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    PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Search Results

    PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH8R316MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -90 A, 0.0064 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH3R10AQM Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 100 V, 120 A, 0.0031 Ω@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    231369

    Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
    Text: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array


    Original     		PDF A80486DX25SX387 32-Bit 168-Lead NG80386SX16SX159 16-Bit 100-Lead 231369 TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package

    Intel 1702 eprom

    Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28
    Text: 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369-1 2-1 1/20/97 6:33 PM CH02LINK.DOC


    Original     		PDF CH02LINK Intel 1702 eprom 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28

    diode databook package outline

    Abstract: sip Connector, Pitch 2.5mm, 4 pin PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC a5501 A5540 Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28 EPROM databook 35 x 35 PBGA, 580 100 balls 64 CERAMIC LEADLESS CHIP CARRIER LCC
    Text: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type – –


    Original     		PDF A5579-01 A5580-01 diode databook package outline sip Connector, Pitch 2.5mm, 4 pin PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC a5501 A5540 Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28 EPROM databook 35 x 35 PBGA, 580 100 balls 64 CERAMIC LEADLESS CHIP CARRIER LCC

    KD 2107

    Abstract: A5515 A5568-01 A54450 PQFP 132 PACKAGE DIMENSION intel A5500-01 A5522-01 A5506 Intel 1702 eprom PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS
    Text: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type A B C


    Original     		PDF A5580-01 KD 2107 A5515 A5568-01 A54450 PQFP 132 PACKAGE DIMENSION intel A5500-01 A5522-01 A5506 Intel 1702 eprom PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS

    416mm

    Abstract: No abstract text available
    Text: PACKAGE OUTLINES Film Package ● Type A TCP：Tape Carrier Package TCP is a package which can easily achieve higher terminal counts, finer terminal pitches and reduced dimensions. It allows flexible pattern design of outer lead shapes and pitches to accept different terminal connections.


    Original     		PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    PC2100R-25330-A1

    Abstract: PC2100R-25330-B1 PC2100R-20330-A1 pc2100r 25330 PC2100R-25330-C1 pc2100r-25330 PC1600R-20220-A1
    Text: HYS 72Dxxx0GR Registered DDR-I SDRAM-Modules 2.5 V 184-pin Registered DDR-I SDRAM Modules 256MB, 512MB & 1 GByte Modules Preliminary Datasheet Rev. 0.98 • 184-pin Registered 8-Byte Dual-In-Line DDR-I SDRAM Module for PC and Server main memory applications


    Original     		PDF 72Dxxx0GR 184-pin 256MB, 512MB 256Mbit 66Lead 72Dxx0x0GR PC200, PC266A PC2100R-25330-A1 PC2100R-25330-B1 PC2100R-20330-A1 pc2100r 25330 PC2100R-25330-C1 pc2100r-25330 PC1600R-20220-A1

    Untitled

    Abstract: No abstract text available
    Text: HYS 72Dxxx0GR Registered DDR-I SDRAM-Modules 2.5 V 184-pin Registered DDR-I SDRAM Modules 256MB, 512MB & 1 GByte Modules Preliminary Datasheet Rev. 0.95 • 184-pin Registered 8-Byte Dual-In-Line DDR-I SDRAM Module for PC and Server main memory applications


    Original     		PDF 72Dxxx0GR 184-pin 256MB, 512MB MO-161 72Dxx0x0GR

    PC133R-333-542-b2

    Abstract: PC133R-333-542 VOLTAGE MO-161 PC133-333 PC133R-333-542 CL 3
    Text: HYS 72Vxx3xxGR PC133 Registered SDRAM-Modules 3.3 V 168-pin Registered SDRAM Modules PC133 128 MByte Module PC133 256 MByte module PC133 512 MByte Module PC133 1 GByte Module PC133 2 GByte Module • 168-pin Registered 8 Byte Dual-In-Line SDRAM Module for PC and Server main


    Original     		PDF 72Vxx3xxGR PC133 168-pin 72and PC133R-333-542-b2 PC133R-333-542 VOLTAGE MO-161 PC133-333 PC133R-333-542 CL 3

