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AMD XCF128XFTG64C IC PROM SRL 128M GATE 64-FTBGA
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	XCF128XFTG64C	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
Avnet Asia	XCF128XFTG64C				136	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Avnet Silica	XCF128XFTG64C			143 Weeks	3	1 - 10 - 100 - 1000 - 10000 -	Buy Now
EBV Elektronik	XCF128XFTG64C			143 Weeks	3	1 - 10 - 100 - 1000 - 10000 -	Buy Now
AMD Xilinx XCF128XFTG64C
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Bristol Electronics	XCF128XFTG64C		4			1 - 10 - 100 - 1000 - 10000 -	Get Quote
ComSIT USA	XCF128XFTG64C		3			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Vyrian	XCF128XFTG64C		411			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Win Source Electronics	XCF128XFTG64C		9,820			1 - 10 $33.3333 100 $33.3333 1000 $33.3333 10000 $33.3333	Buy Now

FTG64 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
FTG644-690GGHS		Advanced Interconnections	644 POS 1.27MM FLIP-TOP BGA SOCKET		Original	PDF

FTG64 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
FTG64 Abstract: FT64 BGA ft64 Text: R Fine-Pitch Thin BGA FT64/FTG64 Package PK370 (v1.0) May 14, 2008 64-BALL FINE-PITCH THIN BGA, (FT64/FTG64) 2008 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.	Original	FT64/FTG64) PK370 64-BALL FTG64 FT64 BGA ft64	PDF
qfn 3x3 tray dimension Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga	PDF
XCF128XFT64C Abstract: XCF128XFTG64C xcf128x UG438 v3.0 xilinx jtag cable UG438 XC5VLX330 XC5VLX XCF128X-FTG64 XApp973 Text: R 8 8 Platform Flash XL High-Density Configuration and Storage Device DS617 v3.0.1 January 07, 2010 Product Specification Features • In-System Programmable Flash Memory Optimized for Virtex -5 or Virtex-6 FPGA Configuration • High-Performance FPGA Bitstream Transfer up to	Original	DS617 16-bits) 128-Mb 16-bit 256-Kb XCF128XFT64C XCF128XFTG64C xcf128x UG438 v3.0 xilinx jtag cable UG438 XC5VLX330 XC5VLX XCF128X-FTG64 XApp973	PDF
xilinx topside marking Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G	PDF
xilinx part marking Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance	PDF
CSG484 Abstract: Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D Text: Application Note: Packaging R XAPP427 v2.5 February 4, 2010 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of	Original	XAPP427 CSG484 Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D	PDF
xilinx jtag cable Abstract: XCF128XFT64C UG438 v3.0 Text: R 8 8 Platform Flash XL High-Density Configuration and Storage Device DS617 v3.0 November 30, 2009 Product Specification Features • In-System Programmable Flash Memory Optimized for Virtex -5 or Virtex-6 FPGA Configuration • High-Performance FPGA Bitstream Transfer up to	Original	DS617 16-bits) xilinx jtag cable XCF128XFT64C UG438 v3.0	PDF
camera-link to hd-SDI converter Abstract: Virtex-4QV DS-KIT-FX12MM1-G AES-S6DEV-LX150T-G VHDL code for ADC and DAC SPI with FPGA spartan 3 ADQ0007 XC6SL AES-XLX-V4FX-PCIE100-G SPARTAN-3 XC3S400 based MXS3FK ADS-XLX-SP3-EVL400 Text: Product Selection Guides Table of Contents February 2010 Virtex Series . 2 Spartan Series . 6	Original		PDF
Lead Free reflow soldering profile BGA Abstract: XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160 Text: Application Note: Packaging R XAPP427 v2.4 February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of	Original	XAPP427 Lead Free reflow soldering profile BGA XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160	PDF
XC3S250E TQ144 STARTER KIT BOARD Abstract: AES-S6DEV-LX150T-G connector FMC LPC samtec DS-KIT-FX12MM1-G ADS-XLX-SP3-EVL1500 xcf128x SPARTAN-3 XC3S400 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 based MXS3FK XQ4VSX55 Text: Product Selection Guides Table of Contents January 2010 Virtex Series . 2 Spartan Series . 6	Original		PDF
XILINX/part marking Hot Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160	PDF
xilinx jtag cable Abstract: DS617 XCF128XFT64C 260327 Text: R 9 2 Platform Flash XL High-Density Storage and Configuration Device DS617 v2.1 May 14, 2008 Preliminary Product Specification Features • In-System Programmable Flash Memory Optimized for Virtex -5 FPGA Configuration • High-Performance FPGA Bitstream Transfer up to 800	Original	DS617 16-bits) xilinx jtag cable DS617 XCF128XFT64C 260327	PDF
XCF128XFTG64C Abstract: XCF128XFT64C xilinx jtag cable xcf128x XC5VLX330 DS617 Text: R 9 Platform Flash XL High-Density Configuration and Storage Device DS617 v2.2 October 29, 2008 Preliminary Product Specification Features • In-System Programmable Flash Memory Optimized for Virtex -5 FPGA Configuration • High-Performance FPGA Bitstream Transfer up to	Original	DS617 16-bits) XCF128XFTG64C XCF128XFT64C xilinx jtag cable xcf128x XC5VLX330 DS617	PDF
BFG95 Abstract: No abstract text available Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL	Original	UG112 UG072, UG075, XAPP427, BFG95	PDF