Model 82 Material Declaration
Abstract: BI Technologies
Text: 10/3/2013 LF and non-LF option content are identical after 2/1/2005 Prepared by Eric Arnold 714 447-2565 No content is banned per E.U. RoHS. Average mass of 82 trimmer is 0.34 gram each. Weights above 1 milligram rounded to the nearest mg. Values less than 1 milligram given in scientific notation.
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f303-86-2
94E-06
00E-06
4E-07
08E-06
23E-04
60E-05
66E-06
23E-05
Model 82 Material Declaration
BI Technologies
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SRAM Cross References
Abstract: UT9Q512K8 SRAM SAMSUNG UT8Q512K8 36E-4 weibull test data 19E4
Text: Single Event Effects Qualification UT8Q512K8 RQ02 Lot 6ZVL04 4Mbit SRAM 7/21/03 Craig Hafer 719-594-8319 craig.hafer@aeroflex.com SUMMARY-Single event effects qualification testing was performed on the UTMC 4Mbit SRAM, (Samsung Rev C die), Lot 6ZVL04, at the Lawrence Berkeley Laboratory using
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UT8Q512K8
6ZVL04
6ZVL04,
88-inch
5E-11
9E-10
3E-09
7E-08
0E-11
SRAM Cross References
UT9Q512K8
SRAM SAMSUNG
UT8Q512K8
36E-4
weibull test data
19E4
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Untitled
Abstract: No abstract text available
Text: SCA620-EF8H1A Product Specification SCA620-EF8H1A SINGLE AXIS ACCELEROMETER WITH ANALOG INTERFACE The SCA620 accelerometer consists of a silicon bulk micro machined sensing element chip and a signal conditioning ASIC. The chips are mounted on a pre-molded package and wire bonded to appropriate contacts.
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SCA620-EF8H1A
SCA620-EF8H1A
SCA620
J-STD020B.
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Untitled
Abstract: No abstract text available
Text: SCA610-E28H1A Datasheet SCA610-E28H1A SINGLE AXIS ACCELEROMETER WITH ANALOG INTERFACE The SCA610 accelerometer consists of a silicon bulk micro machined sensing element chip and a signal conditioning ASIC. The chips are mounted on a pre-molded package and wire bonded to appropriate contacts.
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SCA610-E28H1A
SCA610-E28H1A
SCA610
J-STD020B.
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Untitled
Abstract: No abstract text available
Text: SCA620-EF8H1A Product Specification SCA620-EF8H1A SINGLE AXIS ACCELEROMETER WITH ANALOG INTERFACE The SCA620 accelerometer consists of a silicon bulk micro machined sensing element chip and a signal conditioning ASIC. The chips are mounted on a pre-molded package and wire bonded to appropriate contacts.
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SCA620-EF8H1A
SCA620-EF8H1A
SCA620
J-STD020B.
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Untitled
Abstract: No abstract text available
Text: SCA620-EF8H1A Product Specification SCA620-EF8H1A SINGLE AXIS ACCELEROMETER WITH ANALOG INTERFACE The SCA620 accelerometer consists of a silicon bulk micro machined sensing element chip and a signal conditioning ASIC. The chips are mounted on a pre-molded package and wire bonded to appropriate contacts.
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SCA620-EF8H1A
SCA620-EF8H1A
SCA620
J-STD020B.
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PDF
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Untitled
Abstract: No abstract text available
Text: SCA610-E28H1A Datasheet SCA610-E28H1A SINGLE AXIS ACCELEROMETER WITH ANALOG INTERFACE The SCA610 accelerometer consists of a silicon bulk micro machined sensing element chip and a signal conditioning ASIC. The chips are mounted on a pre-molded package and wire bonded to appropriate contacts.
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SCA610-E28H1A
SCA610-E28H1A
SCA610
J-STD020B.
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Untitled
Abstract: No abstract text available
Text: SCA620-EF1V1B Datasheet SCA620-EF1V1B SINGLE AXIS ACCELEROMETER WITH ANALOG INTERFACE The SCA620 accelerometer consists of a silicon bulk micro machined sensing element chip and a signal conditioning ASIC. The chips are mounted on a pre-molded package and wire bonded to appropriate contacts.
