smd code wKX
Abstract: samsung nc110 samsung nc108 AR5112 TP2322 ELM7S08WS TP2320 smd zG sot 23 TP2323 GND194
Text: [ Z zhtz|unGwyvwypl{hy Y X {opzGkvj|tlu{Gjvu{hpuzGjvumpklu{phs wyvwypl{hyGpumvyth{pvuG{oh{Gpz zhtz|unGlslj{yvupjzGjvNzGwyvwly{U kvGuv{GkpzjsvzlG{vGvyGk|wspjh{lGmvyGv{olyz ljlw{GhzGh|{ovyplkGiGzhtz|unU k k jpjospk j i jw|GGGGGGaG ihuphzVkv{ohu jGzGaG tjoTtGvkltR
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Original
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wziG2893-3017F
ELM7S08WS
100nF
MMBD41
PGB001
smd code wKX
samsung nc110
samsung nc108
AR5112
TP2322
ELM7S08WS
TP2320
smd zG sot 23
TP2323
GND194
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT266-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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Original
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SSOP20
OT266-1
OT266-1
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PDF
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Untitled
Abstract: No abstract text available
Text: December 2006 HYB18L512320BF-7.5 HYE18L512320BF-7.5 DRAMs for Mobile Applications 512-Mbit DDR Mobile-RAM Internet Data Sheet Rev.1.21 Internet Data Sheet HY[B/E]18L512320BF-7.5 512-Mbit Mobile-RAM Revision History: 2006-12-20, Rev. V1.21 All Updated Qimonda template
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Original
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HYB18L512320BF-7
HYE18L512320BF-7
512-Mbit
18L512320BF-7
changed2005-03-01
strength2004-09-13
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP8 package SOT530-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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Original
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OT530-1
OT530-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VSO40 package SOT158-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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Original
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VSO40
OT158-1
OT158-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP80 package SOT647-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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Original
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TSSOP80
OT647-1
OT647-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP16 package SOT403-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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Original
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TSSOP16
OT403-1
OT403-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VSO56 package SOT190-2 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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Original
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VSO56
OT190-2
OT190-2
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP10 package SOT552-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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Original
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TSSOP10
OT552-1
OT552-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP38 package SOT510-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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Original
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TSSOP38
OT510-1
OT510-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VSO56 package SOT190-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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Original
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VSO56
OT190-1
OT190-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP8 package SOT505-2 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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Original
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OT505-2
OT505-2
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA183 package SOT825-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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Original
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LFBGA183
OT825-1
OT825-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT640-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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Original
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TFBGA180
OT640-1
OT640-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA596 package SOT635-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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Original
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HBGA596
OT635-1
OT635-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP32 package SOT358-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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Original
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LQFP32
OT358-1
OT358-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP44 package SOT803-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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Original
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QFP44
OT803-1
OT803-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP176 package SOT506-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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Original
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LQFP176
OT506-1
OT506-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA72 package SOT761-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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Original
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TFBGA72
OT761-1
OT761-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA329 package SOT714-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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Original
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HBGA329
OT714-1
OT714-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA208 package SOT631-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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Original
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LFBGA208
OT631-1
OT631-1
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PDF
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hy 010
Abstract: JISC7021 LA201
Text: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LIGITEK O FFICE:7F.,NO.208,SEC.3,JHONGYANG Rd.,Tucheng City Taipei Hsien.Taiwan R.O.C TEL: 02 22677686(REP) FAX: (02)22675286, (02)22695616 LED ARRAY LA201W/HY DATA SHEET DOC. NO : QW0905-LA201W/HY REV.
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OCR Scan
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LA201W/HY
QW0905-LA201
07-Jul
54TYP
LHY2043-1
10min)
MIL-STD-202:
hy 010
JISC7021
LA201
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PDF
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JISC7021
Abstract: HY 1005
Text: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L IG IT E K O FFIC E:7F.,N O .208,SEC.3,JH O N G YA N G Rd.,Tucheng City Taipei Hsien,Taiwan R.O.C TEL: 02 22677686(REP) FAX:(02)22675286,(02)22695616 LED ARRAY LA131B/HY DATA SHEET DOC. NO : QW0905-LA131/HY
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OCR Scan
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LA131B/HY
QW0905-LA131
Apr-2004
54TYP
LH2640-1
LY2640-1
sub103B
10min)
JISC7021
HY 1005
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PDF
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Untitled
Abstract: No abstract text available
Text: 14.3 u ri 1-• ■-■ h -._ ,— ■_ _ ,-,_ hY rV CO CNl SPECIFICATIONS: 1.RATING: 6VDC. 0.3A. 2.CONTACT RESISTANCE: 70m Q MAX. 3.INSULATION RESISTANCE: 500VDC-100M Q MIN. 4.WITHSTAND VOLTAGE: 500VAC-1 MINUTE 5.OPERATING FORCE: 200±150gf
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OCR Scan
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500VDC-100M
500VAC-1
150gf
ffi10
10-100mm
100mm
SS-LR4202
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PDF
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