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IC51-128 Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005 Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials	Original	PDF
HT 1200-4 Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher	Original	PDF	March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
UPD4011BG Abstract: UPD4011 SC47D ED-7304-1 48 pin ic qfj ED-7407 ED-7500A ED-7419 ED-7401 ED7304 Text: 目次 1. パッケージの標準化 1.1 EIAJ規格 1.2 JEDEC規格 1.3 IEC規格 2. NECにおけるパッケージ名称 3. EIAJにおけるパッケージ・コード 3.1 パッケージ・コードの構成 4. 外形図面用照合文字と寸法表示例	Original	PDF	M7A98 C10535J) SC47D) SC47D NEC2070 RS481) PD4011BGT1 PD4011BG PD421000LA10E1 PD421000LA100 UPD4011BG UPD4011 SC47D ED-7304-1 48 pin ic qfj ED-7407 ED-7500A ED-7419 ED-7401 ED7304
NEC VR4300 Abstract: JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28 Text: High Performance! Contents 目次 1. BGA とは？ ―――――――――――――― 3 2. NEC の BGA は？ ―――――――――――― 3 3. 特徴 ―――――――――――――――――― 4 4. パッケージ写真 ――――――――――――― 6	Original	PDF	208QFP 225BGA 20down 56down 225BGA C13550JJ1V0PF00 NEC VR4300 JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28
PT740 AB Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311 Text: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher	Original	PDF	March/2001 standard-856-8650 PT740 AB PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
smd transistor M7A Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747 Text: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages	Original	PDF	PD41265L-12-E1 PD41256L PD23C32000AGX-$ PD23C32000A smd transistor M7A ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
PT740 AB Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher	Original	PDF	ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A
35 x 35 PBGA, 580 100 balls Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8	Original	PDF	C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
IC 7432 Abstract: IC 7422 SOP EIAJ TYPE II ED-7402-1 7421 IC 7432 ic IC 7424 IC 9715 ED-7305 IC 7421 IC 7402 Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE RELATED STANDARDS 2. IC PACKAGE RELATED STANDARDS The following standards are related to IC package 1 EIAJ (Standards of the Electronic Industries Association of Japan) These standards, published by the Electronic Industries Association of Japan, define the dimensions, characteristics, ratings and test	Original	PDF	ED-7301 ED-7302 ED-7303 ED-7305 ED-7311 ED-7400 ED-7400-1 ED-7400-2 ED-7401-2 ED-7401A IC 7432 IC 7422 SOP EIAJ TYPE II ED-7402-1 7421 IC 7432 ic IC 7424 IC 9715 ED-7305 IC 7421 IC 7402
Datasheet of IC 7432 Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards Text: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type	Original	PDF
PT740 AB Abstract: diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48 Text: Hitachi Semiconductor Package Data Book ADE–410–001G 8th Edition September/2000 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher	Original	PDF	September/2000 PT740 AB diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48