DPS512X32M Search Results

Contextual Info: DENSE-PAC 16 Megabit CM OS SRAM MICROSYSTEMS DPS512X32ML/DPS512X32MW PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: DENSE-PAC 16 Megabit CMOS SRAM DPS512X32ML7DPS512X32MW MI G R Ö S Y S ! B M S DESCRIPTION: The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

DPS512X32MKY5

Contextual Info: 16 Megabit High Speed SRAM DPS512X32MKY5 PRELIMINARY DESCRIPTION: The DPS512X32MKY5 is the 512K x 32 SRAM module that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of four 512K x 8 SRAM’s that are configured as 512K x 32.

Contextual Info: DENSE-PAC 16 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X32MFn3 ADVANCED INFORMATION D E S C R IP T IO N : The DPS512X32MFn3 High Speed S R A M "S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO.

Contextual Info: DENSE-PAC MICROSYSTEMS 16 Megabit CMOS SRAM DPS512X32ML/DPS512X32MW PRELIMINARY DESCRIPTION: P IN -O U T D IA G R A M The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: DENSE-PAC 16 Megabit CMOS SRAM DPS512X32MXP MICROSYSTEMS PRELIMINARY DESCRIPTION: The DPS512X32MXP is a 68-pin surface mount module consisting of four 512K x 8 SRAM devices in plastic TSOP packages surface mounted on a FR-4 substrate. The module is available with "J"-Leads.

Contextual Info: 16 Megabit CMOS SRAM DPS512X32MXP M í C \i O S Y S T E M S PRELIMINARY DESCRIPTION: The DPS512X32MXP is a 68-pin surface mount module consisting of four 512K x 8 SRAM devices in plastic TSOP packages surface mounted on a FR-4 substrate. The module is available with "T-Leads.

Contextual Info: DENSE-PAC m ic ro s y s te m s /H-^OmSUS High Density Memory Device 16 Megabit High Speed SRAM DPS512X32MY5 PRELIMINARY DESCRIPTION: The DPS512X32MY5 is the 512K x 32 SRAM module the utilize the new and innovative space saving TSOP stacking technology. The module is constructed of four

DPS512X32MKV3

Contextual Info: 2Mx8/1Mx16/512Kx32, 20 - 45ns, PGA 30A128-02 C 16 Megabit High Speed CMOS SRAM DPS512X32MKV3 DESCRIPTION: The DPS512X32MKV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip

DPS512X32MKV3

Contextual Info: DENSE-PAC 16 Megabit High Speed CMOS SRAM DPS512X32MKV3 M 1C R O S Y S T E M S DESCRIPTION: The D PS 512X 32M K V3 "V E R S A -S T A C K ” m odule is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip

Contextual Info: 16 Megabit High Speed CMOS SRAM D E N S E - P A C M I C R O S Y S T E MS DPS512X32MFn3 ADVANCED INFORMATION D E S C R IP T IO N : SLCC Stack T he DPS512X32M Fn3 High Speed SRA M " S T A C K " modules are a re vo lu tio n a ry n e w m em ory subsystem using D ense-Pac

32A18

Contextual Info: DENSE-PAC 16 Megabit C M O S SRAM D PS512X32M L/D PS512X32M W M I C R O S Y S T E M S P R ELIM IN A R Y DESCRIPTION: PIN-OUT DIAGRAM The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: 2Mx8/1Mx16/512Kx32, 17 - 25ns, ZIP/SIMM 30A148-00 D 16 Megabit CMOS SRAM DPS512X32ML/DPS512X32MW DESCRIPTION: The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: 16 Megabit High Speed CMOS SRAM D E N S E - P A C M I C R O S Y S T DPS512X32MFn3 E M S ADVANCED INFORMATION SLCC Stack D E S C R IP T IO N : The DPS512X32MFn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

1431 T

Abstract: 56TAL
Contextual Info: DENSE-PAC 16 Megabit CM O S SRAM M I C R O S Y S T E M S D P S 5 1 2 X 3 2 M L /D P S 5 12 X 3 2 M W PR ELIM IN A R Y D ESCRIPTIO N : P IN -O U T DIAGRAM The DPS512X32M L/DPS512X 32M W is a 512K x 32 high density, high-speed Static Random Access M em ory SRAM module, intended

Contextual Info: 2Mx8/1Mx16/5Mx32, 20 - 45ns, STACK 30A154-04 A 16 Megabit High Speed CMOS SRAM DPS512X32MFn3 DESCRIPTION: SLCC Stack The DPS512X32MFn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .

Contextual Info: DENSE-PAC 16 Megabit High Speed CMOS SRAM DPS51 2X 3 2 M KV3 MICROSYSTEMS PRELIMINARY DESCRIPTION: The D PS512X32M KV 3 "V ER SA -S TA C K " module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip

PS1M

Abstract: 36PIN 32 PIN
Contextual Info: R E F E R E N C E SIZE SHAM PART N U M B E R 4 Megabit 6 Megabit 8 Megabit 9 Megabit SIZE \ I O R G A N IZ A T IO N SPEED ns 256Kx8 25, 35, 45, 55, 70 32-Pin DIP 47 32-Pin 32-Pin 36-Pin 36-Pin SOJ SOL SOJ SOL 53 PACKAG E PAGE I I' K ( ) I ) 11 ( I DPS256S8AP

256KX8 SIMM

Abstract: 512kx8 dram simm dram zip 256kx16 1mx8 DPS 119 61 sram 256kx8
Contextual Info: TABLE OF CONTENTS GENERAL PRODUCT INFORMATION Reference by S iz e . 4 Dense-Pac Microsystems Modules and M onolithics. 5