AMKOR Search Results

AMKOR Datasheets (30)

Part	Manufacturer	Description	Datasheet Type	PDF
CABGA	Amkor Technology	ChipArray Packages	Original	PDF
CBGA	Amkor Technology	From innovative designs and expanding package offerings, Amkor provides a platform from prototype-to-production.	Original	PDF
CDIP	Amkor Technology	Ceramic Dual-Inline Package	Original	PDF
CERDIP	Amkor Technology	Ceramic Dual-Inline Package	Original	PDF
CERPAK	Amkor Technology	Ceramic Pack	Original	PDF
CLGA	Amkor Technology	Ceramic Land Grid Array Package	Original	PDF
CMCM	Amkor Technology	Ceramic Multi-Chip Module Package	Original	PDF
CPGA	Amkor Technology	Ceramic Pin Grid Array Package	Original	PDF
CQFP	Amkor Technology	Ceramic Quad Flat Pack Package	Original	PDF
CSOIC	Amkor Technology	Ceramic Small Outline Integrated Circuit Package	Original	PDF
CSPNL	Amkor Technology	Wafer Level Packaging	Original	PDF
CSSOP	Amkor Technology	Ceramic Shrink Small Outline Package	Original	PDF
CTBGA	Amkor Technology	ChipArray Packages	Original	PDF
CVBGA	Amkor Technology	ChipArray Packages	Original	PDF

ETCSP	Amkor Technology	the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.	Original	PDF
FCCSP	Amkor Technology	a flip chip solution in a CSP package format.	Original	PDF
FLATPACK	Amkor Technology	Ceramic Flat Pack Package	Original	PDF
LCC	Amkor Technology	Leadless Chip Carrier Package	Original	PDF
LQFP	Amkor Technology	Low Profile Quad Flat Pack (LQFP) Packages	Original	PDF
LQFPPOWERQUAD2	Amkor Technology	LQFP PowerQuad 2 Packages	Original	PDF

