fujitsu
Abstract: 48-pin
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M02 48-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 6x8 Sealing method Plastic mold BGA-48P-M02 48-pin plastic FBGA (BGA-48P-M02)
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BGA-48P-M02
48-pin
BGA-48P-M02)
B48002S-1C-2
fujitsu
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BGA-48P-M01
Abstract: 48-pin
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M01 48-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 6x8 Sealing method Plastic mold BGA-48P-M01 48-pin plastic FBGA (BGA-48P-M01)
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BGA-48P-M01
48-pin
BGA-48P-M01)
B48001S-1C-2
BGA-48P-M01
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fujitsu
Abstract: 48-pin
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M03 48-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 6x8 Sealing method Plastic mold BGA-48P-M03 48-pin plastic FBGA (BGA-48P-M03)
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BGA-48P-M03
48-pin
BGA-48P-M03)
B48003S-1C-2
fujitsu
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NP291
Abstract: FBGA 320 ic 0715 07210
Text: NP291 Series Open Top Fine Ball Grid Array (FBGA) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: 1,000MΩ min. at 100V DC 100V AC for 1 minute 100m Ω max. at 10mA/20mV max.
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NP291
10mA/20mV
FBGA 320
ic 0715
07210
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NP351-064-148
Abstract: NP351-18464 NP351 NP351-080-128 20890 14422 NP351-180-139 NP35 400X400 NP351-11230
Text: NP351 Series Open Top Fine Ball Grid Array (FBGA, 0.80mm Pitch) Specifications Part Number (Details) 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 100m Ω max. at 10mA/20mV max. Contact Resistance:
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NP351
10mA/20mV
CP351-30413-*
NP351-30431-*
NP351-43216-*
NP351-52009-*
NP351-532-83-*
NP351-064-148
NP351-18464
NP351-080-128
20890
14422
NP351-180-139
NP35
400X400
NP351-11230
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X3329
Abstract: NP352 NP352-40025
Text: NP352 Series Open Top Fine Ball Grid Array (FBGA, 1.00mm Pitch) Part Number (Details) NP352 - 345 34 - * - * Specifications 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 100m Ω max. at 10mA/20mV max.
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NP352
10mA/20mV
NP352-436-68
X3329
NP352-40025
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A3232
Abstract: bga 7x7 CSP2 BGA thermal resistance 6x8 bga 6x8 Package BGA 48 PACKAGE thermal resistance
Text: FBGA Chip Scale BGA Encapsulant Au Wire Die Mold Resin Die Au Wire Polyimide Tape Substrate Solder Laminate Substrate Solder Ball Die Attach Super CSP Si Al SON BCC™ Leadless Redistribution Line Cu Leadframe Metal post (Cu/Barrier) Polyimide Layer SiN
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socket 1155
Abstract: 1155 socket NP352-676-103 NP352-76814 45x45 mm bga X2933 35x35 bga 45x45 bga NP352-103 ac294
Text: NP352 Series Open Top Fine Ball Grid Array (FBGA, 1.00mm Pitch) Part Number (Details) Specifications NP352 - 560 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 100m Ω max. at 10mA/20mV max. Contact Resistance:
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NP352
10mA/20mV
NP352-1600-54-*
NP352-160018
45x45
NP352-1849-35
NP352-106426
socket 1155
1155 socket
NP352-676-103
NP352-76814
45x45 mm bga
X2933
35x35 bga
45x45 bga
NP352-103
ac294
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Untitled
Abstract: No abstract text available
Text: M29W400BT M29W400BB 4 Mbit 512Kb x8 or 256Kb x16, Boot Block Low Voltage Single Supply Flash Memory • SINGLE 2.7 to 3.6V SUPPLY VOLTAGE for PROGRAM, ERASE and READ OPERATIONS ■ ACCESS TIME: 55ns ■ PROGRAMMING TIME FBGA – 10µs per Byte/Word typical
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M29W400BT
M29W400BB
512Kb
256Kb
TSOP48
TFBGA48
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BGA-48P-M13
Abstract: bga48
Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC BGA-48P-M13 48-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 6x8 Package width × package length 8.00 × 9.00 mm Sealing method Plastic mold Mounting height 1.20 mm MAX Ball size
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BGA-48P-M13
48-pin
BGA-48P-M13)
B480013S-1C-1
BGA-48P-M13
bga48
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Untitled
Abstract: No abstract text available
Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC BGA-48P-M12 48-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 6x8 Package width × package length 6.00 × 9.00 mm Sealing method Plastic mold Mounting height 1.20 mm MAX Ball size
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BGA-48P-M12
48-pin
BGA-48P-M12)
B480012S-2C-2
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Untitled
Abstract: No abstract text available
Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC BGA-48P-M11 48-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 6x8 Package width × package length 6.00 × 8.00 mm Sealing method Plastic mold Mounting height 1.20 mm MAX Ball size
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BGA-48P-M11
48-pin
BGA-48P-M11)
B480011S-1C-1
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FBGA 6x8
Abstract: No abstract text available
Text: DATA SHEET MOS INTEGRATED CIRCUIT µPD442002-X 2M-BIT CMOS STATIC RAM 128K-WORD BY 16-BIT EXTENDED TEMPERATURE OPERATION Description The µPD442002-X is a high speed, low power, 2,097,152 bits 131,072 words by 16 bits CMOS static RAM. The µPD442002-X is packed in 48-pin tape FBGA.