    PC2100R-25330-B1

    Abstract: pc2100r-25330 PC2100R-25330-A1 PC2100R-20330-A1 PC2100R-20330-B1 DDR200 DDR266A DDR266B MO-161 PC2100
    Text: HYS 72Dxx0x0GR Registered DDR-I SDRAM-Modules 2.5 V 184-pin Registered DDR-I SDRAM Modules 256MB, 512MB & 1 GByte Modules Preliminary Datasheet Rev. 0.99 • 184-pin Registered 8-Byte Dual-In-Line DDR-I SDRAM Module for PC and Server main memory applications


    Original     		PDF 72Dxx0x0GR 184-pin 256MB, 512MB MO-161 PC2100R-25330-B1 pc2100r-25330 PC2100R-25330-A1 PC2100R-20330-A1 PC2100R-20330-B1 DDR200 DDR266A DDR266B PC2100

    PC133R-333-542

    Abstract: PC133R-333-542-B2 PC133R-333-542-AA MO-161
    Text: HYS 72Vxx3xxGR-7.5 PC133 Registered SDRAM-Modules 3.3 V 168-pin Registered SDRAM Modules PC133 128 MByte Module PC133 256 MByte module PC133 512 MByte Module PC133 1 GByte Module • 168-pin Registered 8 Byte Dual-In-Line SDRAM Module for PC and Server main


    Original     		PDF 72Vxx3xxGR-7 PC133 168-pin TSOPII-54 PC133R-333-542 PC133R-333-542-B2 PC133R-333-542-AA MO-161

    PC133R-333-542-b2

    Abstract: PC133R-333-542 SPEC VOLTAGE MO-161 PC133-333 PC133R-333-542
    Text: HYS 72Vxx3xxGR PC133 Registered SDRAM-Modules 3.3 V 168-pin Registered SDRAM Modules PC133 128 MByte Module PC133 256 MByte module PC133 512 MByte Module PC133 1 GByte Module PC133 2 GByte Module • 168-pin Registered 8 Byte Dual-In-Line SDRAM Module for PC and Server main


    Original     		PDF 72Vxx3xxGR PC133 168-pin 72and PC133R-333-542-b2 PC133R-333-542 SPEC VOLTAGE MO-161 PC133-333 PC133R-333-542

    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


    Original     		PDF

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		PDF CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays

    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		PDF 68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817

    PC133R-333-542-b2

    Abstract: hys72v128320gr PC133R PC133R-333-542 VOLTAGE MO-161 PC133-333 34c02
    Text: HYS 72Vxx3xxGR PC133 Registered SDRAM-Modules 3.3 V 168-pin Registered SDRAM Modules PC133 128 MByte Module PC133 256 MByte module PC133 512 MByte Module PC133 1 GByte Module PC133 2 GByte Module • 168-pin Registered 8 Byte Dual-In-Line SDRAM Module for PC and Server main


    Original     		PDF 72Vxx3xxGR PC133 168-pin 72and PC133R-333-542-b2 hys72v128320gr PC133R PC133R-333-542 VOLTAGE MO-161 PC133-333 34c02

    Untitled

    Abstract: No abstract text available
    Text: HYS 72Vxx3xxGR-7.5 PC133 Registered SDRAM-Modules 3.3 V 168-pin Registered SDRAM Modules PC133 128 MByte Module PC133 256 MByte module PC133 512 MByte Module PC133 1 GByte Module • 168-pin Registered 8 Byte Dual-In-Line SDRAM Module for PC and Server main


    Original     		PDF 72Vxx3xxGR-7 PC133 168-pin TSOPII-54 PC100

    hard disk ATA pcb schematic

    Abstract: usb flash drive circuit diagram sandisk jili eeprom kontron etx circuit diagram hard disk 2,5 ATA pcb schematic laptop led vesa LVDS display 30 pin connector schematic diagram usb flash sandisk jumptec pc104 laptop display LVDS connector pins 40 pin lvds laptop connector
    Text: ETX Component SBC ETX Design Guide Document Revision 1.4 Kontron CONTENTS 1. USER INFORMATION . 2 1.1 Objective. 2


