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    EXPOSED QFP 128 Search Results

    EXPOSED QFP 128 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    UPD703185GF-XXX-3BA-A Renesas Electronics Corporation 32-bit Microcontrollers, QFP, / Visit Renesas Electronics Corporation
    DF38327HWV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), QFP, / Visit Renesas Electronics Corporation
    DF38427HWV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), QFP, / Visit Renesas Electronics Corporation
    M30302FAPFP#U5 Renesas Electronics Corporation 16-bit Microcomputers (Non Promotion), QFP, / Visit Renesas Electronics Corporation
    M30622F8PFP#U3C Renesas Electronics Corporation 16-bit Microcomputers (Non Promotion), QFP, / Visit Renesas Electronics Corporation

    EXPOSED QFP 128 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    exposed QFP 144

    Abstract: exposed QFP 128 TQFP-EP AN 7823 EP 603 QFP-EP 100L 144L JESD51-2 JESD51-7
    Text: QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 24 x 24mm STATS ChipPAC’s Exposed Pad Quad Flat Pack QFP-ep is a thermally enhanced version of the QFP package. Thermal


    Original     		PDF

    STATS ChipPAC

    Abstract: AN 7823 EP 603 LQFP Package LQFP Package tray QFP JEDEC tray 64 leads qfp 32 QFP PACKAGE thermal resistance Techpoint
    Text: QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a conventional QFP package FEATURES DESCRIPTION • Combining devices into one package reduces PCB real estate and cost STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die


    Original     		PDF

    OBD II Protocol ISO 9141

    Abstract: SC510727 advantages of microcontroller mc9s08aw16 sg2023 relay K-line interface mc9s12dg256 code example assembly electric assisted power steering system motor circuit diagram obd diagnostic SG187 Common rail injector service manuals
    Text: Automotive Quarter 4, 2005 SG187 Rev 22 About This Revision–Q4/2005 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.


    Original     		SG187 Q4/2005 MC68HC908QC4 MC68HC908QC8 MC68HC908QC16 MC9S08AW1e SG187 OBD II Protocol ISO 9141 SC510727 advantages of microcontroller mc9s08aw16 sg2023 relay K-line interface mc9s12dg256 code example assembly electric assisted power steering system motor circuit diagram obd diagnostic Common rail injector service manuals PDF

    OBD II Protocol ISO 9141

    Abstract: SC510727 Common rail injector service manuals MC9S12XDP384 electric assisted power steering system motor LED DRIVER 16pin QFP circuit diagram obd diagnostic Common rail injector driver SG187 switch circuit diagram af remote control door lock
    Text: Automotive Quarter 3, 2005 SG187 Rev 21 About This Revision–Q3/2005 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.


    Original     		SG187 Q3/2005 MMA7260Q MC56F8335VFG60 MC56F8335MFG60 MAC7101 SG187 OBD II Protocol ISO 9141 SC510727 Common rail injector service manuals MC9S12XDP384 electric assisted power steering system motor LED DRIVER 16pin QFP circuit diagram obd diagnostic Common rail injector driver switch circuit diagram af remote control door lock PDF

    mp 9141 es

    Abstract: MC33662 MPXY8600 MPC5673F MPC56xx fet e300 MPC5606B MC33905 mpxy8500 MPC5643L
    Text: Automotive Quarter 4, 2010 SG187Q42010 Rev 40 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad range of


    Original     		SG187Q42010 mp 9141 es MC33662 MPXY8600 MPC5673F MPC56xx fet e300 MPC5606B MC33905 mpxy8500 MPC5643L PDF

    MPXY8600

    Abstract: MPC5674 MPC5603 MPC56xx MPC5668G MPC55XX JTAG MPXY8600A MC33730 MPC5516E MPC5517E
    Text: Automotive Quarter 4, 2009 SG187Q42009 Rev 37 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: i.MX and MPC5668G product families; S12XE, MPC551x, MPC560xS, MPC563xM, MPC560xB, MPC5533, MPC5534 and MPC5553 products in 208 MAPBGA packages.


    Original     		SG187Q42009 MPC5668G S12XE, MPC551x, MPC560xS, MPC563xM, MPC560xB, MPC5533, MPC5534 MPC5553 MPXY8600 MPC5674 MPC5603 MPC56xx MPC55XX JTAG MPXY8600A MC33730 MPC5516E MPC5517E PDF

    LQFP-48 thermal pad

    Abstract: exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad 2-CQFP SOT23-6 1152 BGA 144
    Text: Thermal Characteristics of IC Assembly method for using this board is specified by the SEMI standard G38-87. These standards are available in the SEMI International Standards book, Volume 4, for packaging. INTRODUCTION The purpose of this document is to provide a centralized


    Original     		G38-87. LQFP-48 thermal pad exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad 2-CQFP SOT23-6 1152 BGA 144 PDF

    Untitled

    Abstract: No abstract text available
    Text: VSC8163 Datasheet FEATURES ● ● ● ● ● ● 2.488Gb/s 16:1 Multiplexer Targeted for SONET OC-48 / SDH STM-16 Applications Differential LVPECL Low-Speed Interface On-Chip PLL-Based Clock Generator 128 Pin, 14mm x 20mm PQFP Package Single +3.3V Supply


    Original     		VSC8163 488Gb/s OC-48 STM-16 VSC8163 48832Gb/s 76MHz 52MHz 48832GHz 16-bit PDF

    OBD II Protocol ISO 9141

    Abstract: knock alarm report power window lifter and door switch panel solid state timer aCCELEROMETER APPLICATION CIRCUIT SC510727 mc33883 cars ecu immobilizer automotive ecu manual SG2010
    Text: Automotive Quarter 4, 2004 SG187 Rev 18 About This Revision–Q4/2004 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.


