Philips Semiconductors Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 6 x 6 x 0.8 mm D SOT777-1 A B ball A1 index area A A2 E A1 detail X C e1 e 1/2 ∅v M e b ∅w M y y1 C C A B C K J H e G F e2
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TFBGA100:
OT777-1
MO-195
TFBGA100
MO-195
sot777
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PDF
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MO-216
Abstract: TFBGA100 sot598
Text: PDF: 2000 Nov 21 Philips Semiconductors Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm D SOT598-1 A B ball A1 index area A2 A E A1 detail X e1 b e C v M B ∅w M y y1 C v M A K J e H G F e1 E D C B
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TFBGA100:
OT598-1
MO-216
MO-216
TFBGA100
sot598
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lpc1769
Abstract: ARM LPC1769 instruction set LPC1768 bootloader lpc1768 gpio lpc1768fbd LPC236 LPC17XX LPC1766 NXP bootloader LPC1768 spi Crystal oscillator 12 MHz
Text: LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN Rev. 9 — 10 August 2012 Product data sheet 1. General description The LPC1769/68/67/66/65/64/63 are ARM Cortex-M3 based microcontrollers for
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LPC1769/68/67/66/65/64/63
32-bit
LPC1769/68/67/66/65/64/63
LPC1768/67/66/65/64/63
LPC1769
ARM LPC1769 instruction set
LPC1768 bootloader
lpc1768 gpio
lpc1768fbd
LPC236
LPC17XX
LPC1766 NXP bootloader
LPC1768 spi
Crystal oscillator 12 MHz
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TFBGA180
Abstract: 12MHz oscillator LPC2364 LPC2368 LPC2458 LPC2468 TFBGA100 TFBGA208 Future Designs
Text: SAB-TFBGAxxx SAB-TFBGAxxx Socket Adapter Boards for USB-ICP-LPC2K The SAB-TFBGAxxx Socket Adapter Boards extend the capability of our popular USB In-Circuit Programmer for NXP Semiconductors LPC2xx devices to allow the user to program and test these devices outside of their
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TFBGA100,
TFBGA180
TFBGA208.
12MHz
SAB-TFBGA180
SAB-TFBGA100
SAB-TFBGA208
30-day
TFBGA180
12MHz oscillator
LPC2364
LPC2368
LPC2458
LPC2468
TFBGA100
TFBGA208
Future Designs
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LPC1768 NXP bootloader
Abstract: LPC1769 fly wheel design detail for motor cycle LPC1768 LPC1768 ADC code example LPC1769FBD100 ARM LPC1769 instruction set ARM processor lpc1768 LPC17X LPC1767FBD100
Text: D D R R R R R D D D A A A A A FT FT FT FT FT D D R R A A FT FT FT FT A A R R D D LPC1769/68/67/66/65/64/63 D R R A FT R R R D D D F FT FT A A Product data sheet A Rev. 6.01 — 11 March 2011 D D FT FT A A R R D 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and
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LPC1769/68/67/66/65/64/63
32-bit
LPC1769/68/67/66/65/64/63
LPC1769
LPC1768 NXP bootloader
fly wheel design detail for motor cycle
LPC1768
LPC1768 ADC code example
LPC1769FBD100
ARM LPC1769 instruction set
ARM processor lpc1768
LPC17X
LPC1767FBD100
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LPC9221
Abstract: embedded c code to interface lpc2148 with sensor P89V51RD2 microcontroller LPC2148 i2c with sensor LPC925 p89v51rd2 LPC700 LPC2148 p89v51rd2 development board lpc1754
Text: April 2009 The choice for embedded technologies Our microcontroller offering combines the highest performance in Flash with the lowest power consumption in the smallest packages. A comprehensive portfolio of industryleading performers includes the latest 32-bit LPC3000, LPC2000, LPC1000, LH7A, LH7, and 8-bit LPC900, LPC700 and 80C51 families. We offer an easy migration path from
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32-bit
LPC3000,
LPC2000,
LPC1000,
LPC900,
LPC700
80C51
LPC3000
LPC9221
embedded c code to interface lpc2148 with sensor
P89V51RD2 microcontroller
LPC2148 i2c with sensor
LPC925
p89v51rd2
LPC2148
p89v51rd2 development board
lpc1754