    Original     		PDF

    rs8b

    Abstract: No abstract text available
    Text: Fiber Optics V23833-E0124-A001 V23833-E0134-A001 X2 1310 nm Module 10 Gigabit Pluggable Transceiver Compatible with X2 MSA Issue 1.0b Preliminary Data Sheet Features Standards • Compatible with IEEE 802.3ae -2002 • Compatible with Fibre Channel 10GFC Draft 3.5


    Original     		PDF 3aeTM-2002 10GFC V23833-E0124-A001 V23833-E0134-A001 10GBASE-LR 1200-SM-LL-L rs8b

    L-DIM-184-12

    Abstract: 1350 5 pin diagram PC2100R-20330-M
    Text: HYS 72Dxx5xxGR-7/8-A Low Profile Registered DDR-I SDRAM-Modules 2.5 V Low Profile 184-pin Registered DDR-I SDRAM Modules 256MB, 512MB & 1GByte PC1600 & PC2100 Preliminary Datasheet Revision 0.9 • All inputs and outputs SSTL_2 compatible • 184-pin Registered 8-Byte Dual-In-Line


    Original     		PDF 72Dxx5xxGR-7/8-A 184-pin 256MB, 512MB PC1600 PC2100 L-DIM-184-12 1350 5 pin diagram PC2100R-20330-M

    788862C

    Abstract: 1200-M5E-SN-I INFINEON PART MARKING ES M5E capacitor V23833-F0005-B101 V23833-F0005-B102 V23833-F9909-Z001 ps1208 marking MS
    Text: Fiber Optics V23833-F0005-B101 V23833-F0005-B102 XFP 850 nm Small Form Factor Module 10 Gigabit Pluggable Transceiver Compatible with XFP MSA Rev. 3.1 Preliminary Data Sheet Features Standards • Compatible with IEEE 802.3ae -2002 • Compatible with Fibre Channel 10GFC Draft 3.5


    Original     		PDF V23833-F0005-B101 V23833-F0005-B102 3aeTM-2002 10GFC 10GBASE-SR 1200-M5-SN-I; 1200-M5E-SN-I; 1200-M6-SN-I 788862C 1200-M5E-SN-I INFINEON PART MARKING ES M5E capacitor V23833-F0005-B101 V23833-F0005-B102 V23833-F9909-Z001 ps1208 marking MS

    Untitled

    Abstract: No abstract text available
    Text: SIEMENS 8M x 32 -Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE HYM 328020GD-50/-60 Advanced Information • 8 388 608 words by 32-bit organization • Fast access and cycle time 50 ns access time 90 ns cycle time -50 version 60 ns access time 110 ns cycle time (-60 version)


    OCR Scan     		PDF 328020GD-50/-60 32-bit 328020G D-50/-60 L-DIM-72-2

    M87C196KC

    Abstract: 8XC196KC user manual a5521 80C196KC20 USER MANUAL 8XC196KC manual
    Text: iU D IM D K l^ V i n t e i M87C196KC/M87C196KD 16-BIT HIGH-PERFORMANCE CHMOS MICROCONTROLLERS WITH ON-CHIP EPROM Special Environment M87C196KC— 16 KBytes EPROM, 512 Bytes RAM M87C196KD—32 KBytes EPROM, 1024 Bytes RAM M87C196KC: 16 MHz Operation M87C196KD: 16 and 20 MHz Operation


    OCR Scan     		PDF M87C196KC/M87C196KD 16-BIT M87C196KC-- M87C196KD--32 M87C196KC: M87C196KD: Sources/16 68-Lead M87C196KC 8XC196KC user manual a5521 80C196KC20 USER MANUAL 8XC196KC manual

    Untitled

    Abstract: No abstract text available
    Text: SIEMENS 4M x 32 -Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE HYM 324020GD L -50/-60 Preliminary Information • 72-Pin Small Outline Dual-in-Line Memory Module • 4 0194 034 words by 32-bit organization • Performance: -50 -60 fRC Read / Write Cycle Time


    OCR Scan     		PDF 324020GD 72-Pin 32-bit 1111iiTTTTTTTnrrrii LD06961 fl23SbOS