DPS512X Search Results

Contextual Info: DENSE-PAC 16 Megabit CM OS SRAM MICROSYSTEMS DPS512X32ML/DPS512X32MW PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: □PM Dense-Pac Microsystems, Inc. DPS512X32V3 ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIM INARY DESCRIPTION: The DPS512X32V3 "VERSA-STACK" module is a revo lutio nary new mem ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

Contextual Info: DENSE-PAC 16 Megabit CMOS SRAM DPS512X32ML7DPS512X32MW MI G R Ö S Y S ! B M S DESCRIPTION: The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: 8 Megabit High Speed CM OS SRAM D E N S E - P A C DPS512X 16Cn3/DPS512X 16Bn3 M IC RO SYSTEM S DESCRIPTION: The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM ''STACK7' modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCC .

Contextual Info: 8 Megabit High Speed CMOS SRAM DPS512X16Cn3/DPS512X16Bn3 DESCRIPTION: The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .

DPS512X8MKN3

Contextual Info: 512Kx8, 20 - 45ns, STACK/DIP 30A129-11 D 4 Megabit High Speed CMOS SRAM DPS512X8MKN3 PRELIMINARY DESCRIPTION: The DPS512X8MKN3 High Speed SRAM ‘’STACK’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable

DPS512X32MKY5

Contextual Info: 16 Megabit High Speed SRAM DPS512X32MKY5 PRELIMINARY DESCRIPTION: The DPS512X32MKY5 is the 512K x 32 SRAM module that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of four 512K x 8 SRAM’s that are configured as 512K x 32.

f050

Abstract: we 510
Contextual Info: D EN S E - P A C 8 Megabit CMOS SRAM M I C R O S Y S T E M S DPS512X 16n3 DESCRIPTION: The DPS512X16n3 SRAM "STACK” modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J” leaded

50-PIN

Abstract: DPS512X16A3
Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabits CM OS SRAM DPS512Xl6n3 D ESCRIPTIO N ; The DPS512X16n3 SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded

Dense-Pac Microsystems

Abstract: 1024KX8 SRAM 35nS
Contextual Info: D E N S E -P A C 8 Megabit High Speed CMOS SRAM DPS512X16Cn3/DPS512X16Bn3 M I C R O S Y S T E M S DESCRIPTION: The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM "STACK” modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Lead less Chip Carriers SLCC .

Contextual Info: DENSE-PAC 16 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X32MFn3 ADVANCED INFORMATION D E S C R IP T IO N : The DPS512X32MFn3 High Speed S R A M "S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO.

Contextual Info: DENSE-PAC MICROSYSTEMS 16 Megabit CMOS SRAM DPS512X32ML/DPS512X32MW PRELIMINARY DESCRIPTION: P IN -O U T D IA G R A M The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: DENSE-PAC 8 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X 16Cn3/DPS512X 16Bn3 DESCRIPTION: The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM “ STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

Contextual Info: □PM DPS512X32AV3 Dense-Pac Microsystems. Inc. HIGH SPEED 512K X 32 CMOS SRAM VERSA-STACK O ADVANCED INFORMATION DESCRIPTION: The DPS512X32AV3 “ VERSA-STACK" m odule is a revolutionary new high speed m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable leadless C hip Carriers SLCC m ounted on a

Contextual Info: DENSE-PAC 12 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X24MFn3 ADVANCED INFORMATION DESCRIPTION : The DPS512X24MFn3 High Speed SRAM "S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

Contextual Info: DENSE-PAC 16 Megabit CMOS SRAM DPS512X32MXP MICROSYSTEMS PRELIMINARY DESCRIPTION: The DPS512X32MXP is a 68-pin surface mount module consisting of four 512K x 8 SRAM devices in plastic TSOP packages surface mounted on a FR-4 substrate. The module is available with "J"-Leads.

Contextual Info: 16 Megabit CMOS SRAM DPS512X32MXP M í C \i O S Y S T E M S PRELIMINARY DESCRIPTION: The DPS512X32MXP is a 68-pin surface mount module consisting of four 512K x 8 SRAM devices in plastic TSOP packages surface mounted on a FR-4 substrate. The module is available with "T-Leads.

Contextual Info: 12 Megabit High Speed CMOS SRAM DENSE-PAC M ICR O S Y. S I E M DPS512X24MFn3 S PRELIMINARY SLCC Stack D E SC R IP T IO N : The DPS512X24MFn3 High Speed SRAM "STACK'7modules are a revolutionary new memory subsystem using Dense-Pac Microsystems7 ceramic Stackable Lead less Chip Carriers SLCQ.

DPS512X32BV3

Contextual Info: 16 Megabit High Speed CMOS SRAM DPS512X32BV3 DESCRIPTION: The DPS512X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

Contextual Info: 8 Megabit High Speed CMOS SRAM DPS512X16MKn3 DESCRIPTION: The DPS512X16MKn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded

Contextual Info: □PM DPS512X16A3 . Dense-Pac Microsystems Inc. O CERAMIC 512K X 16 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS512X16A3 "DENSE-STACK" module is a re v o lu tio n a ry n e w m e m o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless

Contextual Info: □PM DPS512X16AA3 Dense-Pac Microsystems. Inc. HIGH SPEED CERAMIC 512K X 16 CMOS SRAM MODULE O ADVANCED INFORMATION DESCRIPTION: The DPS512X16AA3 "DEN SE-STACK" module is a revolutionary new high speed mem ory subsystem using Dense-Pac M icrosystem s' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired

ersa ms 8000

Contextual Info: □PM DPS512X32V3 Dense-Pac Microsystems, Inc. ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIMINARY D ESC R IP T IO N : The D PS512X32V 3 "V ERSA -STA CK" module is a re v o lu tio n a ry n ew m e m o ry su b sy ste m u sing Dense-Pac Microsystems' ceramic Stackable Leadless

Contextual Info: DENSE-PAC 12 Megabit High Speed CMOS SRAM DPS512X24MFn3 MICROSYSTEMS ADVANCED INFORMATION D E S C R IP T IO N : The DPS512X24MFn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ.