memory 9652
Abstract: No abstract text available
Text: FOR IMMEDIATE RELEASE Contact: Grant Jones Micron Technology, Inc. 208 368-4400 Web Site URL <http://www.micron.com> Fax-on-demand: (800) 239-0337 MICRON TECHNOLOGY, INC., REPORTS RESULTS FOR THE THIRD FISCAL QUARTER OF 2000 Boise, Idaho, June 22, 2000 - Micron Technology, Inc., today reported quarterly net
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UM 9515
Abstract: D5A-3210 D5A-1100 D5A-2100 D5A-3200 D5A-7400 plunger grease OMRON m5-1 D5A-3310 E39-F4
Text: High-Precision Switch D5A High-Precision Switch for Detecting Micron Unit Displacement H H 1-micron or 3-micron repeat accuracy H 24 VDC solid state output or 12 VDC/ 24 VAC contact output H Solid state output model has LED indicator for ease of monitoring operation
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1-800-55-OMRON
UM 9515
D5A-3210
D5A-1100
D5A-2100
D5A-3200
D5A-7400
plunger grease
OMRON m5-1
D5A-3310
E39-F4
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transistor f422
Abstract: transistor f423 f422 transistor transistor f421 BV09 F423 fet 13187 RJ4B L442 bvoe
Text: CMOS-8LCX 3-VOLT, 0.50-MICRON CMOS GATE ARRAYS CROSSCHECK TEST SUPPORT NEC Electronics Inc. Preliminary Description October 1993 Figure 1. Various CMOS-8LCX Packages NEC’s 3-volt CMOS-8LCX family consists of ultra-high performance, sub-micron gate arrays, targeted for
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50-MICRON
PD658xx
transistor f422
transistor f423
f422 transistor
transistor f421
BV09
F423
fet 13187
RJ4B
L442
bvoe
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IDT ZBT SRAM 1994
Abstract: samsung 10K filing SEC semico 2000F PC2100 general architecture of ddr sdram PC133 registered reference design MT28S4M16 DDR SDRAM Component Micron technology micron dram code
Text: B u y e r s Volume 7, Issue 4 Product and service news for Micron customers 4Q00 MBN Extra: Micron Unveils New Corporate Brand “Micron Buyers News Extra” is your opportunity to hear from Micron’s management team This newsletter contains forwardlooking statements regarding the company and the industry. These particular
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Atmel oak dsp core
Abstract: block diagram for barrel shifter PPAP "saturation arithmetic"
Text: Features • 16-bit Fixed-point Digital Signal Processing DSP Core • Low-power Consumption: • • • • • • • • • • • – 1 mW/MIPS on 0.25-micron CMOS, 2.5V – 0.6 mW/MIPS on 0.20-micron CMOS, 1.8V High Performance: – 80 MIPS at 160 MHz (Typical) on 0.25-micron CMOS, 2.5V
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16-bit
25-micron
20-micron
0876F
Atmel oak dsp core
block diagram for barrel shifter
PPAP
"saturation arithmetic"
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bv0T
Abstract: F423 FV06 RJ4B 83YL-9164B "Single-Port RAM" B00J transistor f423 bewf diode ru4d
Text: CMOS-8L 3-VOLT, 0.50-MICRON CMOS GATE ARRAYS NEC Electronics Inc. Preliminary Description October 1993 Figure 1. Various CMOS-8L Packages NEC’s 3-volt CMOS-8L family consists of ultra-high performance, sub-micron gate arrays, targeted for applications requiring extensive integration and high
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50-MICRON
PD658xx
bv0T
F423
FV06
RJ4B
83YL-9164B
"Single-Port RAM"
B00J
transistor f423
bewf
diode ru4d
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F611
Abstract: L302 L611
Text: NEC Electronics Inc. CMOS-8LH 3.3-Volt, 0.5-Micron CMOS Gate Arrays Preliminary April 1996 Description Figure 1. CMOS-8LH Package Options: BGA & QFP NEC's CMOS-8LH gate-array family consists of ultra-high performance, sub-micron gate arrays, targeted for applications requiring extensive integration and high
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35-micron)
A11169EU1V0DS00
F611
L302
L611
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nec 2561 equivalent
Abstract: f bj04 TBA 931 765 floppy disk controller 78K3 L435 f305 F423 nec 2401 bg05
Text: CB-C7, 5-VOLT 0.8-MICRON CELL-BASED CMOS ASIC NEC Electronics Inc. August 1993 Description CB-C7 cell-based product family is a 0.8-micron drawn process with two- or three-layer metalization and is offered in 22 I/O pad ring step sizes. It is ideal for applications such
