Untitled
Abstract: No abstract text available
Text: SILICON PIN DIODES Microwave applications ULTRAFAST SWITCHING SILICON PIN DIODES Description For ultrafast switching, these passivated mesa diodes have a thin I layer < 10 µm . Electrical characteristics CHIP AND PACKAGED DIODES CHIP DIODES Characteristics Gold Breakdown Junction
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EH50072
EH50073
EH50074
EH50075
EH50076
EH50077
EH50101
EH50102
EH50103
EH50104
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Untitled
Abstract: No abstract text available
Text: SILICON PIN DIODES Plastic package Surface Mount switching silicon PIN diodes PLASTIC PACKAGE SURFACE MOUNT SWITCHING SILICON PIN DIODES Description TEMEX uses its proprietary technology to manufacture its Silicon PIN diodes in plastic package. This product family is designed for a low cost, medium to high volume market that may be supplied
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DH50XXX
DH50051-51
DH50058-51
DH50053-51
DH50103-51
DH50109-51
DH50203-51
DH50209-51
DH80051-51
DH50051-53
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TEKELEC 302
Abstract: Tekelec Temex
Text: SILICON PIN DIODES SOT23 surface mount switching silicon PIN diodes SOT23 SURFACE MOUNT SWITCHING SILICON PIN DIODES Features Description • Low series resistance • Low capacitance • Fast switching diodes • Surface mount package • Tape and reel packaging available
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DH50XXX
TEKELEC 302
Tekelec Temex
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EH76150 die
Abstract: DH252 DH256 all diodes ratings step recovery diode dh252 temex dh292 DH315 DH303 DH324 DH312
Text: SILICON MICROWAVE DIODES Step Recovery Diodes MICROWAVE SILICON MICROWAVE DIODES STEP RECOVERY DIODES All the detail specification shall be read in conjunction with ESA/SCC Generic Specification N° 5010, the special requirements are included in the detail specification.
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ESA/SCC5512/016
DH252
DH256
DH292
DH267
ESA/SCC5512/016
EH76150 die
DH252
DH256
all diodes ratings
step recovery diode dh252 temex
dh292
DH315
DH303
DH324
DH312
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DH80102
Abstract: DH80106 DH80050 DH80052
Text: SILICON PIN DIODES Square ceramic surface mountable PIN diodes MICROWAVE SQUARE CERAMIC SURFACE MOUNTABLE PIN DIODES Description These PIN diodes are manufactured in a square package SMD for surface mount applications. These packages utilize ceramic package technology with low inductance and axial terminations. This design
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DH50107
DH50205
DH50206
DH50209
DH80050
DH80051
DH80052
DH80053
DH80082
DH80100
DH80102
DH80106
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Untitled
Abstract: No abstract text available
Text: SILICON PIN DIODES Plastic package Surface Mount switching silicon PIN diodes PLASTIC PACKAGE SURFACE MOUNT SWITCHING SILICON PIN DIODES Description TEMEX uses its proprietary technology to manufacture its Silicon PIN diodes in plastic package. This product family is designed for a low cost, medium to high volume market that may be supplied
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Original
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DH50XXX
DH50051-51
DH50058-51
DH50053-51
DH50103-51
DH50109-51
DH50203-51
DH50209-51
DH80051-51
DH50051-53
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dh50076
Abstract: EH50052 M208
Text: SILICON PIN DIODES Microwave applications ULTRAFAST SWITCHING SILICON PIN DIODES Description For ultrafast switching, these passivated mesa diodes have a thin I layer < 10 µm . Electrical characteristics CHIP AND PACKAGED DIODES CHIP DIODES Characteristics Gold Breakdown Junction
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EH50033
EH50034
EH50035
EH50036
EH50037
EH50052
EH50053
EH50054
EH50055
EH50056
dh50076
M208
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dh50076
Abstract: DH50037 M208
Text: SILICON PIN DIODES Microwave applications Ultrafast switching silicon PIN diodes Description For ultrafast switching, these passivated mesa diodes have a thin I layer < 10 µm . Electrical characteristics CHIP AND PACKAGED DIODES CHIP DIODES Characteristics Gold Breakdown Junction
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EH50033
EH50034
EH50035
EH50036
EH50037
EH50052
EH50053
EH50054
EH50055
EH50056
dh50076
DH50037
M208
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sqm1150
Abstract: smd diode f54 sqm1250 DH60034 srd dh294 bh16 transistor step recovery diode dh252 temex DH252 M208 B1 DH294
Text: MICROWAVE SILICON COMPONENTS Contents MICROWAVE SILICON COMPONENTS CONTENTS CONTENTS w e N f o t i y Spir nolog Tech PAGE INTRODUCTION / SYMBOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-2 All specifications contained in that catalog are subject to change without notice.
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Untitled
Abstract: No abstract text available
Text: SILICON PIN DIODES Plastic package Surface Mount switching silicon PIN diodes PLASTIC PACKAGE SURFACE MOUNT SWITCHING SILICON PIN DIODES Description TEMEX uses its proprietary technology to manufacture its Silicon PIN diodes in plastic package. This product family is designed for a low cost, medium to high volume market that may be supplied
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Original
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DH50XXX
switchingDH50109-53
DH50203-53
DH50209-53
DH80051-53
DH50051-54
DH50058-54
DH50053-54
DH50103-54
DH50109-54
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Untitled
Abstract: No abstract text available
Text: SILICON PIN DIODES Plastic package Surface Mount switching silicon PIN diodes MICROWAVE PLASTIC PACKAGE SURFACE MOUNT SWITCHING SILICON PIN DIODES Description TEMEX COMPONENTS uses its proprietary technology to manufacture its Silicon PIN diodes in plastic
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DH50XXX
DH50103
DH50109
DH50203
DH50051-60
DH50058-60
DH50053-60
DH50103-60
DH50109-60
DH50203-60
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Untitled
Abstract: No abstract text available
Text: Surface M o u n t sw itch ing and attenuator Silicon PIN diodes Switch application Characteristics @ Ta=+25° C O F= 120MHz Q max II conditions Type DH50037 DH50051 DH50058 DH50053 DH50103 DH50109 DH50203 DH50209 DH80051 V min. 30 35 35 50 100 100 200 200
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OCR Scan
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DH50037
DH50051
DH50058
DH50053
DH50103
DH50109
DH50203
DH50209
DH80051
120MHz
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