PGA-208c-a02
Abstract: PGA209-C-S17U-1
Text: PIN GRID ARRAY PACKAGE 208 PIN CERAMIC PGA-208C-A02 EIAJ code : ∗PGA209-C-S17U-1 208-pin ceramic PGA Number of pins 209 pins includes extra index pin Lead pitch 100mil Pin matrix 17 Sealing method Metal seal (PGA-208C-A02) 208-pin ceramic PGA (PGA-208C-A02)
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PGA-208C-A02
PGA209-C-S17U-1
100mil
208-pin
PGA-208C-A02)
R208002SC-2-2
PGA-208c-a02
PGA209-C-S17U-1
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PDF
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a06 transistor
Abstract: 179-PIN
Text: PIN GRID ARRAY PACKAGE 179 PIN CERAMIC PGA-179C-A06 179-pin ceramic PGA Lead pitch 100mil Pin matrix 16 Sealing method Metal seal PGA-179C-A06 179-pin ceramic PGA (PGA-179C-A06) 2.54 ± 0.25 (.100 ± .010) 35.99 (1.417) DIA TYP 1.27 (.050) DIA TYP (4 PLCS)
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PGA-179C-A06
100mil
179-pin
PGA-179C-A06)
R179009SC-1-2
a06 transistor
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PDF
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149C
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 149 PIN CERAMIC PGA-149C-A03 EIAJ code : HPGA149-C-S15D-2 149-pin ceramic PGA Lead pitch 100mil Pin matrix 15 Sealing method Metal seal PGA-149C-A03 149-pin ceramic PGA (PGA-149C-A03) 2.54 ± 0.25 (.100 ± .010) 36.00 (1.417) DIA 0.46 ± 0.05
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PGA-149C-A03
HPGA149-C-S15D-2
100mil
149-pin
PGA-149C-A03)
R149002SC-3-2
149C
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PDF
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Untitled
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 149 PIN CERAMIC PGA-149C-A09 EIAJ code : HPGA149-C-S15D-3 Lead pitch 100mil Pin matrix 15 Sealing method Metal seal 149-pin ceramic PGA PGA-149C-A09 149-pin ceramic PGA (PGA-149C-A09) 2.54 ± 0.25 (.100 ± .010) 0.46 +– 0.05 0.08
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PGA-149C-A09
HPGA149-C-S15D-3
100mil
149-pin
PGA-149C-A09)
R149009SC-2-2
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PDF
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Untitled
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 256 PIN CERAMIC PGA-256C-A05 256-pin ceramic PGA Lead pitch 100mil Pin matrix 19 Sealing method Metal seal PGA-256C-A05 256-pin ceramic PGA (PGA-256C-A05) 3.40 +– 0.41 0.36 (.134 +– .016 .014 ) 8.89 (.350) MAX 1.27 ± 0.25 (.050 ± .010)
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PGA-256C-A05
100mil
256-pin
PGA-256C-A05)
R256007SC-2-2
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PDF
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PGA-121C-A02
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 121 PIN CERAMIC PGA-121C-A02 121-pin ceramic PGA Lead pitch 100mil Pin matrix 13 Sealing method Metal seal PGA-121C-A02 121-pin ceramic PGA (PGA-121C-A02) 0.46 +– 0.05 0.08 DIA (.018 +– .002 .003 ) 2.54 ± 0.25 (.100 ± .010) 27.00 (1.063)
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PGA-121C-A02
100mil
121-pin
PGA-121C-A02)
R121002SC-1-2
PGA-121C-A02
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PDF
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PGA089-C-S12U-2
Abstract: 88PIN
Text: PIN GRID ARRAY PACKAGE 88 PIN CERAMIC PGA-88C-A02 EIAJ code : ∗PGA089-C-S12U-2 88-pin ceramic PGA Number of pins 89 pins includes extra index pin Lead pitch 100mil Pin matrix 12 Sealing method Metal seal (PGA-88C-A02) 88-pin ceramic PGA (PGA-88C-A02) 0.46 +– 0.18
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PGA-88C-A02
PGA089-C-S12U-2
100mil
88-pin
PGA-88C-A02)
R88006SC-3-2
PGA089-C-S12U-2
88PIN
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PDF
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PGA179-C-S15U-2
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 179 PIN CERAMIC PGA-179C-A03 EIAJ code : ∗PGA179-C-S15U-2 179-pin ceramic PGA Lead pitch 100mil Pin matrix 15 Sealing method Metal seal PGA-179C-A03 179-pin ceramic PGA (PGA-179C-A03) 2.54±0.25 (.100±.010) 35.56(1.400) REF 1.27(.050)TYP DIA