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vic lpc2378
Abstract: lpc23xx LPC2378 LPC2378 uart LPC2388 16C550 LQFP100 LQFP144 TFBGA100 isp iap
Text: LPC23xx˖ Ѣ ARM7TDMI-S ݙḌⱘ72MHzǃ32ԡ ᖂࠊ఼㋏߫ ᏺ᳝ҹ㔥ǃUSBCAN䆒ⱘARM7 ᖂࠊ఼ 䖭㉏ࡳ㛑ᔎǃ㒣⌢催ᬜⱘᖂࠊ఼ϧЎ䖲ᑨ⫼䆒䅵ˈᬃᣕ10/100ҹ㔥ǃܼ䗳 12 Mbps USB 2.0ষCAN 2.0BষDŽݙ㕂᳔512 KB ISP/IAP䮾ᄬǃ᳔98 KB SRAMǃϔϾ10-ԡA/Dǃ
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LPC23xx
72MHz
72-MHz
LPC2377
LPC2378
LPC2388
LQFP100
LQFP144
vic lpc2378
lpc23xx
LPC2378
LPC2378 uart
LPC2388
16C550
LQFP100
LQFP144
TFBGA100
isp iap
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tray lqfp
Abstract: JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN
Text: ARM-based Flash MCU SAM4S Series SUMMARY DATASHEET Description The Atmel SAM4S series is a member of a family of Flash microcontrollers based on the high-performance 32-bit ARM Cortex ® -M4 RISC processor. It operates at a maximum speed of 120 MHz and features up to 2048 Kbytes of Flash, with optional
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32-bit
tray lqfp
JEDEC qfn tray
QFn Package tray
JEDEC TRAY DIMENSIONS QFN
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LPC2148 i2c
Abstract: BGB210S lpc2148 interfacing 2.8" TFT LCD DISPLAY BGB210 embedded c code to interface lpc2148 with sensor BGW200 TDA8932T tda8920bj NXP PN531 TDA8947J equivalent
Text: Building blocks for vibrant media Highlights of the NXP product portfolio Building blocks for vibrant media At NXP Semiconductors, the new company founded by Philips, we’re driven by a single purpose — to deliver vibrant media technologies that create better sensory experiences.
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OT363
SC-88)
LPC2148 i2c
BGB210S
lpc2148 interfacing 2.8" TFT LCD DISPLAY
BGB210
embedded c code to interface lpc2148 with sensor
BGW200
TDA8932T
tda8920bj
NXP PN531
TDA8947J equivalent
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PDF
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2704B
Abstract: No abstract text available
Text: Features • • • • • • • • • • Low Drop Out Voltage Regulator 4.5V Fixed Output Voltage 4.75V to 5.5V Supply Operation 30 mA Maximum Load Current Less Than 162 µA max Quiescent Current Power-down Mode Consumption Less Than 1 µA More Than 50 dB (Typical) PSRR at 1 kHz
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RE028
2704B
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RE025
Abstract: RE031 TFBGA100
Text: Features • • • • • • • • • • Low-noise Low Drop Out Voltage Regulator Programmable at 2.8V or 2.9V Output Voltages 3V to 5.5V Supply Operation 30 mA Maximum Load Current Power-down Mode Consumption Less Than 1 µA Macrocell for Integration into System-on-chip Products
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RE025
01/02/0M
RE031
TFBGA100
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0.35 um CMOS technology
Abstract: 2705B
Text: Features • • • • • • • • • • Dual Mode Low Drop Out Voltage Regulator 1.8V Fixed Output Voltage 3V to 5.5V Supply Operation 80 mA Maximum Load Current in Full Power Mode Maximum Current Consumption 36 µA in Full Power Mode and 14 µA in Low Power Mode
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RE029
2705B
0.35 um CMOS technology
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VFBGA100
Abstract: ATSAM4SD32BA-MU atsam4s-ek backup mode sam4s ATSAM4SD32CA QFN-64 ATSAM4* Series ATSAM4SD32C
Text: Atmel SAM4S Series Scalable Performance and Memory Density, Power Efficiency Based on the powerful ARM Cortex -M4 processor, the Atmel® SAM4S series extends the Atmel Cortex-M portfolio to offer: • Increased performance and power efficiency • Higher memory densities up to 2MB of Flash and 160KB of SRAM
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160KB
120MHz
VFBGA100
ATSAM4SD32BA-MU
atsam4s-ek
backup mode sam4s
ATSAM4SD32CA
QFN-64
ATSAM4* Series
ATSAM4SD32C
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