DSN2 Search Results

NSR01L30NXT5G

Contextual Info: NSR01L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

152AA-01

Abstract: 0201 footprint marking 2x
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DSN2, 0.6x0.3, 0.4P, 0201 CASE 152AA−01 ISSUE O DATE 06 MAY 2009 SCALE 8:1 A B D 2X DIM A A1 b D E e L E 0.06 C 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.

NSR02F30NXT5G

Contextual Info: NSR02F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

NSR02F30NXT5G

Contextual Info: NSR02F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

NSR01L30NXT5G

Contextual Info: NSR01L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

152AD-01

Abstract: 152AD dsn2
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DSN2, 1.4x0.6, 0.75P CASE 152AD−01 ISSUE A DATE 18 MAR 2010 SCALE 8:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 0.05 C A B D DIM A A1 b D E L L2 L3 E 0.05 C

AND8464

Abstract: PNC0106A Soldering guidelines pin in paste reflow profile
Contextual Info: AND8464/D Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages Prepared by: Denise Thienpont, Steve St. Germain ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Recommendations for each of these items are included in this application note. Figure 2 illustrates the color scheme

Contextual Info: NSR02L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

NSR02L30NXT5G

Abstract: 0201 footprint
Contextual Info: NSR02L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

NSR01F30NXT5G

Contextual Info: NSR01F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

NSR01F30NXT5G

Contextual Info: NSR01F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

Contextual Info: NSR02F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

152AB

Abstract: CASE 152AB
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DSN2, 1.6x0.8, 0.9P, 0603 CASE 152AB−01 ISSUE A DATE 18 MAR 2010 SCALE 8:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 0.05 C A B D DIM A A1 b D E L L2

Contextual Info: NSR01F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

AND8398

Abstract: stencil tension PNC0106A
Contextual Info: AND8398/D Board Level Application Note for 0201 DSN2 0.6 x 0.3mm Package Prepared by: Steve St. Germain, Roger Arbuthnot, Denise Thienpont, Lon Robinson, Darrell Truhitte ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Board Mounting Process

152AC

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DSN2, 1.0x0.6, 0.575P, 0402 CASE 152AC−01 ISSUE B DATE 18 MAR 2010 SCALE 8:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 0.05 C A B D DIM A A1 b D E L L2

NSR01F30NXT5G

Contextual Info: NSR01F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

NSR02L30NXT5G

Abstract: DSN2 0201 DSN footprint
Contextual Info: NSR02L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

digital dts dolby 5.1 ic

Abstract: ac3 7.1 decoder ic YAMAHA DSP ac3 dts decoder dts decoder dts decoder ic YSS912-F dolby to dts circuit DSP DTS YSS902
Contextual Info: YSS912 AC3D2 Dolby Digital AC-3 / Pro Logic / DTS decoder + Sub DSP INTRODUCTION The YSS912 is one chip LSI consisting two built-in DSP’s ; Dolby Digital (AC-3) / Pro Logic / DTS decoder (Main DSP) and a sound processing DSP (Sub DSP). Sub DSP is capable of realizing various sound fields, such as

Contextual Info: Biased Schottky Diode Detectors BROADBAND BIASED DETECTORS DSN Series HIGH SENSITIVITY/LOW VSWR DETECTORS DQN Series 500 MHz to 26.0 GHz ♦ Fast Response Time ♦ High Sensitivity ♦ Wide Dynamic Range ♦ Coaxial ♦ Drop-In ♦ Replaceable Connectors 100 MHz to 3.5 GHz

Contextual Info: CM1282-01D1 1-Channel Ultra-Low Capacitance ESD Protection Device Product Description http://onsemi.com The CM1282−01D1 is an ultra−low capacitance, 1−channel ESD protection device. The CM1282−01D1 is fully compliant with IEC 61000−4−2 and is also RoHS−compliant.

Contextual Info: NSR05F40QNXT5G Schottky Diode Optimized for High Frequency Switching Power Supplies These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current and are offered in a Chip Scale Package CSP to reduce board space. The low thermal resistance

nsr05f40nxt5g

Abstract: NSR05F40
Contextual Info: NSR05F40NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current and are offered in a Chip Scale Package CSP to reduce board space. The low thermal resistance enables designers to meet the challenging task of achieving higher

NSR20F30NXT5G

Abstract: 20F30 NSR20F30NXT5 of665
Contextual Info: NSR20F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current and are offered in a Chip Scale Package CSP to reduce board space. The low thermal resistance enables designers to meet the challenging task of achieving higher