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Catalog Datasheet	MFG & Type	PDF	Document Tags
PHD64 Abstract: land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14 Text: PowerPAD - A Method To Create Thermally Enhanced Plastic Package Solutions for Semiconductors Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter Texas Instruments, Incorporated Dallas, Texas f = switching frequency in Hz N = number of gates switched/clock cycle	Original	PDF	100MHz PHD64 land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14
Untitled Abstract: No abstract text available Text: User's Guide SLVU457 – April 2011 TPS4333xEVM 1 2 3 4 Contents Introduction . Setup .	Original	PDF	SLVU457 TPS4333xEVM
Untitled Abstract: No abstract text available Text: User's Guide SLVU484 – June 2011 TPS4335xEVM Evaluation Module 1 Introduction The Texas Instruments TPS4335xEVM evaluation module EVM helps designers evaluate the operation and performance of the TPS4335x family of Switch Mode Power Supplies – Multiple-output voltage	Original	PDF	SLVU484 TPS4335xEVM TPS4335x TPS43350QDAPQ1 DAP-38 TPS43351QDAPQ1 TPS4335xEVM.
Untitled Abstract: No abstract text available Text: User's Guide SLVU349 – October 2009 TPS43331EVM 1 2 3 4 Contents Introduction . Setup .	Original	PDF	SLVU349 TPS43331EVM
SLMA002 Abstract: "x-ray machine" DCA56 land pattern for tSOP56 powerPAD SMTC-0118 750-W METCAL removal iron TQFP64 land package IPC-7525 SLMA004 Text: Application Report SLMA002E – November 1997 – Revised January 2010 PowerPAD Thermally Enhanced Package Steven Kummerl. ABSTRACT	Original	PDF	SLMA002E SLMA002 "x-ray machine" DCA56 land pattern for tSOP56 powerPAD SMTC-0118 750-W METCAL removal iron TQFP64 land package IPC-7525 SLMA004