DPS256X Search Results

Contextual Info: ^ f= ¡| j¡ñ ¡P > 'v.:. U DPS256X32AV3 ^ l v l Dense-Pac Microsystems, In c ^ y _ H IG H SPEED 256K X 32 C M O S SR A M VERSA-STACK w ADVANCED INFORMATION DESCRIPTION: The D PS2 5 6 X3 2 A V 3 "V E R SA -ST A C K " module is a revolutionary new high speed memory subsystem

Contextual Info: 4 Megabit High Speed CMOS SRAM DPS256X16Cn3/DPS256X16Bn3 DESCRIPTION: The DPS256X16Cn3/DPS256X16Bn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .

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Abstract: DPS256X
Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit CM OS SRAM DPS256X16n3 DESCRIPTION: The DPS256X16n3SRAM "S T A C K " modules are a revolutionarynew memory subsystem using Dense-Pac Microsystems'ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, " j " leaded

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Abstract: SH 05.22 DPS256X36L AL154
Contextual Info: D E N S E - P A 9 Megabit CMOS SRAM C MICROSYSTEMS DPS256X36L PRELIM ÎNARY D E S C R IP T IO N : The DPS256X36L is a 25 6K X 36 high-density, low-power static RAM module comprised of eight 256K X 4 and four 256K x 1 monolithic SRAM's and decoupling capacitors surface mounted on a FR-4

Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS SRAM DPS256X32V3 DESCRIPTION: The D PS256X32V 3 "V E R S A -ST A C K ” module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO mounted on a co-fired ceramic substrate. It offers 8

Contextual Info: DENSE-PAC 8 Megabit CMOS SRAM MICROSYSTEMS DPS256X32L/DPS256X32W D ES C R IP T IO N : T he D PS256X32L/DPS256X32W is a 256K x 32 high density, high-speed Static Random Access Memory SRAM m odule, intended for high performance computers and digital signal processing applications.

Contextual Info: DENSE-PAC 4 Megabit CMOS SRAM MICROSYSTEMS DPS256X32V3 DESCRIPTION: The DPS256X32V3 "VERSA-STACK" m odule is a r e v o lu tio n a r y n e w m e m o ry subsystem u sin g Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

Contextual Info: 8 Megabit CMOS SRAM D E N S E -P A C MICROSYSTEMS DPS256X32L/DPS256X32W DESCRIPTION: The DPS256X32L/DPS256X32W is a 256K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing applications.

Contextual Info: 8 Megabit CMOS SRAM DPS256X32V3 DESCRIPTION: The DPS256X32V3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 8

Contextual Info: DPS256X32AV3 Dense-Pac Microsystems. Inc. ~ H IG H SPEED 256K X 32 C M O S SR A M VERSA-STACK PRELIMINARY D ESC RIPTIO N : The D PS25 6X32 A V3 "V E R S A - S T A C K " m odule is a revolutionary n e w high speed m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable

Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit CMOS SRAM DPS256X16n3 DESCRIPTION: The DPS256X16n3SRAM "STACK" modules are a revolutionarynew memory subsystem using Dense-PacMicrosystems'ceramicStackable Leadless Chip Carriers SLCC . Available in straight leaded, " J " leaded

Contextual Info: DENSE-PAC MICROSYSTEMS 9 Megabit CMOS SRAM DPS256X36L PRELIM INARY DESCRIPTION: The DPS256X36L is a 256K X 36 high-density, low-power static RAM module comprised of eight 256K X 4 and four 256K x 1 monolithic SRAM's and decoupling capacitors surface mounted on a FR-4

Contextual Info: □PM DPS256X16A3 Dense-Pac Microsystems, Ina O CERAMIC 256K X 16 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS256X16A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC mounted on a

Contextual Info: 4 Megabit High Speed CM OS SRAM D E N S E - P A C DPS256X16Cn3/DPS256X16Bn3 MICROSYSTEMS DESCRIPTION: The DPS256X16Cn3/DPS256X16Bn3 High Speed SRAM ''STACK7' modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCC .

Contextual Info: 1Mx8/512Kx16/256Kx32, 17 - 35ns, ZIP/SIMM 30A151-00 A 8 Megabit CMOS SRAM DPS256X32KL/DPS256X32KW DESCRIPTION: The DPS256X32KL/DPS256X32KW is a 256K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: □P M DPS256X16A3 Dense-Pac Microsystems, Inc. CERAMIC 256K X 16 C M O S SRAM MODULE O PRELIMINARY DESCRIPTION: The D PS256X16A 3 "D E N S E -S T A C K " module is a revo lutio n ary new m em ory subsystem usin g D e n se -P a c M ic ro s y s te m s ' ceram ic Stackable

Contextual Info: DENSE-PAC 8 Megabit High Speed CMOS SRAM M ICRO S YSTEM S DPS256X32CV3/D PS256X32BV3 DESCRIPTION: The DPS256X32CV3/DPS256X32BV3 "VER SA-STAC K” module is a revolutionary new high speed m em ory subsystem using Dense-Pac Microsystems’ ceramic Stackable Lead less Chip Carriers SLCC mounted

256K STACK RAM

Abstract: 9000-098J making A10
Contextual Info: DENSE-PAC MICROSYSTEMS 2ÛE D • 575^415 OODQSOb i* M D P C DPS256X16AA3 HIGH SPEED CERAMIC 256K X 16 CMOS SRAM MODULE ADVANCED INFORMATION DESCRIPTION: The DPS256X16AA3 "DENSE-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems'

Contextual Info: DPS256X16A3 Dense-Pac Microsystems. Inc. CERAMIC 256K X 16 C M O S SRAM MODULE O PRELIMINARY DESCRIPTION: The D P S 2 5 6 X 1 6 A 3 "D E N S E - S T A C K " m odule is a re v o lu t io n a ry n e w m e m o ry su b sy ste m u sin g D e n s e -P a c M ic r o s y s t e m s ' ce ra m ic S ta c ka b le

Contextual Info: DENSE PAC 4 Megabit High Speed CMOS SRAM DPS256X16Cn3/DPS256X16Bn3 MICROSYSTEMS DESCRIPTION: The DPS256X16Cn3/DPS256X16Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

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Contextual Info: 8 Megabit CM OS SRAM M I C K ÖS V S T EM 'S DPS256X32KL/DPS256X32KW DESCRIPTION: The DPS256X32KIVDPS256X32KW is a 256K x 32 high density, high-speed Static Random Access M e m o ry S R A M m od ule, in tend ed for high performance computers and digitai signal processing

Contextual Info: DPS256X32AV3 Dense-Pac Microsystems. Inc. ^ H IG H SPEED 256K X 32 C M O S SRAM VERSA-STACK PRELIMINARY DESCRIPTION: The D P S 2 5 6X 3 2 A V 3 "VERSA-STACK" m odule is a revolutionary n ew high speed m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable

Contextual Info: □PM DPS256X32V3 Dense-Pac Microsystems, Inc. O C E R A M IC 256K X 32 C M O S S R A M VERSA-STACK PRELIMINARY DESCRIPTION: The D PS256X32V3 "VER SA -STA C K " module is a re v o lu tio n a ry n ew m em o ry sub system using Dense-Pac Microsystems' ceramic Stackable Leadless

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Contextual Info: 4 Megabit CMOS SRAM B E N S E -P Á C M i C R éK Y ST E MS DPS256X16n3 DESCRIPTION: The DPS256X16n3 SRAM ''STACK'7modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCC . Available in straight leaded, " j " leaded