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Phoenix Contact 3240817 STRAPPING TIE SILVER 2.228'
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	3240817	Bulk			100	1 - 10 - 100 $1.34 1000 $1.34 10000 $1.34	Buy Now
Mouser Electronics	3240817					1 $1.77 10 $1.69 100 $1.53 1000 $1.34 10000 $1.34	Get Quote
Master Electronics	3240817					1 - 10 - 100 $1.34 1000 $1.34 10000 $1.34	Buy Now
Sager	3240817				100	1 - 10 - 100 $1.5 1000 $1.39 10000 $1.34	Buy Now
Dynapar HS35R02408177 Encoder, Heavy Duty, Hollow Shaft, 5/8" Bore, 240 PPR, 10 pin+mating Termination \| Dynapar HS35R02408177
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	HS35R02408177	Bulk		2 Weeks	1	1 $780.02 10 $725.42 100 $725.42 1000 $725.42 10000 $725.42	Get Quote
RS Pro 2408171 (ALTERNATE: 2408171) Stainless Steel Hook Toggle Clamp \| RS PRO 2408171
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	2408171 (ALTERNATE: 2408171)	Bulk		5 Weeks	1	1 $45.29 10 $45.29 100 $45.29 1000 $45.29 10000 $45.29	Get Quote
RS Pro 2408176 (ALTERNATE: 2408176) Toggle Clamp Latch Style 171.8mm Length x 76.1mm Height Zinc Plated Steel \| RS PRO 2408176
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	2408176 (ALTERNATE: 2408176)	Bulk		6 Weeks	1	1 $34.99 10 $34.99 100 $34.99 1000 $34.99 10000 $34.99	Get Quote
RS Pro 2408174 (ALTERNATE: 2408174) Toggle Clamp Latch Style 77mm Length x 31.3mm Height Stainless Steel \| RS PRO 2408174
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	2408174 (ALTERNATE: 2408174)	Bulk		6 Weeks	1	1 $34.99 10 $34.99 100 $34.99 1000 $34.99 10000 $34.99	Get Quote

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240817 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
240817 Abstract: SURFACE MOUNT TECHNOLOGY Text: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,	Original		PDF
SKIIP 33 nec 125 t2 Abstract: skiip 613 gb 123 ct RBS 6302 ericsson SKIIP 513 gb 173 ct THERMISTOR ml TDK 150M pioneer PAL 010a Project Report of smoke alarm using IC 555 doc SKiip 83 EC 125 T1 ericsson RBS 6000 series INSTALLATION MANUAL Ericsson Installation guide for RBS 6302 Text: Discontinued and Superseded Stock Number History. This document contains Discontinued and Superseded Stock Number History. The information is listed in the following format: Stock Number: The original RS Stock Number of the item. Brief Description: The Invoice Description of the item.	Original	734TL UWEB-MODEM-34 HCS412/WM TLV320AIC10IPFB 100MB NEON250 GA-60XM7E BLK32X40 BLK32X42 SKIIP 33 nec 125 t2 skiip 613 gb 123 ct RBS 6302 ericsson SKIIP 513 gb 173 ct THERMISTOR ml TDK 150M pioneer PAL 010a Project Report of smoke alarm using IC 555 doc SKiip 83 EC 125 T1 ericsson RBS 6000 series INSTALLATION MANUAL Ericsson Installation guide for RBS 6302	PDF
intel packaging Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than	Original	CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays	PDF
Side Brazed Ceramic Dual-In-Line Packages Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year	Original		PDF
CERAMIC CHIP CARRIER LCC 68 socket Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a	Original		PDF
dinverter 768r Abstract: G7D-412S Ericsson Installation guide for RBS 6201 OMRON G7d TH3 thermistor 6201 RBS ericsson user manual TMS77C82NL reed relay rs 349-355 i ball 450 watt smps repairing RBS -ericsson 6601 Text: Discontinued and Superseded Stock Number History. This document contains Discontinued and Superseded Stock Number History. The information is listed in the following format: Stock Number: The original RS Stock Number of the item. Brief Description: The Invoice Description of the item.	Original	HEF4527BT HEF4531BT HEF4534BP HEF4534BT MSP-STK430X320 AD9054/PCB AD9054BST-135 IPS521G IPS521S IRL2203S dinverter 768r G7D-412S Ericsson Installation guide for RBS 6201 OMRON G7d TH3 thermistor 6201 RBS ericsson user manual TMS77C82NL reed relay rs 349-355 i ball 450 watt smps repairing RBS -ericsson 6601	PDF
MDM 6600 Abstract: mt 1389 de 2061 D nikko AR9344 bosch AL 1115 CV denso alternator 7805/3A bosch al 1450 dv CATERPILLAR 207-1560 ba 4918 Text: No. 9800-OERF-007 Replaces • Remplace • Substituye No. 9800-OERF-005 Dixie Electric Ltd. OEM CROSS REFERENCE GUIDE DE RÉFÉRENCE GUÍA DE REFERENCIA 2007 Index • Índice AGCO .1	Original	9800-OERF-007 9800-OERF-005 MDM 6600 mt 1389 de 2061 D nikko AR9344 bosch AL 1115 CV denso alternator 7805/3A bosch al 1450 dv CATERPILLAR 207-1560 ba 4918	PDF
132418 Abstract: wiring diagram DOL starter PLC Eaton MCB 044947 - B3.1/4-PKZ0 Text: Moeller series Command and Signalling Motor Applications Product Overview for Machinery Automation Power Management Aerospace Powering Business Worldwide Discover Eaton – a leader in the power management field Since 1911, when our company began trading as a small truck parts	Original	D-53115 CA08103003Z-EN-INT 132418 wiring diagram DOL starter PLC Eaton MCB 044947 - B3.1/4-PKZ0	PDF
programming smt machine Abstract: pick and place robot tank water level control A5668-01 SURFACE MOUNT RESISTOR SMT Process application 741 heat exchanger wired pick and place robot water pumping machine control schematic Text: Leaded Surface Mount Technology SMT 7.1 7 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight, volume, and	Original		PDF
TSOP 56 socket Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817 Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the	Original	68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817	PDF