DIP 32 DIMENSION Search Results

32-PIN

Abstract: PD-03 745 diode dimensions PD05 32 PIN
Contextual Info: Package Diagram DIP Modules 32-Pin DIP Module PD02 1.590 1.610 0.600 0.620 0.590 0.610 0.007 0.013 0.315 0.335 0.100 TYP 0.015 0.025 0.125 0.175 0.050 TYP 32-Pin DIP Module PD03 1 DIMENSIONSININCHES MIN. MAX. Package Diagram 32-Pin DIP Module PD05 1.745 1.755

PA32-32-DP

Abstract: PA32-32-DP-PP 3232DPSM
Contextual Info: PA32-32-DP -PP Data Sheet 32 pin DIP socket/32 pin PLCC plug Supported Device/Footprints Adapter Construction The PA32-32-DP adapter accepts 32 pin DIP devices and plugs into 32 pin PLCC production sockets. This allows DIP devices, or emulators with DIP plugs, to be used during development of

Contextual Info: PA28-32-20-Dx-QF Data Sheet 28 pin DIP 0.3” socket /32 pin QFP plug Adapter Dimensions Supported Device/Footprints The PA28-32-20-Dx-QF adapters accept 28 pin DIP devices and have a removable 32 pin QFP solder-down plug. This allows DIP devices, or emulators with DIP plugs, to be used during

Contextual Info: SKINNY DUAL IN-LINE PACKAGE 32 PIN PLASTIC DIP-32P-M02 EIAJ code : ∗DIP032-P-0300-1 32-pin plastic SK-DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-32P-M02 32-pin plastic SK-DIP (DIP-32P-M02) +0.20 39.98 –0.30 +.008 1.574 –.012

DIP032-P-0600-1

Contextual Info: DUAL IN-LINE PACKAGE 32 PIN PLASTIC DIP-32P-M01 EIAJ code : ∗DIP032-P-0600-1 32-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-32P-M01 32-pin plastic DIP (DIP-32P-M01) +0.20 40.44 –0.30 +.008 1.592 –.012 INDEX-1

d-3200

Contextual Info: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC DIP-32P-M02 EIAJ code :∗DIP032-P-0300-1 32-pin plastic SK-DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-32P-M02 32-pin plastic SK-DIP (DIP-32P-M02)

32 PIN

Contextual Info: SLIM DUAL IN-LINE PACKAGE 32 PIN CERAMIC DIP-32C-A02 EIAJ code : ∗DIP032-C-0400-1 32-pin ceramic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Metal seal DIP-32C-A02 32-pin ceramic SL-DIP (DIP-32C-A02) 40.13±0.43 (1.580±.017) R1.27(.050)

DIP032-P-0600-1

Abstract: DIP-32P-M01
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC DIP-32P-M01 EIAJ code :∗DIP032-P-0600-1 32-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-32P-M01 32-pin plastic DIP (DIP-32P-M01) +0.20 40.44 –0.30

Contextual Info: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC DIP-32C-A02 EIAJ code :∗DIP032-C-0400-1 32-pin ceramic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Metal seal DIP-32C-A02 32-pin ceramic SL-DIP (DIP-32C-A02) 40.13±0.43

PA28-32-DP

Abstract: PA28-32-DP-PP 2832DPSM 27x512
Contextual Info: PA28-32-DP -PP Data Sheet 28 pin DIP socket/32 pin PLCC plug Supported Device/Footprints Adapter Construction The PA28-32-DP adapter accepts 28 pin DIP devices and plugs into 32 pin PLCC production sockets. This allows DIP devices, or emulators with DIP plugs, to be used during development of

DIP032-P-0600-1

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC To Top / Package Lineup / Package Index DIP-32P-M01 EIAJ code :∗DIP032-P-0600-1 32-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-32P-M01 32-pin plastic DIP

PA32TS14-OT

Abstract: 32TS14
Contextual Info: PA32TS14-OT Data Sheet 32 pin TSOP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA32TS14-OT adapter converts the pinout of a 32 pin TSOP device to its 32 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket.