    Original     		SG187 Q4/2004 MM908E621 SG187-6e SG187 OBD II Protocol ISO 9141 knock alarm report power window lifter and door switch panel solid state timer aCCELEROMETER APPLICATION CIRCUIT SC510727 mc33883 cars ecu immobilizer automotive ecu manual SG2010 PDF

    9s08dz32

    Abstract: 9s12xeq384 144 QFP 908QY1 9S12XDT256 manual 9S12XHZ256 9s08sg32 9S08DZ128 NEXUS iso MC33810 MC33882
    Text: Automotive Quarter 4, 2007 SG187Q42007 Rev 29 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad


    Original     		SG187Q42007 9s08dz32 9s12xeq384 144 QFP 908QY1 9S12XDT256 manual 9S12XHZ256 9s08sg32 9S08DZ128 NEXUS iso MC33810 MC33882 PDF

    PHD64

    Abstract: land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14
    Text: PowerPAD - A Method To Create Thermally Enhanced Plastic Package Solutions for Semiconductors Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter Texas Instruments, Incorporated Dallas, Texas f = switching frequency in Hz N = number of gates switched/clock cycle


    Original     		100MHz PHD64 land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14 PDF

    diagrams hitachi ecu

    Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		D-85622 REJ01K0003-0200Z diagrams hitachi ecu SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog" PDF

    JESD51-2

    Abstract: exposed QFP 144 100L JESD51-7 Techpoint
    Text: MQFP-ed Exposed Drop-in Heat Slug Metric Quad Flat Pack • 14 x 20mm to 32 x 32mm • 100 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 20mm to 32 x 32mm STATS ChipPAC’s Exposed Drop-In Heat Slug Metric Quad


    Original     		PDF

    CS-007

    Abstract: Amkor Electronics Amkor mold compound
    Text: LEADFRAME data sheet FusionQuad Body Exposed Pad Size mm Size (mm) 176 ld 14 x 14 6.5 x 6.5 A Electrical: Theta JA (°C/W) by Velocity (m/s) 1.0 2.5 24.6 19.9 17.9 Body Pad Size Size Pkg (mm) 14 x 14 Inductance Capacitance Resistance (mm) Lead 6.5 x 6.5 176 ld


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    amkor exposed pad

    Abstract: exposed QFP 128 amkor exposed QFP 144
    Text: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small


    Original     		PDF

    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog" PDF

    BR931

    Abstract: motorola mca MCA3200ETL MCA6200ETL MCA750ETL H4C018 Motorola Master Selection Guide H4C161 wirebond die flag lead frame an1512
    Text: Semicustom Application Specific Integrated Circuits In Brief . . . Motorola supports strategic programs and co–development partnerships to accelerate the availability of advanced processes CMOS, BiCMOS, Bipolar , packaging and CAD technology. Extensive research,


    Original     		PDF

    MS08QD4

    Abstract: MCF52236 MPC56xx instruction set digrf MCF52252 MMM6000 MMM7010 MPC5602B MS08EL32 MPC56xx
    Text: SG1000mini Freescale Semiconductor Product Selector Guides Quarter 2, 2009 Product Selector Guide Cross-Reference, SG1000CR Automotive, SG187 Analog and Mixed Signal Power Management, SG1002 Digital Signal Processors DSP , SG1004 Network/Embedded Processors, SG1007


    Original     		SG1000mini SG1000CR SG187 SG1002 SG1004 SG1007 SG1009 SG1010 SG1013 32-Bit MS08QD4 MCF52236 MPC56xx instruction set digrf MCF52252 MMM6000 MMM7010 MPC5602B MS08EL32 MPC56xx PDF

    outline of the heat slug for JEDEC

    Abstract: heat slug for JEDEC JEDEC Matrix Tray outlines MS-029 QFP JEDEC tray amkor exposed pad 245C amkor
    Text: LEADFRAME data sheet MQFP PowerQuad 4 Features: MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit


    Original     		MS-029/022 outline of the heat slug for JEDEC heat slug for JEDEC JEDEC Matrix Tray outlines MS-029 QFP JEDEC tray amkor exposed pad 245C amkor PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    MS-029

    Abstract: 144 QFP body size amkor
    Text: LEADFRAME data sheet MQFP PowerQuad 4 Features MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit


    Original     		out029 MS-029/022 MS-029 144 QFP body size amkor PDF

    SPRA953A

    Abstract: Theta-JC QFP die down Theta-JC plcc Theta-JC qfp Theta-JC 28 PLCC mgmt coolant temperature sensor outline of the heat sink for Theta JC dead bug heat slugs attach QFP PACKAGE thermal resistance
    Text: Application Report SPRA953A – June 2007 IC Package Thermal Metrics Darvin Edwards. ABSTRACT Many thermal metrics exist for integrated circuit IC packages ranging from θja to Ψjt.


    Original     		SPRA953A SPRA953A Theta-JC QFP die down Theta-JC plcc Theta-JC qfp Theta-JC 28 PLCC mgmt coolant temperature sensor outline of the heat sink for Theta JC dead bug heat slugs attach QFP PACKAGE thermal resistance PDF

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318 PDF

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128 PDF