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PD442002-X
128K-WORD
16-BIT
PD442002-X
48-pin
I/O16)
FBGA 6x8
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uPD442002F9-BC85X-BC1
Abstract: FBGA 6x8
Text: DATA SHEET MOS INTEGRATED CIRCUIT µPD442002-X 2M-BIT CMOS STATIC RAM 128K-WORD BY 16-BIT EXTENDED TEMPERATURE OPERATION Description The µPD442002-X is a high speed, low power, 2,097,152 bits 131,072 words by 16 bits CMOS static RAM. The µPD442002-X is packed in 48-pin TAPE FBGA.
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PD442002-X
128K-WORD
16-BIT
PD442002-X
48-pin
I/O16)
uPD442002F9-BC85X-BC1
FBGA 6x8
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MX29GL256
Abstract: 28F512P30 Numonyx M29W256G 28F00AP30 w25q128 MX25L6445 28F00AM29EW M29DW127G 28F128P30 PF38F3040M0Y3D
Text: Spansion NOR Flash Memory Competitive Cross Reference Guide December 2009 Parallel 1.8V Density Voltage Bus Mb (V) VIO (V) Type Bus Sector Width Type # Initial Access Burst Speed Banks Times (ns) (MHz) Packages Temp Range Recommended Pin Software Spansion OPN Compatible Compatible Notes
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AT49SV163D
48-Pin
48-Ball
S29AS016J
EN29SL800
S29AS00gest
MX29GL256
28F512P30 Numonyx
M29W256G
28F00AP30
w25q128
MX25L6445
28F00AM29EW
M29DW127G
28F128P30
PF38F3040M0Y3D
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S25FL129
Abstract: S98GL064NB0 S98GL064 s29gl256p90 S70FL256 S98GL064NB s71vs128 S25FL129P WSON 6x8 S25FL032K
Text: Spansion Product Selector Guide Embedded and Mobile Applications Portfolio March 2011 Spansion ® Products Portfolio . Automotive . Consumer electronics . Gaming . Industrial equipment . Machine-to-Machine Spansion offers a wide range of NOR Flash memory solutions in multiple voltages,
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128Mb
256Mb
512Mb
1-866-SPANSION
43715B
S25FL129
S98GL064NB0
S98GL064
s29gl256p90
S70FL256
S98GL064NB
s71vs128
S25FL129P
WSON 6x8
S25FL032K
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fcBGA PACKAGE thermal resistance
Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
Text: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America
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S25FL256
Abstract: S25FL512 S98GL064 S25FL256* spansion S98GL064NB S98GL064NB0 S25FL204 s25fl128s S25FL129 S25FL032K
Text: Spansion Product Selector Guide April 2012 Spansion ® Products Portfolio Spansion offers a wide range of NOR Flash memory solutions in multiple voltages, densities and packages expressly designed and optimized for embedded and mobile applications, including:
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128Mb
256Mb
512Mb
43715C
S25FL256
S25FL512
S98GL064
S25FL256* spansion
S98GL064NB
S98GL064NB0
S25FL204
s25fl128s
S25FL129
S25FL032K
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kor 2001
Abstract: MARKING HYNIX Origin Country HYNIX Origin Country
Text: HY62UF16201A Series 128Kx16bit full CMOS SRAM Document Title 128K x16 bit 3.0V Super Low Power Full CMOS Slow SRAM Revision History Revision No 05 06 07 History Draft Date Remark Divide output load into two factors Dec.10. 2000 Final - tCLZ,tOLZ,tBLZ,tCHZ,tOHZ,tBHZ,tWHZ,tOW
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HY62UF16201A
128Kx16bit
HY62UF16201AF1)
HY62UF16201AF)
HYUF621Ac
100ns
kor 2001
MARKING HYNIX Origin Country
HYNIX Origin Country
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R1LV1616
Abstract: ECU car R1LV0816A R1LV08 HM62V8100 r1lp0408c m5m5v208akv R1LV0808ASB-5SI M5M5256DVP-70LL M5M5W817
Text: R1LV0816ABG -5SI, 7SI 8Mb Advanced LPSRAM 512k word x 16bit REJ03C0393-0100 Rev.1.00 2009.12.08 Description The R1LV0816ABG is a family of low voltage 8-Mbit static RAMs organized as 524,288-words by 16-bit, fabricated by Renesas's high-performance 0.15um CMOS and TFT technologies.
