200B
Abstract: 24LC01B 24LC02B DK-2750 RG41
Text: M 24LC01B/02B MODULES 1K/2K I2C Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 Compliant pad locations • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V • Organized as a single block of 128 bytes 128 x 8
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24LC01B/02B
200B
24LC01B
24LC02B
DK-2750
RG41
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24LC08B
Abstract: 200B 24LC16B
Text: M 24LC08B/16B MODULES 8K/16K I2C Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 compliant contact locations • Single supply with operation from 2.5-5.5V • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V
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24LC08B/16B
8K/16K
400kHz
DS21224A-page
24LC08B
200B
24LC16B
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SMARTCARD micromodule assembly
Abstract: No abstract text available
Text: D5, D7 MICROMODULES Smartcard MCU Dual Modules General Information on D5 and D7 Packaging DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.
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SMARTCARD micromodule assembly
Abstract: emv 7816 smartcard
Text: D3, D4 MICROMODULES Smartcard MCU Modules General Information on D3 and D4 Packaging DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.
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SMARTCARD micromodule assembly
Abstract: sgs thomson ST14C04C
Text: MICROMODULES SMART CARD IC’s EMBEDDING PROCESS BRIEF DATA INTRODUCTION The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.
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24LC02B Modules
Abstract: 24lc01b 200B 24LC02B 24LC01B Modules I2C EEPROM 1kbit
Text: M 24LC01B/02B MODULES 1K/2K I2C Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 Compliant pad locations • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V • Organized as a single block of 128 bytes 128 x 8
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24LC01B/02B
DS21222A-page
24LC02B Modules
24lc01b
200B
24LC02B
24LC01B Modules
I2C EEPROM 1kbit
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ISO 14443-1
Abstract: SMARTCARD micromodule assembly MICROMODULES SMARTCARD micromodule ST16R820 ST16RF52 ST16RF58 ST19RF08
Text: D5, D7 MICROMODULES Smartcard MCU Dual Modules General Information on D5 and D7 Packages DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.
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MIL-STD 833 test method 3015
Abstract: ST1305 M14C04 M14C16 ST1200 ST1305B ST1331 ST1333 ST1335 ST1336
Text: D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side contact side – Support for the chip
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microtune tuner module
Abstract: MT1530 microtune MT1230
Text: M I C R O T U N E CABLE MODEM AND DIGITAL APPLICATIONS 4900 SERIES RF TUNER MICROMODULES APPLICATIONS • Cable modems CM • Cable telephony • Digital cable systems FEATURES • Input frequency ranges: 50 MHz to 860 MHz (US) 70 MHz to 862 MHz (EU)
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MT1530
MT1230
PB-00027
microtune tuner module
microtune
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SMARTCARD micromodule assembly
Abstract: MICROMODULES SMARTCARD ST16CF54 ST16SF42 ST16600 ST16601 ST16SF41 ST16SF44 ST16SF48
Text: D3, D4 MICROMODULES Smartcard MCU Modules General Information on D3 and D4 Packages DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.
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SMARTCARD micromodule assembly
Abstract: ISO 14443-1 MICROMODULES micromodule SMARTCARD ST16R820 ST16RF52 ST16RF58 ST19RF08
Text: D5, D7 MICROMODULES Smartcard MCU Dual Modules General Information on D5 and D7 Packages DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.
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D68 package information micromodule
Abstract: MICROMODULES T4X diode uv-tape SO20 TQFP44
Text: SMARTCARD MCU Ordering Information For Package And Delivery DATA BRIEFING INTRODUCTION The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – micromodules, – flat packages, – wafers.