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Pc 9571
Abstract: No abstract text available
Text: FOR IMMEDIATE RELEASE Contact: Grant Jones Micron Technology, Inc. 208 368-5781 gcjones@micron.com Web Site URL <http://www.micron.com> Fax-on-demand: (800) 239-0337 MICRON TECHNOLOGY, INC., REPORTS RECORD RESULTS FOR FOURTH FISCAL QUARTER AND FISCAL YEAR 2000
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0.25-um CMOS standard cell library inverter
Abstract: CMOS GATE ARRAY stmicroelectronics OLIVETTI
Text: CB55000 Series HCMOS7 Standard Cells FEATURES • ■ ■ ■ ■ ■ 0.25 micron drawn 0.20 micron effective channel length process , six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided
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CB55000
0.25-um CMOS standard cell library inverter
CMOS GATE ARRAY stmicroelectronics
OLIVETTI
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CMOS
Abstract: hv 102 mos fet transistor varactor diode model in ADS bsim3 ADS varactor diode 0.18 micron 1.8V pspice model BSIM3V3 bsim3 model bsim3 model for 0.18 micron technology for hspice N-Channel jfet 100V depletion
Text: 0.6 m CMOS Process XC06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular Mixed Signal Technology Description Key Features The XC06 Series completes X-FAB‘s 0.6 Micron Modular Mixed Signal Technology with embedded Non Volatile Memory and High Voltage options.
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NEC V30MX
Abstract: 8255a Max mode system in 8086 microprocessor v 12719 40673 71055 Rambus ASIC Cell 40673 cmos marking code C76 verilog code for 8254 timer IC Ensemble
Text: CB-C8 3-VOLT, 0.5-MICRON CELL-BASED CMOS ASIC NEC Electronics Inc. July 1994 Description Figure 1. Typical CB-C8 Series Cell-Based ASIC NEC’s 3-volt CB-C8 cell-based ASIC series are ultra-high performance sub-micron CMOS products built within the OpenCAD Design SystemTM of NEC. The family allows
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TF-680
Abstract: L302 FV09 macros in embedded computing
Text: DATA SHEET QB-8 / QB-8E 3.3 Volt , 0.44-Micron Gate-Array Description NEC’s 3.3V QB-8 family consists of ultra-high performance, sub-micron gate arrays, targeted for applications requiring high speeds and low power dissipation. The QB-8 family offers not
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44-Micron
TF-680
L302
FV09
macros in embedded computing
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spice model Tunnel diode
Abstract: dpsN TUNNEL DIODE spice model
Text: 0.6 µm Process XT06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular Trench Isolated SOI CMOS Technology Description The XT06 Series completes X-FAB's 0.6 Micron Modular Mixed Signal Technology. XT06 uses dielectric isolation on SOI wafers. This allows unrestricted 60 V high and low side operation
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0.6 um cmos process
Abstract: bsim3 Trench MOS Schottky Rectifier MICRON POWER RESISTOR Mos BSIM3 SOI pmos 60V-20 MICRON RESISTOR Mos MOS RM3 P-Channel Depletion Mosfets
Text: 0.6 µm Process XT06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular Trench Isolated SOI CMOS Technology Description The XT06 Series completes X-FAB's 0.6 Micron Modular Mixed Signal Technology. XT06 uses dielectric isolation on SOI wafers. This allows unrestricted 60 V high and low side operation
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PALMDSPCORE
Abstract: No abstract text available
Text: Features • 16-bit Fixed-point Advanced Digital Signal Processing DSP Core • High Performance: • • • • • • • • • • • • • – 210 MHz (typical) on 0.18-micron CMOS, 1.8V – 3800 MOPS (3.8 GOPS) - Peak Performance on 0.18-micron CMOS
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16-bit
18-micron
03/01/0M
PALMDSPCORE
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MIPS32 cache
Abstract: 4KEC MIPS32 Mips MIPS32 application MIPS64 MIPS32 memory interface MIPS32 instruction set
Text: FlexCore MIPS32 4KEc™ 32-bit RISC Processor Cores OVERVIEW FEATURES AND BENEFITS LSI Logic offers FlexCore MIPS32 4KEc processor cores available on both our Gflx™ 0.11 micron drawn and G12™ 0.18 micron (drawn) high performance process technologies, and fully configured to individual customer needs.