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SCA620-EF1V1B
SCA620-EF1V1B
SCA620
J-STD020B.
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ji82
Abstract: GDP014B-18E0 IR3P66 LR36683N LZ2453A LZ95B25 LZ95G71 X140 mg - 404 e
Text: SHARP SHARP LZ2 4 5 3A # Handle this document carefully for it contains material protected by international copyright law. Any reproduction, full or in part, of this material is prohibited without the express written permission of the company. 9 When using the products covered herein, please observe the conditions written herein
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OCR Scan
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Untitled
Abstract: No abstract text available
Text: SCA620-EF1V1B Datasheet SCA620-EF1V1B SINGLE AXIS ACCELEROMETER WITH ANALOG INTERFACE The SCA620 accelerometer consists of a silicon bulk micro machined sensing element chip and a signal conditioning ASIC. The chips are mounted on a pre-molded package and wire bonded to appropriate contacts.
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SCA620-EF1V1B
SCA620-EF1V1B
SCA620
J-STD020B.
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PDF
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Untitled
Abstract: No abstract text available
Text: SCA610-E23H1A Datasheet SCA610-E23H1A SINGLE AXIS ACCELEROMETER WITH ANALOG INTERFACE The SCA610 accelerometer consists of a silicon bulk micro machined sensing element chip and a signal conditioning ASIC. The chips are mounted on a pre-molded package and wire bonded to appropriate contacts.
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SCA610-E23H1A
SCA610-E23H1A
SCA610
J-STD020B.
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Untitled
Abstract: No abstract text available
Text: SCA630-EDCV1B Datasheet SCA630-EDCV1B SINGLE AXIS ACCELEROMETER WITH ANALOG INTERFACE The SCA630 accelerometer consists of a silicon bulk micro machined sensing element chip and a signal conditioning ASIC. The chips are mounted on a pre-molded package and wire bonded to appropriate contacts.
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SCA630-EDCV1B
SCA630-EDCV1B
SCA630
J-STD020B.
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Untitled
Abstract: No abstract text available
Text: SCA610-ECKH1A Datasheet SCA610-ECKH1A SINGLE AXIS ACCELEROMETER WITH ANALOG INTERFACE The SCA610 accelerometer consists of a silicon bulk micro machined sensing element chip and a signal conditioning ASIC. The chips are mounted on a pre-molded package and wire bonded to appropriate contacts.
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SCA610-ECKH1A
SCA610-ECKH1A
SCA610
J-STD020B.
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Sca100t
Abstract: No abstract text available
Text: Doc.Nr. 82 1178 00 Data Sheet SCA100T-D07 2-AXIS HIGH PERFORMANCE ANALOG ACCELEROMETER Features Applications • Measurement range ±12g Measurement bandwidth 400 Hz Low noise ratiometric analog voltage outputs Excellent bias stability over temperature and time
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SCA100T-D07
20000g)
J-STD-020B.