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PGA-179C-A03
PGA179-C-S15U-2
100mil
179-pin
PGA-179C-A03)
R179004SC-3-2
PGA179-C-S15U-2
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PDF
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PGA-299C-A01
Abstract: PGA299-C-S20D-1
Text: PIN GRID ARRAY PACKAGE 299 PIN CERAMIC PGA-299C-A01 EIAJ code : ∗PGA299-C-S20D-1 299-pin ceramic PGA Lead pitch 100mil Pin matrix 20 Sealing method Metal seal PGA-299C-A01 299-pin ceramic PGA (PGA-299C-A01) 2.41 ± 0.10 (.095 ± .004) 1.65 ± 0.10 (.065 ± .004)
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PGA-299C-A01
PGA299-C-S20D-1
100mil
299-pin
PGA-299C-A01)
R299001SC-2-2
PGA-299C-A01
PGA299-C-S20D-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 80 PIN CERAMIC PGA-80C-A01 EIAJ code : HPGA080-C-S12D-1 80-pin ceramic PGA Lead pitch 100mil Pin matrix 12 Sealing method Metal seal PGA-80C-A01 80-pin ceramic PGA (PGA-80C-A01) 2.54±0.25 (.100±.010) 27.00(1.063)DIA 27.94(1.100)
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PGA-80C-A01
HPGA080-C-S12D-1
100mil
80-pin
PGA-80C-A01)
R80001SC-3-2
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PDF
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EPA120B-100P
Abstract: 100MIL
Text: EPA120B-100P High Efficiency Heterojunction Power FET UPDATED 01/13/2006 • • • • • • NON-HERMETIC 100MIL METAL FLANGE PACKAGE +29.0dBm TYPICAL OUTPUT POWER 11.5dB TYPICAL POWER GAIN AT 12GHz 0.3 X 1200 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION
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EPA120B-100P
100MIL
12GHz
18GHz
175oC
-65/175oC
EPA120B-100P
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PDF
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100MIL
Abstract: EPA240D-100P AuSn eutectic
Text: EPA240D-100P High Efficiency Heterojunction Power FET UPDATED 11/14/2005 • • • • • • NON-HERMETIC 100MIL METAL FLANGE PACKAGE +33 dBm TYPICAL OUTPUT POWER 20 dB TYPICAL POWER GAIN AT 2GHz 0.4 X 2400 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION
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EPA240D-100P
100MIL
120mA
620mA
EPA240D-100P
AuSn eutectic
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PDF
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EPA160A
Abstract: 9018 transistor EPA160A-100P 100MIL
Text: EPA160A-100P High Efficiency Heterojunction Power FET UPDATED 02/15/2005 • • • • • • NON-HERMETIC 100MIL METAL FLANGE PACKAGE +31.0dBm TYPICAL OUTPUT POWER 11.5dB TYPICAL POWER GAIN AT 12GHz 0.3 X 1600 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION
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EPA160A-100P
100MIL
12GHz
18GHz
EPA160A
9018 transistor
EPA160A-100P
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PDF
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MA 7824
Abstract: EPA120B-100P 100MIL
Text: EPA120B-100P High Efficiency Heterojunction Power FET UPDATED 10/30/2006 • • • • • • NON-HERMETIC 100MIL METAL FLANGE PACKAGE +29.0dBm TYPICAL OUTPUT POWER 11.5dB TYPICAL POWER GAIN AT 12GHz 0.3 X 1200 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION
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EPA120B-100P
100MIL
12GHz
18GHz
MA 7824
EPA120B-100P
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PDF
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DIP-24P-M04
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M04 EIAJ code : ∗DIP024-P-0400-1 24-pin plastic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Plastic mold DIP-24P-M04 24-pin plastic SL-DIP (DIP-24P-M04) +0.20 30.28 –0.30 +.008 1.192 –.012
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DIP-24P-M04
DIP024-P-0400-1
100mil
400mil
24-pin
DIP-24P-M04)
D24025S-3C-3
DIP-24P-M04
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M05 EIAJ code : ∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP (DIP-28P-M05) +0.20 35.73 –0.30 +.008 1.407 –.012 INDEX-1
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DIP-28P-M05
DIP028-P-0600-2