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R1LV0816ABG
16bit)
REJ03C0393-0100
288-words
16-bit,
48balls
R1WV6416R
R1LV1616
ECU car
R1LV0816A
R1LV08
HM62V8100
r1lp0408c
m5m5v208akv
R1LV0808ASB-5SI
M5M5256DVP-70LL
M5M5W817
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HY62UF16201A
Abstract: HY62UF16201A-I HY62UF16201AF HYUF621 REV08
Text: HY62UF16201A Series 128Kx16bit full CMOS SRAM Document Title 128K x16 bit 3.0V Super Low Power Full CMOS Slow SRAM Revision History Revision No 05 06 07 08 History Draft Date Remark Divide output load into two factors Dec.10. 2000 Final - tCLZ,tOLZ,tBLZ,tCHZ,tOHZ,tBHZ,tWHZ,tOW
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HY62UF16201A
128Kx16bit
HY62UF16201AF1)
HY62UF16201AF)
HYUF621Ac
100ns
HY62UF16201A-I
HY62UF16201AF
HYUF621
REV08
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DAEWON tray 48
Abstract: daewon tray daewon 3476a 12B-0609-F19 12B-0608-F19 VBK048 TRAY MPPO DAEWON FBGA FBGA 6x8
Text: Chapter 5 Trays Fine-Pitch Ball Grid Array: FAA 064 322.6 315.0 * 2.54 R. 4 PLACES VACUUM PICKUP CELLS 10 PLACES (6 CENTER CELLS, 4 SIDE CELLS) 5.62* X 7.62 SEE DETAIL "D" Z Y SEE DETAIL "E" X X 112.0 135.9* ±0.25 92.1 * 16.00 B 12.7 * 11.95 CHAMFER
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3417-1a
27458b
3467b
26040h
DAEWON tray 48
daewon tray
daewon
3476a
12B-0609-F19
12B-0608-F19
VBK048
TRAY MPPO
DAEWON FBGA
FBGA 6x8
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vhdl code for dice game
Abstract: Video Proc 3.3V 0.07A 64-Pin PQFP ez811 GRAPHICAL LCD interfaced with psoc 5 cypress ez-usb AN2131QC CYM9239 vhdl code PN 250 code generator CY3649 cy7c63723 Keyboard and Optical mouse program CY7C9689 ethernet
Text: Product Selector Guide Communications Products Description Pins Part Number Freq. Range Mbps ICC (mA) Packages* 3.3V SONET/SDH PMD Transceiver 2.5V SiGe Low Power SONET/SDH Transceiver SONET/SDH Transceiver w/ 100K Logic 2.5 G-Link w/ 100K Logic OC-48 Packet Over SONET (POS) Framer
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OC-48
CYS25G0101DX
CYS25G0102
CYS25G01K100
CYP25G01K100
CY7C9536
CY7C955
CY7B952
CY7B951
10BASE
vhdl code for dice game
Video Proc 3.3V 0.07A 64-Pin PQFP
ez811
GRAPHICAL LCD interfaced with psoc 5
cypress ez-usb AN2131QC
CYM9239
vhdl code PN 250 code generator
CY3649
cy7c63723 Keyboard and Optical mouse program
CY7C9689 ethernet
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12B-0608-F19
Abstract: DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A
Text: Chapter 5 Trays Very Very Thin Small Outline No Lead Package: WNF 008 322.6 2.54 R. 4 PLACES * 315.0 VACCUM PICKUP CELLS 14 PLACES Y (12 CENTER CELLS, 2 SIDE CELLS) CLOSED CELLS 2 PLACES 6.35 SEE DETAIL "D" X BUMPS 12 PLACES * 7.62 Z SEE DETAIL "E" X
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0X45M
3466b
26022i
12B-0608-F19
DAEWON tray 48
daewon
daewon tray
FBGA 6x8
TRAY fbga 6X8
DAEWON FBGA
MPPO
fBGA package tray
3466A
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