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    QFN TRAY POCKET SIZE 5 X 6 Search Results

    QFN TRAY POCKET SIZE 5 X 6 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    SMD-B Coilcraft Inc Test fixture for 1008 - 1812 body sizes Visit Coilcraft Inc Buy
    SMD-D Coilcraft Inc Test fixture for 0402 - 1812 body sizes Visit Coilcraft Inc Buy
    SMD-F Coilcraft Inc Test fixture for 0402 body sizes Visit Coilcraft Inc Buy
    SMD-A Coilcraft Inc Test fixture for 0603 - 1812 body sizes Visit Coilcraft Inc Buy
    SMD-G Coilcraft Inc Test fixture for 0603 - 0805 body sizes Visit Coilcraft Inc

    QFN TRAY POCKET SIZE 5 X 6 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    EPAK TRAY

    Abstract: GP01-D232 JEDEC Kostat Kostat tray kostat qfn 6 x 6 eC3-LGA0909-24-12-F1-L 3M060 Kostat GP01-D232-173 SOT-89-D
    Text: APPLICATION NOTE Tape and Reel Information – RF Modules Production quantities of Skyworks RF Modules are shipped in standard tape and reel format. The enclosed information provides the formats and dimensions for the currently popular sizes. APPLICATION NOTE


    Original     		101568G EPAK TRAY GP01-D232 JEDEC Kostat Kostat tray kostat qfn 6 x 6 eC3-LGA0909-24-12-F1-L 3M060 Kostat GP01-D232-173 SOT-89-D PDF

    JEDEC Matrix Tray outlines

    Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
    Text: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783 PDF

    kostat tray qfn 5 x 3

    Abstract: ePAK kostat qfn 6 x 6 Kostat kostat skyworks 6 x 6 Kostat tray EPAK TRAY kostat skyworks 3 x 3 kostat qfn 9 x 9 kostat 6 x 6
    Text: APPLICATION NOTE Tape and Reel Information – RF Modules Production quantities of Skyworks RF Modules are shipped in standard tape and reel format. The enclosed information provides the formats and dimensions for the popular sizes of current modules. APPLICATION NOTE


    Original     		101568E kostat tray qfn 5 x 3 ePAK kostat qfn 6 x 6 Kostat kostat skyworks 6 x 6 Kostat tray EPAK TRAY kostat skyworks 3 x 3 kostat qfn 9 x 9 kostat 6 x 6 PDF

    IC51-128

    Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
    Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials


    Original     		PDF

    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    90 nm CMOS

    Abstract: HDJD-J822 HDJD-J822-SCR00 HDJD-S831-QT333 QFN-16 part numbering system ic master AV01-0159EN M/VDE 5070
    Text: HDJD-J822-SCR00 Color Management System Feedback Controller Data Sheet Description Features The HDJD-J822 is a CMOS mixed-signal IC designed to be the optical feedback controller of an LED-based lighting system. A typical system consists of an array of red, green and blue LEDs, LED drivers, a tri-color


    Original     		HDJD-J822-SCR00 HDJD-J822 HDJD-J822. 10-bit 12-bit 5989-2180EN 5989-3259EN 90 nm CMOS HDJD-J822-SCR00 HDJD-S831-QT333 QFN-16 part numbering system ic master AV01-0159EN M/VDE 5070 PDF

    PT740 AB

    Abstract: diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48
    Text: Hitachi Semiconductor Package Data Book ADE–410–001G 8th Edition September/2000 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		September/2000 PT740 AB diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48 PDF

    WLCSP smt

    Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
    Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None


    Original     		AN69061 AN69061 WLCSP smt EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition PDF

    PT740 AB

    Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
    Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A PDF

    LGA 1155 Socket PIN diagram

    Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo PDF

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		UG112 UG072, UG075, XAPP427, BFG95 PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G PDF