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MIPS32TM
32-bit
MIPS32
G12TM
MIPS32 cache
4KEC
Mips
MIPS32 application
MIPS64
MIPS32 memory interface
MIPS32 instruction set
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netronics
Abstract: D link adsl modem board Hitachi Stacked CSP Stanford plasma tv ic fujitsu lvds standard Plasma Display Panel PLASMA tv datasheet MB86060 MB86613
Text: F A L L 2 0 0 0 Fujitsufocus The News on the Latest Semiconductor Technologies and Products From Fujitsu Microelectronics, Inc. Revolutionary 0.11 Micron Technology A breakthrough in ASIC solutions, Fujitsu’s new 0.11 micron process technology combines the lowest power, fastest transistor and most compact memory in the
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32-bit
CORP-NL-20840-09/2000
netronics
D link adsl modem board
Hitachi Stacked CSP
Stanford
plasma tv ic
fujitsu lvds standard
Plasma Display Panel
PLASMA tv datasheet
MB86060
MB86613
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LPDDR2 PoP
Abstract: LPDDR2 micron lpddr2 lpddr2 datasheet 216-ball LPDDR lpddr2 nand mcp Micron 512MB nand FLASH 136-Ball 168-ball LPDDR Micron NAND
Text: A Perfect Match for Matchless Performance Micron Multichip Packages Form Factor, Speed, Power. Choose All That Apply. Form factor, speed, power—your mobile customers want all three. With Micron’s MCPs, you can respond to customers’ everincreasing demands without compromising leading-edge performance. Mix and match devices, configurations, and package
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northbridge circuit pentium 4
Abstract: intel i5 block diagram cache organization of intel 8086 430TX LM75 430tx intel INTEL 430TX INTEL confidential pentium temperature sensor interface with 8086 pb sram
Text: INTEL PENTIUM PROCESSOR WITH MMX TECHNOLOGY MOBILE MODULE ON .25 MICRON n n n n n Intel Pentium® Processor with MMX™ Technology on .25 Micron running at 166/200/233/266 MHz n Second-level cache of pipeline burst SRAM Burst read/write at 3-1-1-1; back-to-back
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430TX
northbridge circuit pentium 4
intel i5 block diagram
cache organization of intel 8086
LM75
430tx intel
INTEL 430TX
INTEL confidential pentium
temperature sensor interface with 8086
pb sram
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d 65632
Abstract: 65612 nec L302 CMOS Transmission gate Specifications nec cmos CMOS-5 NEC OPENCAD CMOS Block library 700-207
Text: CMOS-6/ 6A/6V/6X 1.0-MICRON CMOS GATE ARRAYS NEC NEC Electronics Inc. February 1995 Description Figure 1. Sample CMOS-6/6A/6 V/6X Packages NEC’s CMOS-6 gate array families CMOS-6, CMOS6A, CMOS-6V and CMOS-6X are high performance, sub-micron effective channel length CMOS products
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uPD65801
Abstract: uPD65800 UPD65804
Text: CMOS-8 5-VOLT, 0.6-MICRON CMOS GATE ARRAYS NEC NEC Electronics Inc. August 1995 Figure 1. Sample CMOS-8 Packages Description NEC’s 5-volt CMOS-8 family are high performance, sub micron gate arrays, targeted for applications requiring e xtensive in te g ra tio n and high speeds. The device
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H27SSS
uPD65801
uPD65800
UPD65804
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8251a usart interface from z80
Abstract: 72065B verilog code for 8254 timer NEC V30MX Rambus ASIC Cell OPENCAD CMOS Block library nec floppy circuit NEC 71059 NEC 71051 V30MX
Text: CB-C8 3-VOLT, 0.5-MICRON CELL-BASED CMOS ASIC NEC NEC Electronics Inc. July 1994 Description Figure 1. Typical CB-C8 Series Cell-Based ASIC NEC’s 3-volt CB-C8 cell-based ASIC series are ultra-high performance sub-micron CMOS products built within the OpenCAD Design System of NEC. The family allows
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TMXP-200
L427525
8251a usart interface from z80
72065B
verilog code for 8254 timer
NEC V30MX
Rambus ASIC Cell
OPENCAD CMOS Block library
nec floppy circuit
NEC 71059
NEC 71051
V30MX
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CMOS-6A
Abstract: F223 65630 F304 f422 F501 MOS l442 bt08 700201 L421 Marking
Text: NEC CM OS-6/6 A 1.0-MICRON CMOS g a t e a r r a y s NEC Electronics Inc. PRELIM INARY Description February 1990 Figure 1. Sample CMOS-6 Packages NEC’s CMOS-6 gate array families CMOS-6, CMOS6A are ultra-high performance, sub-micron channel length CM OS p ro du cts crea ted fo r h ig h -in te g ra tio n A S IC
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IP-8090
CMOS-6A
F223
65630
F304
f422
F501 MOS
l442
bt08
700201
L421 Marking
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