AMKOR Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
amkor Abstract: No abstract text available Text: 1 REV. THE DRAWINGS AND INFORMATION CONTAINED HEREIN ARE THE EXCLUSIVE PROPERTY OF AMKOR/ANAM. THE INFORMATION, DRAWINGS AND DESIGN CONCEPTS CONTAINED HEREIN ARE CONFIDENTIAL/PR6PRIETARY, SHALL BE MAINTAINED IN STRICT CONFIDENCE. AND SHALL NOT BE RELEASED TO ANY THIRD PARTY WITHOUT THE EXPRESS	OCR Scan	5M-1994. amkor	PDF
PCB design for 0.2mm pitch csp package Abstract: led matrix 8x8 mini circuits 0.3mm pitch csp package E30JA Amkor CSP mold compound Soldering guidelines and SMD footprint design led 3mm 8x8 matrix mlf 0.3mm pitch MLF 6x6 guideline pad dimension 1210 Text: Application Notes for Surface Mount Assembly of Amkor’s MicroLeadFrame MLF® Packages December 2003 Page 1 December 2003 Rev. E Contents 1.0 Introduction 3 2.0 Surface Mount Consideration 3 3.0 PCB Design Requirements 4 3.1 4 4 8 8 10 3.2 3.3 Page 2	Original		PDF
Untitled Abstract: No abstract text available Text: REVISION HISTORY Ky NOTES! U N LESS OTHERWISE SPECIFIED 1. TRAYS MUST MEET ALL REQUIREMENTS OF AMKOR/ANAM § 01 -04-31 - 2 2 B 3 PROCUREMENT SPE C FOR SHIPPING TRAY. 2. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY 3. TOTAL USABLE CELL COUNT IS 490. 4. TRAY VACUUM PICKUP METHOD REQUIRES A 28XZ8m m	OCR Scan	28XZ8m A51200 A52135	PDF
PCN0504 Abstract: EME-G700 SUMITOMO G700 SUMIKON EME-G700 SUMITOMO EME G700 MPM7128 EME-G700 datasheet G700 SUMItomo EME-G700 Sumikon Text: PROCESS CHANGE NOTICE PCN0504 STANDARDIZED EME-G700 SERIES MOLD COMPOUND FOR QFP PACKAGES Change Description: Altera will be standardizing on Sumikon EME-G700 series mold compound in Altera’s quad flat pack QFP packages. All QFP packages assembled at ASE in Malaysia and Amkor in	Original	PCN0504 EME-G700 MP8000 EME-6300HJ EPF8452A, EPF8636A, EPF8820A, PCN0504 SUMITOMO G700 SUMIKON EME-G700 SUMITOMO EME G700 MPM7128 EME-G700 datasheet G700 SUMItomo EME-G700 Sumikon	PDF
PCN0801 Abstract: hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4 Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0801 ALTERNATIVE MANUFACTURING SITE FOR EPCS FAMILY Change Description This is an update to PCN0801; please see the revision history table for information specific to this update. Altera introduced Amkor Philippines as an alternative assembly manufacturing site for the Altera	Original	PCN0801 PCN0801; PCN0801 hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4	PDF
ic packages Abstract: MO-137 Text: LEADFRAME data sheet ExposedPad SOIC/SSOP Features: ExposedPad SOIC/SSOP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power-constrained standard SOIC and SSOP packages. The ExposedPad SOIC/ SSOPs can increase heat dissipation by	Original	MS-012 MO-137 ic packages MO-137	PDF
CSPNL Abstract: amkor RDL wafer map format amkor amkor flip amkor Sip amkor polyimide FCCSP wafer map Text: data sheet wafer level packaging CSPnl RDL Features: Packaging CSPnl Bump on Redistribution RDL (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the	Original		PDF
TQ32 Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6 Text: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*	Original	Jul-00 Oct-00 Jan-01 Apr-01 Jul-01 Oct-01 10X10, TQ32 ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6	PDF
CCL-HL832NX-A Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832 Text: LAMINATE data sheet TEPBGA Features: Thermally Enhanced Plastic Ball Grid Array TEPBGA : Amkor's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize	Original	CO-029) CCL-HL832NX-A Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832	PDF
MO-166 Abstract: PPF leadframe MO166 MS-013 tip 142 Text: LEADFRAME data sheet PowerSOP 2&3 Features: Thermal Resistance: PowerSOP® Packages: PSOP This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard SOIC packages. The PowerSOP (PSOP) improves	Original	MO-166. MS-012 MO-166 PPF leadframe MO166 MS-013 tip 142	PDF
E679 Abstract: Amkor CSP mold compound chiparray amkor MO-192 Amkor mold compound Amkor Wafer level mold compound amkor polyimide Text: LAMINATE data sheet Stacked CSP Features: Stacked CSP SCSP : The Stacked CSP (SCSP) family leverages Amkor's industry leading ChipArray Ball Grid Array (CABGA) manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking	Original		PDF
nitto GE-100L Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034 Text: LAMINATE data sheet MCM-PBGA Features: MCM-PBGA Packages: The MCM-PBGA Multi-Chip Module Plastic Ball Grid Array by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA	Original		PDF
Untitled Abstract: No abstract text available Text: data sheet CERAMIC / HERMETIC CMCM Ceramic Multi-Chip Module Package CMCM The MCM/CBGA and MCM/PBGA by Amkor Technology incorporates the latest technology in high-density Ceramic and Plastic IC packaging. The high-speed performance and thermal advantages of the CBGA and PBGA package	Original	DS804	PDF
MS-026 Abstract: JEDEC Matrix Tray outlines CS-007 MS-026 lqfp 80 MS026 tray 20 x 14 LQFPPOWERQUAD4 MS-026 lqfp 128 Text: LEADFRAME data sheet LQFP PowerQuad 4 Features: LQFP PowerQuad® 4 Packages: LQFP PowerQuad® 4 PQ4 is the same Amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is	Original		PDF

