SZZA031
Abstract: Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste
Text: Application Report SZZA031 - December 2001 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement Donald Abbott, Douglas Romm, Bernhard Lange Standard Linear & Logic ABSTRACT This gold Au embrittlement study evaluates TI’s original four-layer nickel-palladium (NiPd)
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SZZA031
Cu OSP and Cu SOP
gold embrittlement palladium
DIAMOND TECHNOLOGIES
IPC-A-610C
gold embrittlement
sn-pb-ag solder paste
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ZPD 5.1 ITT
Abstract: ZPD ITT diode zener ZD 88 germanium BYY32 germanium transistor CJ 4148 ZENER BAW21 ITT ZPD 11 itt germanium diode
Text: General Information Germanium Gold Bonded Diodes Silicon Diodes Silicon Capacitance Diodes Silicon Diode Switches PIN Diodes Silicon Zener Diodes and Temperature Compensated Stabilizing Circuits Silicon Stabilizer Diodes Light Emitting Diodes Silicon Rectifiers
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OCR Scan
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F-92223
D-7800
ZPD 5.1 ITT
ZPD ITT
diode zener ZD 88
germanium
BYY32
germanium transistor
CJ 4148 ZENER
BAW21
ITT ZPD 11
itt germanium diode
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
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MC9S08QB8
Abstract: No abstract text available
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
MC9S08QB8
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
MC9S08QE32
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MC9S08SH8, instructions set
Abstract: No abstract text available
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
MC9S08SH8, instructions set
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98ASA00474D
Abstract: No abstract text available
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
MC9S08QE8
98ASA00474D
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
MC9S08GT16A
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MC9S08SH8/4
Abstract: MC9S08QB8
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
MC9S08AC128,
MC9S08SH8/4
MC9S08QB8
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
MC9S08LL16
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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mc9s08sh
Abstract: MC9S08SH8
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
mc9s08sh
MC9S08SH8
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MC9S08SH8/4
Abstract: No abstract text available
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
MC9S08SH8/4
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MC9S08SH8/4
Abstract: No abstract text available
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
MC9S08SH8/4
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MC9S08SH8/4
Abstract: MC9S08JM60 c code example
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
MC9S08SH8/4
MC9S08JM60 c code example
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MC9S08SH8/4
Abstract: No abstract text available
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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MC9S08SH8/4
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p6103
Abstract: LT1201 regulator LT1190 arcing spice model LT1201 spark gap capacitors 1.5kv 262LYF-0092K Betatherm 15K capacitive pick up spark plug LT1028
Text: LINEAR TECHNOLOGY OCTOBER 1992 IN THIS ISSUE . . . COVER ARTICLE Design Techniques for Electrostatic Discharge Protection. 1 Sean Gold Editor's Page . 2 Richard Markell DESIGN FEATURES LT1190 Family Ultra-High-Speed Op Amps Eclipse Prior Art
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LT1190
LTC1196/1198
LT1112/LT1114
LTC1157
Now82-2-792-1617
p6103
LT1201 regulator
arcing spice model
LT1201
spark gap capacitors 1.5kv
262LYF-0092K
Betatherm 15K
capacitive pick up spark plug
LT1028
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KTY 10-5
Abstract: Q62705-K111 KTY 10-7 Q62705-K110 KTY 10-6 temperature DEPENDENT RESISTOR Q62705-K331 KTY 10 k132 Q62705-K71
Text: Silicon Spreading Resistance Temperature Sensor in Leaded Plastic Package KT 100 KTY 10 Features • Temperature dependent Resistor with Positive Temperature Coefficient • Small plastic package • Fast response • High reliability due to multilayer gold contacts
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Q62705-K110
Q62705-K71
KTY 10-5
Q62705-K111
KTY 10-7
Q62705-K110
KTY 10-6
temperature DEPENDENT RESISTOR
Q62705-K331
KTY 10
k132
Q62705-K71
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KTY 10-6
Abstract: KTY10 KTY temperature sensor 10-62 Q62705-K110 temperature DEPENDENT RESISTOR Q62705-K331 KTY10 Siemens
Text: SIEMENS Silicon Spreading Resistance Temperature Leaded Plastic Package lorin K T 100 KTY10 Features • Temperature dependent Resistor with Positive Temperature Coefficient • Small plastic package • Fast response • High reliability due to multilayer gold contacts
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OCR Scan
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KTY10
FC40/PP7)
GPD05636
KTY 10-6
KTY10
KTY temperature sensor 10-62
Q62705-K110
temperature DEPENDENT RESISTOR
Q62705-K331
KTY10 Siemens
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KTY 10-8
Abstract: KTY 10-6 KTY 10-62 KTY 10-7 KTY10 Q62705-K107 Siemens KTY K111 KTY temperature sensor KTY 5
Text: SIEMENS KTY10 Spreading Resistance Silicon Temperature Sensor • • • • • Small plastic package Fast response High reliability due to m ultilayer gold contacts n-conducting silicon crystal Polarity independent due to symmetrical construction Type Marking
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OCR Scan
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KTY10
Q62705-K107
62705-K110
Q62705-K132
Q62705-K71
62705-K111
40/PP7)
KTY 10-8
KTY 10-6
KTY 10-62
KTY 10-7
KTY10
Siemens KTY
K111
KTY temperature sensor
KTY 5
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Untitled
Abstract: No abstract text available
Text: SIEMENS K TY16-6 Spreading Resistance Silicon Temperature Sensor • • • • • Small metal housing with leadwires Fast response High reliability due to multilayer gold contacts n-conducting silicon crystal Polarity independent due to symmetrical construction
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OCR Scan
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TY16-6
Q62705-K128
40/PP7)
GPD0563B
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KTY 20-5
Abstract: KTY 20-6 Q62705-K255 KTY temperature sensor KTY20 kty s
Text: SIEM ENS K TY20 Spreading Resistance Silicon Temperature Sensor • • • • • Small plastic package Fast response High reliability due to m ultilayer gold contacts n-conducting silicon crystal Polarity independent due to symmetrical construction Type
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Q62705-K253
Q62705-K254
Q62705-K255
Q62705-K256
KTY 20-5
KTY 20-6
KTY temperature sensor
KTY20
kty s
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DICLAD522T
Abstract: NEL2001 NEL2004 NEL2012 NEL2035 NEL2035F03-24 V06C ZO 189 transistor
Text: DATA SHEET SILICON POWER TRANSISTOR NEL2035F03-24 NPN SILICON EPITAXIAL TRANSISTOR L Band Power Amplifier OUTLINE DIMENSIONS Unit: mm 2.8 ±0.2 NEL2035F03-24 of NPN epitaxial microwave power transistors 2 It incorporates emitter ballast resistors, gold metallizations and
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NEL2035F03-24
NEL2035F03-24
DICLAD522T
NEL2001
NEL2004
NEL2012
NEL2035
V06C
ZO 189 transistor
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temperature DEPENDENT RESISTOR
Abstract: Q62705-K128 KTY 16-6 KTY 10
Text: Silicon Spreading Resistance Temperature Sensor in Miniature Metal Housing KTY 16-6 Features • Temperature dependent Resistor with Positive Temperature Coefficient • Small metal housing with insulated leadwires • Fast response • High reliability due to multilayer gold contacts
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Q62705-K128
FC40/PP7)
temperature DEPENDENT RESISTOR
Q62705-K128
KTY 16-6
KTY 10
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