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 PDF

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance PDF

    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram PDF

    EM260

    Abstract: EM260-RTR Ezsp reference guide 10UF 24MHZ 27PF QFN40 SPI protocol 064321 XAP2b
    Text: EM260 ZigBee/802.15.4 Network Processor This datasheet applies to EmberZNet PRO 3.1 or greater. • • Integrated 2.4GHz, IEEE 802.15.4-compliant transceiver: Standard SPI or UART Interfaces allow for connection to a variety of Host microcontrollers • Non-intrusive debug interface SIF


    Original     		EM260 ZigBee/802 99dBm 20byte 100dBm 120-0260-000J EM260 EM260-RTR Ezsp reference guide 10UF 24MHZ 27PF QFN40 SPI protocol 064321 XAP2b PDF

    cd40001

    Abstract: SN74AHC2G russian transistor cross-reference CD4000 SERIES BOOK NXP 74LVC1G datasheet IC CD 40106 4093 ic for bcd counter sn 16861 741HC REGULATOR IC 7804
    Text: Logic Guide www.ti.com/logic 3Q 2009 2 Logic Guide 2009 ➔ Important Notice Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any


    Original     		PDF

    FB 3306

    Abstract: pcf 817 CD4000 SERIES BOOK BR 8550 sn 16861 7 SEGMENT DISPLAY cd 4511 74 LS 00 Logic Gates pcf 9555 HC 40106 NXP 74LVC1G
    Text: TM Technology for Innovators Logic Selection Guide 2007 2 ➔ Logic Selection Guide Texas Instruments Important Notice Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any


    Original     		PDF

    sdram pcb layout guide

    Abstract: marvell alaska programmers guide
    Text: Cover Marvell PXA27x Processor Family Design Guide Doc. No. MV-S301207-00, Rev. A April 6, 2009 PXA27x Processor Family Design Guide Document Conventions Note Provides related information or information of special importance. Caution Indicates potential damage to hardware or software, or loss of data.


    Original     		PXA27x MV-S301207-00, MV-S301207-00 sdram pcb layout guide marvell alaska programmers guide PDF

    energy tapping identifier wireless data acquisition

    Abstract: mini project using microcontroller toy car CD 5888 CB SMD IC centrifugal washing machine working principle car reverse horn mini project report Microcontroller-based Ultrasonic Distance Meter SKRP 1000 A1 alcohol identifier in automobiles abstract 34993 car chip ic gps clock with MC68HC11 D3
    Text: Sensors Device Data Freescale Semiconductor Reference Manual DL200 REV. 7 1/2007 Freescale Semiconductor DL200 Rev 7, 01/2007 Table of Contents Section One - General Information Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		DL200 DL200 energy tapping identifier wireless data acquisition mini project using microcontroller toy car CD 5888 CB SMD IC centrifugal washing machine working principle car reverse horn mini project report Microcontroller-based Ultrasonic Distance Meter SKRP 1000 A1 alcohol identifier in automobiles abstract 34993 car chip ic gps clock with MC68HC11 D3 PDF

    QFn Package tray

    Abstract: qfn 5 x 5 TRAY qfn 6 x 6 TRAY qfn 3 x 3 TRAY msc1701 qfn 7 x 7 TRAY QFN tray MSA-3032 qfn tray pocket size 5 x 6 QFN Shipping Trays
    Text: REVISIONS REV D E S C R IP T IO N 00 INITIAL RELEASE 01 ADDED NEW PACKAGE - DATE N P /N P G 3 2 APPROVED 1 1 /0 6 /0 6 KK Thee 1 1 /2 9 /0 6 KK Thee DETAIL B BOTTOM VIEW QFN 5X5X1.0 QFN 0 5 0 5 1 0 1 4 3 5 3 NOTE: S C A L LO P IS CENTERED ON SIDE OF TRAY.


    OCR Scan     		MSA-3032. MSC17011 P7-221- MSC-5729 QFn Package tray qfn 5 x 5 TRAY qfn 6 x 6 TRAY qfn 3 x 3 TRAY msc1701 qfn 7 x 7 TRAY QFN tray MSA-3032 qfn tray pocket size 5 x 6 QFN Shipping Trays PDF