100mil
600mil
28-pin
DIP-28P-M05)
D28013S-3C-2
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PDF
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DIP-14P-M02
Abstract: DIP14-P
Text: DUAL IN-LINE PACKAGE 14 PIN PLASTIC DIP-14P-M02 EIAJ code : ∗DIP014-P-0300-1 14-pin plastic DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-14P-M02 14-pin plastic DIP (DIP-14P-M02) +0.20 19.55 –0.30 +.008 .770 –.012 INDEX-1
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DIP-14P-M02
DIP014-P-0300-1
100mil
300mil
14-pin
DIP-14P-M02)
D14010S-4C-3
DIP-14P-M02
DIP14-P
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 40 PIN PLASTIC DIP-40P-M02 EIAJ code : ∗DIP040-P-0600-2 40-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-40P-M02 40-pin plastic DIP (DIP-40P-M02) +0.20 52.40 –0.30 +.008 2.063 –.012 INDEX-1
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DIP-40P-M02
DIP040-P-0600-2
100mil
600mil
40-pin
DIP-40P-M02)
D40011S-2C-2
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PDF
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DIP-20P-M02
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 20 PIN PLASTIC DIP-20P-M02 EIAJ code : ∗DIP020-P-0300-2 20-pin plastic DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-20P-M02 20-pin plastic DIP (DIP-20P-M02) +0.20 24.64 –0.30 .970 +.008 –.012 INDEX-1
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DIP-20P-M02
DIP020-P-0300-2
100mil
300mil
20-pin
DIP-20P-M02)
D20003S-3C-4
DIP-20P-M02
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PDF
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34036
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 42 PIN CERAMIC DIP-42C-A03 EIAJ code : WDIP042-C-0600-1 42-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-42C-A03 42-pin ceramic DIP (DIP-42C-A03) 53.34±0.51 (2.100±0.20) 8.50(.335)DIA. TYP R1.27(.050)
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DIP-42C-A03
WDIP042-C-0600-1
100mil
600mil
42-pin
DIP-42C-A03)
D42012SC-2-3
34036
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 20 PIN PLASTIC DIP-20P-M03 EIAJ code : ∗DIP020-P-0300-3 20-pin plastic DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-20P-M03 20-pin plastic DIP (DIP-20P-M03) +0.20 24.59 –0.30 .968 +.008 –.012 INDEX-1
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DIP-20P-M03
DIP020-P-0300-3
100mil
300mil
20-pin
DIP-20P-M03)
D20011S-1C-3
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PDF
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16-Pin Plastic DIP
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 16 PIN PLASTIC DIP-16P-M04 EIAJ code : ∗DIP016-P-0300-2 Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold 16-pin plastic DIP DIP-16P-M04 16-pin plastic DIP (DIP-16P-M04) +0.20 19.55 –0.30 +.008 .770 –.012 INDEX-1
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DIP-16P-M04
DIP016-P-0300-2
100mil
300mil
16-pin
DIP-16P-M04)
D16033S-2C-3
16-Pin Plastic DIP
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 16 PIN PLASTIC DIP-16P-M03 EIAJ code : ∗DIP016-P-0300-1 Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold 16-pin plastic DIP DIP-16P-M03 16-pin plastic DIP (DIP-16P-M03) +0.20 19.45 –0.30 +.008 .766 –.012 INDEX-1
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DIP-16P-M03
DIP016-P-0300-1
100mil
300mil
16-pin
DIP-16P-M03)
D16030S-3C-3
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PDF
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24-Pin Ceramic DIP
Abstract: DIP-24C-C04
Text: SKINNY DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-C04 EIAJ code : ∗DIP024-G-0300-1 24-pin ceramic SK-DIP Lead pitch 100mil Row spacing 400mil Sealing method Cerdip DIP-24C-C04 24-pin ceramic SK-DIP (DIP-24C-C04) 0.69 .027 30.30 +– 0.33 (1.193 +– .013
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DIP-24C-C04
DIP024-G-0300-1
100mil
400mil
24-pin
DIP-24C-C04)
D24016SC-3-3
30024C-C04
24-Pin Ceramic DIP
DIP-24C-C04
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PDF
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