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    PACKAGE TSOP1 Search Results

    PACKAGE TSOP1 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE TSOP1 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SAMSUNG 834

    Abstract: No abstract text available
    Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm


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    STD131 SAMSUNG 834 PDF

    SAMSUNG 834

    Abstract: pcb design 0,5 mm pitch STD130
    Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm


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    STD130 SAMSUNG 834 pcb design 0,5 mm pitch STD130 PDF

    pcb design 0,5 mm pitch

    Abstract: SAMSUNG 834 QFP PACKAGE thermal resistance package tsop1 12 x 12 fbga thermal resistance
    Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm


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    STDL130 pcb design 0,5 mm pitch SAMSUNG 834 QFP PACKAGE thermal resistance package tsop1 12 x 12 fbga thermal resistance PDF

    WED3DG64126V-D2

    Abstract: No abstract text available
    Text: WED3DG64126V-D2 1GB- 128Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG64126V is a 128Mx64 synchronous DRAM module which consists of sixteen 64Mx8 SDRAM components in TSOP11 package and one 2K EEPROM in an 8- pin TSSOP package for


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    WED3DG64126V-D2 128Mx64 WED3DG64126V 64Mx8 TSOP11 d75D2 100MHz 133MHz WED3DG64126V-D2 PDF

    WED3DG6434V-D2

    Abstract: No abstract text available
    Text: WED3DG6434V-D2 256MB- 32Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG6434V is a 32Mx64 synchronous DRAM module which consists of sixteen 16Mx8 SDRAM components in TSOP11 package and one 2K EEPROM in an 8- pin TSSOP package for


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    WED3DG6434V-D2 256MB- 32Mx64 WED3DG6434V 16Mx8 TSOP11 WED3DG6434V-D2 PDF

    WED3DG6463V-D2

    Abstract: No abstract text available
    Text: WED3DG6463V-D2 512MB- 64Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG6463V is a 64Mx64 synchronous DRAM module which consists of sixteen 32Mx8 SDRAM components in TSOP11 package and one 2K EEPROM in an 8- pin TSSOP package for


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    WED3DG6463V-D2 512MB- 64Mx64 WED3DG6463V 32Mx8 TSOP11 WED3DG6463V-D2 PDF

    A 11101

    Abstract: WED3DG7217V-D2
    Text: WED3DG7217V-D2 128MB- 16Mx72 SDRAM UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG7217V is a 16Mx72 synchronous DRAM module which consists of nine 16Meg x 8 SDRAM components in TSOP11 package, and one 2K EEPROM in an 8- pin TSSOP package


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    WED3DG7217V-D2 128MB- 16Mx72 WED3DG7217V 16Meg TSOP11 WED3DG7217V10D2 WED3DG7217V7D2 WED3DG7217V75D2 A 11101 WED3DG7217V-D2 PDF

    Untitled

    Abstract: No abstract text available
    Text: WED3DG6417V-D1 128MB- 16Mx64 SDRAM, UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG6417V is a 16Mx64 synchronous DRAM module which consists of four 16Meg x 16 SDRAM components in TSOP11 package, and one 2K EEPROM in an 8- pin TSSOP package


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    WED3DG6417V-D1 128MB- 16Mx64 WED3DG6417V 16Meg TSOP11 WED3DG6417V10D1 WED3DG6417V7D1 PDF

    TDS05160

    Abstract: TDS05150 TDS03160 TDS03150 TDSR5150 9999 DIODE tsop1736 TLU02401 BPW2 silver ag wire Bond
    Text: V I^ W Y Vishay Telefunken Table of Package Forms Part Number Package Form Part Number Package Form Part Number Package Form TLBR5410 8 TLHR4401 11 TLMH3100 1 TLDR4400 11 TLHR4405 11 TLMH3101 1 TLDR4900 11 TLHR4600 11 TLMK3100 1 TLDR5400 TLDR5800 8 TLHR4601


    OCR Scan
    TLBR5410 TLDR4400 TLDR4900 TLDR5400 TLDR5800 TLHE4900 TLHE5100 TLHE5101 TLHE5102 TLHE5800 TDS05160 TDS05150 TDS03160 TDS03150 TDSR5150 9999 DIODE tsop1736 TLU02401 BPW2 silver ag wire Bond PDF

    WED3DG6416V-D1

    Abstract: No abstract text available
    Text: WED3DG6416V-D1 128MB- 16Mx64 SDRAM, UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG6416V is a 16Mx64 synchronous DRAM module which consists of eight 8Meg x 16 SDRAM components in TSOP11 package, and one 2K EEPROM in an 8- pin TSSOP package


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    WED3DG6416V-D1 128MB- 16Mx64 WED3DG6416V TSOP11 WED3DG6416V10D1 WED3DG6416V7D1 WED3DG6416V75D1 WED3DG6416V-D1 PDF

    Untitled

    Abstract: No abstract text available
    Text: WED3DG7216V-D1 128MB- 16Mx72 SDRAM, UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG7216V is a 16Mx72 synchronous DRAM module which consists of nine 16Meg x 8 SDRAM components in TSOP11 package, and one 2K EEPROM in an 8- pin TSSOP package


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    WED3DG7216V-D1 128MB- 16Mx72 WED3DG7216V 16Meg TSOP11 WED3DG7216V10D1 WED3DG7216V7D1 PDF

    OTA datasheet for 32v for aerospace

    Abstract: WED3DG7216V-D1
    Text: WED3DG7216V-D1 128MB- 16Mx72 SDRAM, UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG7216V is a 16Mx72 synchronous DRAM module which consists of nine 16Meg x 8 SDRAM components in TSOP11 package, and one 2K EEPROM in an 8- pin TSSOP package