29f512

Abstract: pinout socket 7 PA32TS20-OT 29F010
Contextual Info: PA32TS20-OT Data Sheet 32 pin TSOP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA32TS20-OT adapter converts the pinout of a 32 pin TSOP device to its 32 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket. Several Flash EEPROM

Contextual Info: PA32QFN-32 Data Sheet 32 pin QFP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of many 32 pin QFN devices in their 32 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via

PA32-32

Abstract: PA32-32Z 32-32ZR lcc 20 test socket clcc 32 socket lcc 28 socket 32 pin plcc socket J-Lead, plcc clcc 28 socket footprint plcc 32
Contextual Info: PA32-32 Z Data Sheet 32 pin PLCC socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of many 32 pin PLCC, CLCC and LCC devices in their 32 pin DIP footprint. The adapter is made up of 2 sub-assemblies. They assemble via

W9759

Abstract: MBM29F010 29C101T15 intel 28F020 intel 28F010 28F010T AM29F010 28F020T 28F001BX-B 28F001BX-T
Contextual Info: Created in DoubleCAD XT, www.DoubleCAD.com 17.78 mm 6.42 mm 32 pin TSOP to 32 pin DIP 22.04 mm Part Number W9759 Product Group Programmer Adapters Top Package TSOP Top Pitch 0.5mm Bottom Package DIP Bottom Pitch 0.6" Top Pins 32 Bottom Pins 32 15.24 mm 2.54 mm

PA32Q1498

Abstract: 32QF1498
Contextual Info: PA32Q1498 Data Sheet 32 pin QFP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of many 32 pin QFP devices in their 32 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via

PA32Q-1498-1

Abstract: 32QF1498-1
Contextual Info: PA32Q-1498-1 Data Sheet 32 pin QFP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of many 32 pin QFP devices in their 32 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via

Contextual Info: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC To Top / Package Lineup / Package Index DIP-32C-A02 EIAJ code :∗DIP032-C-0400-1 32-pin ceramic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Metal seal DIP-32C-A02

32-pin

Abstract: fujitsu
Contextual Info: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC To Top / Package Lineup / Package Index DIP-32P-M02 EIAJ code :∗DIP032-P-0300-1 32-pin plastic SK-DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-32P-M02

3224P

Contextual Info: PA32-24-wP Z d Data Sheet 32 pin PLCC socket/24 pin DIP 0.3” or 0.6” plug Introduction Adapter Construction This data sheet describes several adapters. They are all similar in that they have 32 pin PLCC test sockets and 24 pin DIP plugs. They differ in the dimensions of the DIP plug and the wiring from

PA40SO1-OT

Abstract: XXSO1-OT test socket 32 pin Enplas Enplas OTS 36 32 pin test socket footprint dip 40 Enplas 14 pin footprint dip 16 Enplas 28 pin
Contextual Info: PAxxSO1-OT Data Sheet xx pin SO Socket/xx pin DIP 0.6" plug Supported Device/Footprints Adapter Dimensions Using this adapter, the 32 and 40 pin SO EPROM packages can be programmed on DIP programmers. Device Device 32 pin 40 pin Mfgr Many " Package SO " Footprint

Contextual Info: PA34-32-1SP6 Data Sheet 34 pin SO 0.040” pitch socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This PA34-32-1SP6 adapter allows programming of an STMicro ST7263 in a 34 pin SOIC package in its 32 pin DIP footprint. The adapter is made up of 2 sub-assemblies. They assemble via

Enplas drawings

Abstract: TSOP 54 PIN Enplas OTS 0,047 63 DIP 32 DIMENSION enplas TSOP 40 socket F28F010 F28F020
Contextual Info: CIC-32TS-32D-A6-ENP-R 32-Lead TSOP to a 32-Pin DIP 3/98 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: F28F010 F28F020 SOCKET: BASE 32-Pin DIP PIN NAMES SOCKET 32-Lead TSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32