TEXTOOL
Abstract: land pattern BGA 0,50 3M 2380
Text: 3M Textool, 1.0mm pitch, Lidded, BGA Test & Burn-In Sockets Type I, II, III • Highly reliable contact that allows for normal variation in BGA ball-diameter and position. • Low spring-rate design achieves minimal solder ball deformation while allowing up to a 0.2mm
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TS-9100-06
TEXTOOL
land pattern BGA 0,50
3M 2380
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Untitled
Abstract: No abstract text available
Text: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply
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AS4DDR32M72PBG1
32Mx72
333Mbps
23mm-1
208-PBGA
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Untitled
Abstract: No abstract text available
Text: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply
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AS4DDR32M72PBG1
32Mx72
333Mbps
23mm-1
208-PBGA
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18CO
Abstract: No abstract text available
Text: White Electronic Designs W3H64M64E-XSBX ADVANCED* 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Organized as 64M x 64 • 1.0mm pitch
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W3H64M64E-XSBX
18CO
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Untitled
Abstract: No abstract text available
Text: Ball Grid Array BGA Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com Now Available In 0.75mm Pitch Standard Socket (S) • Mates with Standard Adapter (A)
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BGA 731
Abstract: No abstract text available
Text: Ball Grid Array BGA Sockets 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com BGA Sockets Standard Socket (S): • Mates with Standard Adapter (A)
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63Sn/37Pb,
BGA 731
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bail
Abstract: No abstract text available
Text: I ADVANCED Ball Grid Array BGA Sockets » INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@ advintcorp.com • Internet http://www.advintcorp.com Standard S ocket (S):
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63Sn/37Pb,
bail
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Untitled
Abstract: No abstract text available
Text: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE
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Untitled
Abstract: No abstract text available
Text: LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter
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C36000)
ASTM-B-16
63Sn/37Pb
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Untitled
Abstract: No abstract text available
Text: Press Releases CYPRESS INTRODUCES DUAL-PORTS IN BGA PACKAGES 7.2 Gbps FLEx36 Housed in Manufacturing-Friendly 1.0-mm Lead Pitch BGA SAN JOSE, Calif., November 5, 1999 - Cypress Semiconductor Corp. NYSE:CY today announced that the four members of the FLEx36 family of x36 dual-port SRAMs will be offered in 172-ball, 15 mm x
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FLEx36
172-ball,
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BGA reflow guide
Abstract: 1024 ball bga
Text: Ball Grid Array BGA Adapters ADVANCED INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@ advintcorp.com • Internet http://w ww .advintcorp.com BGA Adapters Standard Adapter (A):
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Untitled
Abstract: No abstract text available
Text: True BGA Socket Ball Grid Array Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com PATENTED How It Works Step 1 • Solder True BGA Socket™ to PCB
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coin test box
Abstract: bga socket C17200
Text: True BGA Socket Ball Grid Array Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com PATENTED How It Works Step 1 • Solder True BGA Socket™ to PCB
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63Sn/37Pb,
coin test box
bga socket
C17200
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TQFP 100 PACKAGE footprint
Abstract: 225-pin BGA transistor BF 998 BGA and QFP Package PQFP ALTERA 160 PLCC pin configuration 84 pin plcc ic base 2030 ic 5 pins 256-pin BGA AW 55 IC
Text: Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998 • package options • pin compatibility Advanced • design flexibility Packaging Solutions FineLine BGA • vertical migration • space efficiency • cost-effectiveness
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100-Pin
256-Pin
484-Pin
672-Pin
20-Pin
32-Pin
7000S,
M-GB-ALTERAPKG-01
TQFP 100 PACKAGE footprint
225-pin BGA
transistor BF 998
BGA and QFP Package
PQFP ALTERA 160
PLCC pin configuration
84 pin plcc ic base
2030 ic 5 pins
256-pin BGA
AW 55 IC
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SPARTAN XC2S50
Abstract: XCS10 vq100 FG456 XC2S50 xilinx CS144 CSP144 CS144 xc2s30 pq208 XCS30 PQ208 XC2S15
Text: High volume package solutions guide partanTM families provide the low-cost, high-volume ASIC packages for applications that need low power, small form factors and high reliability. The Chip Scale Package CSP and the Fine Pitch BGA package (FG) provide higher
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Untitled
Abstract: No abstract text available
Text: Ball Grid Array BGA Socketing Systems 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com BGA Socketing Systems Options: Custom Solutions For Virtually Any
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Untitled
Abstract: No abstract text available
Text: ADVANCED aKJA« INTERCONNECTIONS. LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 » Fax 401-823-8723 •Email info@advintcorp.com • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications
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CustomC36000)
ASTM-B-16
63Sn/37Pb
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bt 1696
Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are
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Untitled
Abstract: No abstract text available
Text: Ball Grid Array Sockets True BGA Socket 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com True BGA Socket™ How it Works PATENTED
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Sn/37%
63Sn/37Pb
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RC3002B6
Abstract: TR13 450006
Text: RC Series 3000 Technical Data Features • Integrated Resistor and Capacitor Network Excellent high frequency performance Slim BGA Package 1% Resistor Tolerance Dense packaging solution Significantly reduces component placements • • • • • Description
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RC3001B6TR7
RC3001B6TR13
RC3002B6
TR13
450006
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JEDEC JESD22-B117
Abstract: JESD22-B117 Solder Paste, Indium 5.8 N41 250 y 803 IPC-9504 10k resistor 1/8 watt datasheet hot air bga Solder Paste, Indium 5.1, Type 3 10k resistor 1/4 watt datasheet
Text: RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN & REPORT .4
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63SN 37PB SOLDER
Abstract: No abstract text available
Text: Ball Grid Array Sockets True BGA Socket ADVANCED INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West W arwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 « Fax 401-823-8723 • Email info@ advintcorp.com ♦ Internet h ttp://w vw .advintcorp.com How it Works
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Sn/37%
63Sn/37Pb
63SN 37PB SOLDER
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underfill
Abstract: cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate
Text: Reliability Study of High-Pin-Count Flip-Chip BGA Yuan Li, John Xie, Tarun Verma and Vincent Wang Altera Corp. 101 Innovation Drive, San Jose, CA 95134 ysli@altera.com Abstract A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package
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12x10-6
17x10-6
6x10-6
underfill
cte table flip chip substrate
ansys darveaux
with or without underfill
FR4 substrate height and thickness
cte table bga
cte table
63Sn37Pb
application for bt 151
FR4 substrate
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Untitled
Abstract: No abstract text available
Text: R DS095 v2.6 January 30, 2005 XC2C384 CoolRunner-II CPLD Preliminary Product Specification Features Description • The CoolRunner-II 384-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment
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DS095
XC2C384
384-macrocell
multi256
TQ144
FG324
324-ball
XC2C384-10TQ144I.
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