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    WED3DG7216V-D1 128MB- 16Mx72 WED3DG7216V 16Meg TSOP11 WED3DG7216V10D1 WED3DG7216V7D1 OTA datasheet for 32v for aerospace WED3DG7216V-D1 PDF

    TSAL62

    Abstract: TSOP2838 IR TSOP1838 Telefunken ir receiver 38 TSOP1838 "ir reciever" ir tsal62 TSOP1856 TSOP1836
    Text: VISH A Y Vishay Telefunken T Receiver for IR-Remote Control continued Package Dim. Fig- Type Features fQ (kHz) IR Receiver for Standard A pplication in Small Package 74 1 = Out; 2 = GND; 3 = Vs 74 ^ 3 1 = Out; 2 = Vs; 3 = GND TSOP1830 TSOP1830SS3V 30 TSOP1833


    OCR Scan
    FigTSOP1830 TSOP1833 TSOP1836 TSOP1837 TSOP1838 TSOP1840 TSOP2830 TSOP2833 TSOP2836 TSOP2837 TSAL62 TSOP2838 IR TSOP1838 Telefunken ir receiver 38 "ir reciever" ir tsal62 TSOP1856 PDF

    Untitled

    Abstract: No abstract text available
    Text: WED3DG649V-D1 64MB- 8Mx64 SDRAM, UNBUFFERED FEATURES DESCRIPTION n Burst Mode Operation The WED3DG649V is a 8Mx64 synchronous DRAM module which consists of four 8Meg x 16 SDRAM components in TSOP11 package, and one 2K EEPROM in an 8- pin TSSOP package for Serial Presence Detect which are mounted on a 144 Pin SODIMM multilayer FR4 Substrate.


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    WED3DG649V-D1 8Mx64 WED3DG649V TSOP11 WED3DG649V10D1 WED3DG649V7D1 WED3DG649V75D1 100MHz PDF

    K6X1008C2D-GF55

    Abstract: k6x1008c2d-pf55 K6X1008C2D-GF70 k6x1008c2d-bf55 K6X1008C2D-DF55 K6X1008-C2D-BF55 K6X1008C2D-BF70 samsung k6x1008c2d K6X1008C2D-TF70 K6X1008C2D
    Text: K6X1008C2D Family CMOS SRAM Document Title 128Kx8 bit Low Power CMOS Static RAM Revision History Revision No. History Draft Data Remark 0.0 Initial draft July 15, 2002 Preliminary 0.1 Revised - Deleted 32-TSOP1-0820R Package Type. - Added Commercial product.


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    K6X1008C2D 128Kx8 32-TSOP1-0820R 32-SOP-525 32-TSOP1-0820F 0820F) K6X1008C2D-GF55 k6x1008c2d-pf55 K6X1008C2D-GF70 k6x1008c2d-bf55 K6X1008C2D-DF55 K6X1008-C2D-BF55 K6X1008C2D-BF70 samsung k6x1008c2d K6X1008C2D-TF70 PDF

    Untitled

    Abstract: No abstract text available
    Text: TSOP11. Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP11. - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.


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    TSOP11. D-74025 19-Jan-07 PDF

    TSOP12238YA1

    Abstract: No abstract text available
    Text: TSOP12238YA1 Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP12238YA1 - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.


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    TSOP12238YA1 TSOP12238YA1 08-Apr-05 PDF

    Untitled

    Abstract: No abstract text available
    Text: TSOP19238 Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP19238 - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.


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    TSOP19238 TSOP19238 D-74025 22-Jan-07 PDF

    TSAL6200

    Abstract: TSOP18238
    Text: TSOP18238 Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP18238 - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.


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    TSOP18238 TSOP18238 D-74025 21-Jun-06 TSAL6200 PDF

    TSOP14836

    Abstract: TSOP1-48 TSAL6200 TSOP148 TSOP14833 TSOP14838 TSOP14840
    Text: TSOP148. Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP148. - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.


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    TSOP148. D-74025 07-Sep-06 TSOP14836 TSOP1-48 TSAL6200 TSOP148 TSOP14833 TSOP14838 TSOP14840 PDF

    K6X1008C2D-GF70

    Abstract: K6X1008C2D-PQ701 55ns K6X1008C2D K6X1008C2D-DF55 K6X1008C2D-GF55 K6X1008C2D-TF70 K6X1008C2D-B K6X1008C2D-F K6X1008C2D-Q
    Text: K6X1008C2D Family CMOS SRAM Document Title 128Kx8 bit Low Power CMOS Static RAM Revision History Revision No. History Draft Data Remark 0.0 Initial draft July 15, 2002 Preliminary 0.1 Revised - Deleted 32-TSOP1-0820R Package Type. - Added Commercial product.


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    K6X1008C2D 128Kx8 32-TSOP1-0820R 32-SOP-525 32-TSOP1-0820F 0820F) K6X1008C2D-GF70 K6X1008C2D-PQ701 55ns K6X1008C2D-DF55 K6X1008C2D-GF55 K6X1008C2D-TF70 K6X1008C2D-B K6X1008C2D-F K6X1008C2D-Q PDF

    Untitled

    Abstract: No abstract text available
    Text: TSOP14838 Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP14838 - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.


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    TSOP14838 TSOP14838 08-Apr-05 PDF

    Untitled

    Abstract: No abstract text available
    Text: TSOP12238 Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP12238 - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.


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    TSOP12238 TSOP12238 08-Apr-05 PDF

    Untitled

    Abstract: No abstract text available
    Text: TSOP12. Vishay Semiconductors IR Receiver Modules for Remote Control Systems Description The TSOP12. - series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.


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    TSOP12. 08-Apr-05 PDF