Sca100t
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MCT12K
Abstract: MCR50K MCT29K
Text: Tem ic Semiconductors Gate Arrays TEMIC Semiconductors offers an extended gate array family providing full solutions to customers. Several technologies from 0.85 |n 2 metal to 0.6 ¡i 3 metal, offer speed and high levels of integration. MG2: CMOS Sea-of-Gates Family:
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MGI001
MG1002
MG1014*
MG1120
MCT12K
MCR50K
MCT29K
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S09A
Abstract: Kyocera Electronic Components 5.6V TVS
Text: MultiGuard 2 & 4 Element TVS Arrays ESD Protection for CMOS and BiPolar Systems Bi-Directional Transient Voltage Suppressors GENERAL DESCRIPTION AND COMMENTS AVX’s Transient Voltage Suppressor (TVS) Arrays address three trends in today’s electronic circuits: (1) mandatory
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5M1198-C
S09A
Kyocera Electronic Components
5.6V TVS
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2E12
Abstract: FSGL033D1 FSGL033R3 FSGL033R4 Rad Hard in Fairchild for MOSFET
Text: FSGL033R Data Sheet Radiation Hardened, SEGR Resistant N-Channel Power MOSFET Fairchild Star*Power Rad Hard MOSFETs have been specifically TM developed for high performance applications in a commercial or military space environment. Star*Power MOSFETs offer the system designer both
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FSGL033R
FSGL033R
2E12
FSGL033D1
FSGL033R3
FSGL033R4
Rad Hard in Fairchild for MOSFET
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Untitled
Abstract: No abstract text available
Text: FSGYE033R Data Sheet Radiation Hardened, SEGR Resistant N-Channel Power MOSFET Fairchild Star*Power Rad Hard MOSFETs have been specifically TM developed for high performance applications in a commercial or military space environment. Star*Power MOSFETs offer the system designer both
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FSGYE033R
FSGYE033R
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Untitled
Abstract: No abstract text available
Text: A B C L2 CACHE CONNECTORS 4 Int*[0.5] CLOCKA CLOCKB ModeClock ModeIn VccOk ColdReset* Reset* ScDOE* TAG_CLOCK ScTCE* ScMatch ScTOE* ScTDE* Int*[0.5] CLOCKA CLOCKB ModeClock ModeIn VccOk ColdReset* Reset* ScDOE* TAG_CLOCK ScTCE* ScMatch ScTOE* ScTDE* D E
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-512KB
SysAD32
SysAD33
SysAD34
SysAD35
SysAD36
SysAD37
SysAD38
SysAD39
SysAD40
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Untitled
Abstract: No abstract text available
Text: RoHS P55/CS32 Silicon Diodes with Silicon Oxide Passivation in Kovar Pill Package Product Environmental Data Sheet P55/CS32 Semiconductor Silicon Chip – Oxide Passivated Silicon with Boron Doping CAS 1E-10 Silicon Gold Plated Contact 7400-21-3 Contact P55/CS32 - Package
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P55/CS32
P55/CS32
1E-10
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EZ 642
Abstract: EZ 644 9444S 61428
Text: /-y{y-/x/-y{y-+ 2030}896, /0./ 54;,6 6,1}< -A>KLIAJ S 5:@ jn`kZ_`e^ ZXgXY`c`kp.GE585EG/ S 9bS [`\c\Zki`Z jki\e^k_ .Y\kn\\e Zf`c Xe[ ZfekXZkj/ S Jfn _\`^_k> 642:dd S 5 gfc\ .GE585EG/0 6 gfc\j .GE585EC/ Zfe]`^liXk`fej XmX`cXYc\ S PfZb\kj XmX`cXYc\ S TXj_ k`^_k Xe[ ]clo giff]\[ kpg\j XmX`cXYc\
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GE585EG/
GE585EG/0
GE585EC/
5644S@
B374SCB
B374SCB
EZ 642
EZ 644
9444S
61428
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bond wire gold
Abstract: No abstract text available
Text: Package Details - SOT-223C Mechanical Drawing Lead Code: Part Marking: Full Part Number. Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R1 (5-November 2007)
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OT-223C
EIA-481-1-A
Custom333-86-4
19-September
bond wire gold
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Untitled
Abstract: No abstract text available
Text: RoHS CS32SP Silicon Diode with Silicon Oxide Passivation in a Copper Pill Package Product Environmental Data Sheet CS32SP Semiconductor Silicon Chip – Oxide Passivated Silicon with Boron Doping CAS 1E-10 Silicon Gold Plated Contact 7400-21-3 Contact CS32SP - Package
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CS32SP
CS32SP
1E-10
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1E14
Abstract: 2E12 FSPYC164D1 FSPYC164R3 Rad Hard in Fairchild for MOSFET
Text: FSPYC164R, FSPYC164F Data Sheet Radiation Hardened, SEGR Resistant N-Channel Power MOSFETs Fairchild Star*Power Rad Hard MOSFETs have been specifically TM developed for high performance applications in a commercial or military space environment. Star*Power MOSFETs offer the
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FSPYC164R,
FSPYC164F
FSPYC164F
1E14
2E12
FSPYC164D1
FSPYC164R3
Rad Hard in Fairchild for MOSFET
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PDF
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