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    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA329 package SOT714-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		HBGA329 OT714-1 OT714-1 PDF

    MS-034

    Abstract: sot714 e213
    Text: PDF: 2001 Nov 02 Philips Semiconductors Package outline HBGA329: plastic, thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink SOT714-1 B D A D1 ball A1 index area A j A2 A1 E1 E detail X C e1 ∅v M C A B b e y y1 C ∅w M C


    Original     		HBGA329: OT714-1 MS-034 MS-034 sot714 e213 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HBGA329: plastic, thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink SOT714-1 B D A D1 ball A1 index area A j A2 A1 E1 E detail X C e1 b e AC AB AA Y W V U T R P N M L K J H G F E D C B A e heatsink e2 1 shape


    Original     		HBGA329: OT714-1 OT71XP PDF