Untitled Abstract: No abstract text available Text: data sheet CERAMIC / HERMETIC Flat Pack Ceramic Flat Pack Package FP Amkor Technology is committed to continuing to service this long established standard industry package. This surface mount package consists of a co-fired ceramic base that has leads brazed to	Original	DS809	PDF
sumitomo EME G700L Abstract: SUMITOMO g700l g700l Loctite 536 EME-G700 EME G700L lead frame cu C194 ablestick tqfp upsd Text: 05/12/06 µPSD ATK Assembly Qualification Test Report The following report summarizes the qualification testing of the uPSD family of µPSD Microcontrollers additional assembly and test locations AMKOR Technology Korea. To meet the increased product demand, and to enable flexibility for	Original		PDF
MP-8000 Abstract: MP8000 mosfet 1500v 1000H 15KHZ MIC4128YME TM2016 soic 8l ep fortune date Code mic4127 Text: RELIABILITY REPORT DATE: 2/15/05 QUALITY ENG : PURPOSE: Micrel 408 435-3476 Dual Low Side MosFet Driver Family QUAL VEHICLE : PACKAGE TYPE : MIC4126BME 1.5A Epad Soic 8L .150 MIC4127BME 1.5A MIC4128YME 1.5A ASSEMBLY LOC M/C D/C # FAB LOC LOT # PROCESS Amkor Philippines	Original	MIC4126BME MIC4127BME MIC4128YME MP8000 4A23614 4A23615 1000H MP-8000 MP8000 mosfet 1500v 1000H 15KHZ TM2016 soic 8l ep fortune date Code mic4127	PDF
Untitled Abstract: No abstract text available Text: RELIABILITY REPORT DATE: 2/27/04 QUALITY ENG : PART NUMBER : DANA TRINH SY100EL14 408 474-1078 PROJECT : PACKAGE TYPE : ASSEMBLY LOC LOT # 20 W-SOIC Amkor B736BA 22188 DESCRIPTION: FAB MICREL D/C # ARRAY PROCESS 0124 EL ASSET1.2 2000H COMMENTS 1:5 CLOCK DISTRIBUTION	Original	SY100EL14 B736BA 2000H 1000H B756FB A306E1 B756FC B756EA FAIL200	PDF
Untitled Abstract: No abstract text available Text: RELIABILITY REPORT DATE: 10/25/04 QUALITY ENG : PRODUCT: DANA TRINH SY89833 PROJECT: 22088-1 PACKAGE TYPE: ASSEMBLY LOCATION 16L-MLF AMKOR D/C # LOT # FAB # ARRAY PROCESS 0219B B146001MNB MICREL SA ASSET 2 SY89833L 3.3V, 2GHz Any Differential INPUT-to-LVDS 1:4 Fanout Buffer/Translator w/Internal Termination	Original	SY89833 16L-MLF 0219B B146001MNB SY89833L B650GA JESD78 JESD22-A115	PDF
MS-018 Abstract: rh 115-2 00060 Text: LEADFRAME data sheet PLCC Features Plastic Leaded Chip Carrier PLCC Packages: Amkor's PLCC offerings cover the total range of industry-available options. It includes all square body packages from 20 lead through 84 lead. Also included is the rectangular	Original	MS-018 MS-016 rh 115-2 00060	PDF
MS-029 Abstract: 144 QFP body size amkor Text: LEADFRAME data sheet MQFP PowerQuad 4 Features MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit	Original	out029 MS-029/022 MS-029 144 QFP body size amkor	PDF
LQFP-48 thermal pad Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48 Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /	Original		PDF
amkor Abstract: amkor exposed pad Text: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a	Original		PDF
6016 Abstract: ON SEMICONDUCTOR TRACEABILITY On semiconductor SOIC Traceability DALLAS SOIC PRODUCT CHANGE Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: 11/6/97 Subject: PRODUCT CHANGE NOTICE - J71601 Description: Alternate Assembly Site for 8 Lead SOIC (150mil), AAPI – Amkor Philippines	Original	J71601 150mil) 6016 ON SEMICONDUCTOR TRACEABILITY On semiconductor SOIC Traceability DALLAS SOIC PRODUCT CHANGE	PDF

AMKOR Search Results

AMKOR Datasheets (30)

AMKOR Datasheets Context Search

amkor

PCB design for 0.2mm pitch csp package

Untitled

PCN0504

PCN0801

ic packages

CSPNL

TQ32

CCL-HL832NX-A

MO-166

E679

nitto GE-100L

Untitled

MS-026

Untitled

sumitomo EME G700L

MP-8000

Untitled

Untitled

MS-018

MS-029

LQFP-48 thermal pad

amkor

6016