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AI02171
D68 package information micromodule
MICROMODULES
T4X diode
uv-tape
SO20
TQFP44
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SMARTCARD micromodule assembly
Abstract: ST14C02 M14C04 M14C16 M14C32 M14C64 ST1200 ST1305B ST1331 ST1333
Text: SUPER 35 MM MICROMODULES Super 35 mm Micromodules for Smartcards and Memory Cards DATA BRIEFING • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side 1 1 1 1 1 1 – Support for the chip
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2702 eprom
Abstract: ST1305B ST1331 ISO/IEC 7816-1 micromodule MICROMODULES M14C04 M14C16 ST1200 ST1333
Text: D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side contact side – Support for the chip
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040-305
Abstract: 24lc08b 24LC16 200B 24LC16B DK-2750 RG41 tray drawing
Text: M 24LC08B/16B MODULES 8K/16K I2C Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 compliant contact locations • Single supply with operation from 2.5-5.5V • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V
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24LC08B/16B
8K/16K
400kHz
040-305
24lc08b
24LC16
200B
24LC16B
DK-2750
RG41
tray drawing
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SMD CAPACITORS color code
Abstract: RRM12B ECRKN030G61 ECRKN010 ECRKN ECRKN020 XN400 ECRKN020E61 N1200 ECRKN030G
Text: Adjustable pre-set Ceramic Capacitors(Series K) Chip Type Adjustable(pre-set) Ceramic Capacitors K Series: Series K is 3 mm square, surface mounting device. n Recommended Applications n Features l Hybrid IC and micromodules l Portable radios and cassette tape players
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ECRKN111161X
ECRKN111161W
ET-7200
RRM12B
SMD CAPACITORS color code
RRM12B
ECRKN030G61
ECRKN010
ECRKN
ECRKN020
XN400
ECRKN020E61
N1200
ECRKN030G
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ET-7
Abstract: ecrkn030g61
Text: Adjustable pre-set Ceramic Capacitors(Series K) Chip Type Adjustable(pre-set) Ceramic Capacitors Series: K Series K is 3 mm square, surface mounting device. n Recommended Applications n Features l Hybrid IC and micromodules l Portable radios and cassette tape players
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ECRKN111161X
ECRKN111161W
ET-7200
RRM12B
ET-7
ecrkn030g61
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SMARTCARD micromodule assembly
Abstract: stmicroelectronics traceability MICROMODULES ST16RF42 ST16600 ST16601 ST16R820 ST16RF58 STMicroelectronics TRACEABILITY code ST16SF42
Text: Micromodules for Smartcards SECURITY AND TRACEABILITY Security is the key issue for all Smartcards, The security provided by STMicroelectronics extends from chip design to wafer fabrication and now includes micromodule assembly and final testing. All based
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FLSC0014/0400
ST16600
ST16601
ST16R820
ST16RF42
ST16RF58
ST16RF/HF52
ST16SF41
ST16SF42
ST16SF44
SMARTCARD micromodule assembly
stmicroelectronics traceability
MICROMODULES
ST16RF42
ST16600
ST16601
ST16R820
ST16RF58
STMicroelectronics TRACEABILITY code
ST16SF42
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7816 GPIO
Abstract: 7816 SMARTCARD spi 7816 ST19NA18 st19wl34 SO20 ST19 ST19WSC8 ST22
Text: Smartcard ICs for pay-TV Conditional access and content protection STMicroelectronics is the world’s leading supplier of ICs for pay-TV and conditional access, and has extensive experience supplying 8- and 32-bit secure microcontrollers for conditional access to pay-TV solution providers. ST’s latest solutions are
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32-bit
7816-12/CCID/SPI/
FLPAYTV1105
7816 GPIO
7816
SMARTCARD
spi 7816
ST19NA18
st19wl34
SO20
ST19
ST19WSC8
ST22
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24LC02B Modules
Abstract: No abstract text available
Text: 24LC01B/02B MODULES 1K/2K I2C Serial EEPROMs in ISO Micromodules CROCHIP FEATURES ISO MODULE LAYOUT • ISO 7816 Compliant pad locations • Low power CMOS technology - 1 mA active current typical - 1 0 ^ standby current typical at 5.5V • Organized as a single block of 128 bytes 128 x 8
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24LC01B/02B
DS21222A-page
24LC02B Modules
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Untitled
Abstract: No abstract text available
Text: 24LC08B/16B MODULES M ic r o c h ip 8K/16K I 2C Serial EEPROMs in ISO Micromodules FEATURES ISO MODULE LAYOUT • ISO 7816 compliant contact locations • Single supply with operation from 2.5-5.5V • Low power CMOS technology - 1 mA active current typical
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24LC08B/16B
8K/16K
400kHz
DS21224A-page
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Untitled
Abstract: No abstract text available
Text: 24LC01B/02B MODULES 1K/2K I2C Serial EEPROMs in ISO Micromodules C R O C H IP FEATURES ISO MODULE LAYOUT • ISO 7816 Compliant pad locations • Low power CMOS technology - 1 mA active current typical - 10 nA standby current typical at 5.5V • Organized as a single block of 128 bytes 128 x 8
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PDF
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24LC01B/02B
DS21222A-page
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Untitled
Abstract: No abstract text available
Text: M 24LC08B/16B MODULES ic r o c h ip 8K/16KI2C Serial EEPROMs in ISO Micromodules ISO MODULE LAYOUT FEATURES • ISO 7816 compliant contact locations • Single supply with operation from 2.5-5.5V • Low power CMOS technology V dd - 1 mA active current typical
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24LC08B/16B
8K/16KI2Câ
400kHz
DS21224A-page
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U2740B-FP
Abstract: NPN planar RF transistor 16 bit ic rf encoder programmable read write transponder transistor C892 e5550F-S8 M44C0W RF ENCODER RF 125khz receiver ir preamplifier
Text: Tem ic S e m i c o n d u c t o r s Selector Guide Remote Control Part Number Function Key Features Package IR Transm itter / Receiver BPV23NF PIN diode IR photo detector, 875 to 950 nm, sensitivity typical 65 ^A TSHA520. IR emitter family High efficiency, ± 12°, 875 nm
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BPV23NF
TSHA520.
TSHA550.
U426B-FP
U2535B-FP
U2538B-FP
BFQ62
QFP64
PLCC44
DIP40
U2740B-FP
NPN planar RF transistor
16 bit ic rf encoder
programmable read write transponder
transistor C892
e5550F-S8
M44C0W
RF ENCODER
RF 125khz receiver
ir preamplifier
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